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Broadcom is seeking an experienced SI/PI Technical Project Manager to lead a team of engineers designing complex flip-chip-BGA packages, PCBs, system channel links for industry-leading ASICs with high-speed SerDes and very-high-power-delivery needs. You will be part of a worldwide R&D team developing high-performance package designs for ASICs for artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations.These designs include SerDes at 448G and higher, Optics, 5G RF/Microwave ADC/DAC, HBM, DDR5 and more. In this role, you will support and develop the engineering team, as well as contribute to technical methodologies and technical project management.

RESPONSIBILITIES:

• Technical Project Management : Navigate and track project plans for 20+ concurrent pkg/PCB designs (scope, schedules, resources) from a technical execution standpoint

• Understand the skill sets and traits of each team member, in order to maximize productivity and retention

• Organize team & customer activities to keep projects on track

• Clearly and concisely communicate plans, status, next steps and risks on a regular basis

• Create technical methodologies for signal and power integrity solutions

• Understanding and supporting package and PCB technologies with input from team members

• Customer, vendor, & cross-functional collaboration

EDUCATION/EXPERIENCE & REQUIREMENTS:

• Preferred candidates have previous experience managing people and projects

• BSEE and 12+ years of experience in ASIC and system signal and power integrity for high-speed SerDes AND a minimum of 3 years in leadership/management.

• Knowledge of package-level, PCB-level, and/or system level signal integrity and power integrity, to apply to package and PCB designs.

• Cooperate with our world-wide team (multiple time zones), including co-design with internal team members and external (Vendor) designers

• Self-management, organization, and clear communication skills

• Technical understanding related to System Signal and Power Integrity development and support :

  • SI/PI EDA extractions and simulations

  • System level SerDes channel results

  • Lab measurements - passive and active

  • Lab and measurement correlation efforts

  • Lab equipment needs and management

  • Package and PCB lifecycle and design flows

  • How the substrate and package fit into the overall system implementation and trade-offs therein to support customers effectively

  • Design Data, including how it is created and utilized (e.g. package:: .mcm, package spreadsheet, drawings (POD, Lid, Substrate))

  • Automation code development

  • Project Management

OTHER REQUIREMENTS:

• This job requires working on-site at the Broadcom office, 5 days a week. This is not a remote-work position. This role is deeply collaborative and requires direct, real-time engagement with lab equipment and face-to-face team co-design.

Compensation and Benefits

As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.

Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.

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