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Serdes Mixed Signal Design Engineer Jobs (NOW HIRING)

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Serdes Mixed Signal Design Engineer information

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$80.5K

$141.4K

$290.5K

How much do serdes mixed signal design engineer jobs pay per year?

As of Sep 10, 2026, the average yearly pay for serdes mixed signal design engineer in the United States is $141,351.00, according to ZipRecruiter salary data. Most workers in this role earn between $95,000.00 and $158,000.00 per year, depending on experience, location, and employer.

What is a Serdes mixed signal design engineer?

Serdes Mixed Signal Design Engineers are professionals who design and develop Serializer/Deserializer (SerDes) circuits, which are critical for high-speed data transmission in electronic devices. They work with both analog and digital (mixed-signal) components to optimize signal integrity, reduce noise, and ensure efficient communication between chips or systems. Their work involves circuit design, simulation, validation, and often collaboration with layout and verification teams. These engineers play a key role in industries like telecommunications, data centers, and consumer electronics, where reliable high-speed interfaces are essential.

What are the key skills and qualifications needed to thrive as a Serdes mixed signal design engineer?

To thrive as a Serdes Mixed Signal Design Engineer, you need a strong background in analog and digital circuit design, signal integrity, and a degree in electrical or electronics engineering. Familiarity with EDA tools like Cadence, SPICE simulators, and experience with lab equipment such as oscilloscopes and network analyzers are typically required. Excellent problem-solving skills, attention to detail, and effective teamwork are crucial soft skills for this role. These skills ensure the reliable design and implementation of high-speed data interfaces that are critical for modern electronic systems.

What are some common challenges faced by Serdes mixed signal design engineers during the design and validation process?

Serdes Mixed Signal Design Engineers often encounter challenges such as managing signal integrity, minimizing jitter and crosstalk, and ensuring high data rates over varying process, voltage, and temperature conditions. Coordinating between analog and digital design elements requires close collaboration with layout, verification, and system integration teams. Debugging silicon issues and validating performance against specifications can be especially complex, requiring strong problem-solving skills and hands-on lab experience.

What is the difference between Serdes Mixed Signal Design Engineer vs Digital IC Design Engineer?

AspectSerdes Mixed Signal Design EngineerDigital IC Design Engineer
Required CredentialsBachelor's or Master's in Electrical Engineering, specialized in mixed signal or high-speed designBachelor's or Master's in Electrical or Computer Engineering, focused on digital logic design
Work EnvironmentDesigning high-speed serial interfaces, working with analog and digital circuits, often in R&D or product developmentDeveloping digital integrated circuits, working on logic design, verification, and synthesis
Industry UsageTelecommunications, data centers, high-speed networkingConsumer electronics, computing, embedded systems

Serdes Mixed Signal Design Engineers focus on high-speed serial interfaces combining analog and digital circuits, while Digital IC Design Engineers concentrate on digital logic circuits. Both roles require strong electrical engineering backgrounds but differ in their specialization and application areas.

What are popular job titles related to Serdes Mixed Signal Design Engineer jobs?

For Serdes Mixed Signal Design Engineer jobs, the most frequently searched job titles are:

Infographic showing various Serdes Mixed Signal Design Engineer job openings in the United States as of September 2026, with employment types broken down into 1% Internship, 87% Full Time, 9% Part Time, and 3% Contract. Highlights an 81% Physical, 4% Hybrid, and 15% Remote job distribution, with an average salary of $141,351 per year, or $68 per hour.

High-Speed Mixed-Signal Design Engineer

Gardena, CA

$140K - $190K/yr

Full-time

Medical, Dental, Vision, Retirement, PTO

Re-posted 21 days ago


Job description

HIGH-SPEED MIXED SIGNAL DESIGN ENGINEER

Mesh Optical Technologies was founded on the belief that optical photons will be at the center of advanced technologies in the coming century. Making advanced technology ubiquitous means building at scale, and that's exactly what we're doing at Mesh.

Our optical hardware platform requires tightly integrated high-speed electronic and photonic systems operating at tens of gigahertz and beyond-modulator drivers, trans-impedance amplifiers, SerDes interfaces, and the analog signal chains that connect them. We are seeking a High-Speed Mixed-Signal Design Engineer to architect, design, and validate the high-speed electronic systems that interface directly with our photonic integrated circuits. You will work across the boundary between electronics and photonics, from transistor-level circuit design through package and board-level integration, ensuring the electrical systems meet the bandwidth, linearity, and noise performance our optical links demand.

RESPONSIBILITIES:

  • Design and analyze high-speed analog and mixed-signal circuits for electro-optic systems, including modulator drivers, TIAs, CTLEs, limiting amplifiers, and clock/data recovery circuits
  • Develop and own circuit-level and system-level models for high-speed signal chains, incorporating device parasitics, package effects, and photonic component behavior
  • Perform transistor-level simulation and verification using industry tools (e.g., Cadence Virtuoso, Spectre, ADS, HFSS) across process corners, temperature, and supply variation
  • Architect high-speed electrical interfaces between electronic ICs and photonic integrated circuits, defining impedance matching, bandwidth targets, voltage swing, and power constraints
  • Lead or contribute to chip-to-package-to-board co-design, including high-speed interconnect design, SI/PI analysis, and signal integrity closure from die through PCB
  • Collaborate with PIC designers to co-optimize electro-optic performance across the driver-modulator and photodetector-TIA interfaces
  • Define characterization and validation strategies for high-speed electronic and electro-optic subsystems, including S-parameter measurements, eye diagram analysis, and BER testing
  • Analyze measurement data and correlate to simulation models, driving root-cause investigation and design iteration
  • Partner with manufacturing and test engineering teams to develop production test methods for high-speed electrical and electro-optic assemblies
  • Contribute to component selection, evaluation, and qualification for high-speed electronic devices (e.g., driver ICs, TIAs, CDRs, PLLs)

QUALIFICATIONS:

  • Master's or PhD in electrical engineering, applied physics, or a related discipline
  • 3+ years of experience in high-speed analog, mixed-signal, or RF circuit design, with emphasis on circuits operating at multi-GHz bandwidths
  • Strong foundation in analog and RF circuit design principles, including small-signal and large-signal analysis, noise analysis, and stability
  • Experience with circuit simulation tools (e.g., Cadence Spectre, ADS, HFSS, or equivalent)
  • Understanding of high-speed serial link architectures and signaling formats (e.g., NRZ, PAM4, coherent modulation)
  • Experience with high-speed lab characterization, including use of high-bandwidth oscilloscopes, VNAs, BERTs, and spectrum analyzers
  • Working knowledge of semiconductor device physics and IC fabrication processes (CMOS, SiGe BiCMOS, or III-V)
  • Strong programming and data analysis skills (e.g., Python, MATLAB) for simulation automation, data processing, and visualization
  • Willingness to work extended hours and weekends as needed

PREFERRED EXPERIENCE:

  • Experience designing high-speed circuits for optical communications, including modulator drivers, TIAs, or SerDes front-ends
  • ASIC or custom IC design experience, including full design flow from specification through tapeout and silicon validation
  • Experience with high-speed package and interconnect design, including wirebond, flip-chip, or co-packaged optics integration
  • Deep expertise in one or more of: wideband amplifier design (>25 GHz), high-speed DAC/ADC interfaces, PLL/CDR design, or RF power amplifier design
  • Familiarity with DSP concepts relevant to optical links (e.g., FFE, DFE, CTLE equalization) and optical performance metrics (e.g., OSNR, OMA, receiver sensitivity)
  • Experience with electromagnetic simulation for high-speed interconnects and packaging (e.g., HFSS, Momentum, CST)
  • Experience with photonic-electronic co-design or co-simulation (e.g., Lumerical Interconnect, VPI, ADS co-simulation)
  • Experience working with silicon photonics or III-V electro-optic platforms
  • Familiarity with reliability and qualification testing for high-speed electronic or electro-optic assemblies

COMPENSATION AND BENEFITS:

Pay range: 
High-Speed Mixed Signals Design Engineer: $140,000.00 - $190,000.00/per year

Title and base salary are determined on a case by case basis commensurate with experience and merit.

In addition to base salary, compensation for this role includes:

  • Eligibility for long-term incentives including company stock options and discretionary bonuses awarded for exceptional achievements.
  • Comprehensive medical, vision, and dental insurance with significant cost covered by the company for yourself and dependents.
  • Paid parental leave and flexible PTO (3 weeks accrued vacation and 10 company holidays per year).
  • 401(k) retirement plan access.
  • Relocation assistance to sunny Los Angeles.