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Senior Packaging Engineer Jobs in Boston, MA (NOW HIRING)

Whoop

Senior Mechanical Engineer, Packaging

Boston, MA · On-site

$113K - $149K/yr

WHOOP is looking for a Senior Mechanical Engineer, Packaging to lead the design, development, validation, and manufacturing release of next-generation packaging systems for WHOOP products and ...

Cisco

Hardware Engineering Technical Leader

Maynard, MA · On-site

$130K - $172K/yr

Your Impact As a Senior Photonics Packaging Engineer on the Acacia Packaging Engineering team, you will join a multidisciplinary group of optical, mechanical, electrical, and manufacturing engineers ...

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Senior Packaging Engineer information

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$84.2K

$124.5K

$172.7K

How much do senior packaging engineer jobs pay per year?

As of Aug 15, 2026, the average yearly pay for senior packaging engineer in Boston, MA is $124,473.00, according to ZipRecruiter salary data. Most workers in this role earn between $107,000.00 and $129,300.00 per year, depending on experience, location, and employer.

What does a senior packaging engineer do?

As a Senior Packaging Engineer, your daily responsibilities often include designing and testing packaging solutions, evaluating material performance, and optimizing current packaging designs for cost and sustainability. You’ll collaborate closely with cross-functional teams such as product development, manufacturing, marketing, and suppliers to ensure packaging meets both technical and branding requirements. Expect to lead or contribute to project teams, conduct root cause analyses for packaging failures, and stay up-to-date with regulatory and environmental guidelines. This role typically offers a mix of desk-based design work, on-site testing, and meetings, providing varied opportunities for both technical development and leadership.

What is a senior packaging engineer?

A Senior Packaging Engineer is responsible for designing, developing, and optimizing packaging solutions for products to ensure functionality, cost-effectiveness, and sustainability. They collaborate with cross-functional teams, including product development, manufacturing, and marketing, to create packaging that meets regulatory requirements and enhances user experience. Additionally, they analyze materials, conduct testing, and implement improvements to enhance packaging performance and reduce environmental impact.

What are the key skills and qualifications needed to thrive as a senior packaging engineer?

A Senior Packaging Engineer typically requires a degree in engineering (mechanical, packaging, or related field), extensive experience in packaging design, and strong knowledge of materials and manufacturing processes. Proficiency in CAD software, packaging simulation tools, and familiarity with industry standards like ISTA or ASTM certifications is common. Excellent project management, problem-solving abilities, and strong communication skills set top candidates apart. These skills are critical for developing innovative, cost-effective packaging solutions that meet quality, safety, and regulatory requirements while collaborating across teams.

What are the most commonly searched types of Packaging Engineer jobs in Boston, MA?

The most popular types of Packaging Engineer jobs in Boston, MA are:

What are popular job titles related to Senior Packaging Engineer jobs in Boston, MA?

For Senior Packaging Engineer jobs in Boston, MA, the most frequently searched job titles are:

What job categories do people searching Senior Packaging Engineer jobs in Boston, MA look for?

The top searched job categories for Senior Packaging Engineer jobs in Boston, MA are:

What cities near Boston, MA are hiring for Senior Packaging Engineer jobs?

Cities near Boston, MA with the most Senior Packaging Engineer job openings:

Senior Packaging Engineer jobs near you
Infographic showing various Senior Packaging Engineer job openings in Boston, MA as of August 2026, with employment types broken down into 100% Full Time. Highlights an 100% In-person job distribution, with an average salary of $124,473 per year, or $59.8 per hour.

Semiconductor Packaging Engineer

Analog Devices

Wilmington, MA • On-site

Full-time

Medical, Dental, Vision, Retirement, PTO

Posted 11 days ago

Analog Devices rating

8.5

Company rating: 8.5 out of 10

Based on 17 frontline employees who took The Breakroom Quiz

33rd of 157 rated electronics manufacturers

Job description

About Analog Devices
Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and X.
Senior Systems Semiconductor Packaging Engineer
About the Role
As a Senior Systems Semiconductor Packaging Engineer, you will lead the development of advanced semiconductor packaging solutions for MEMS sensors used in automotive, industrial, medical, aerospace, and defense applications. You will work across the product lifecycle, from concept through manufacturing readiness, helping translate product and customer requirements into robust, scalable packaging solutions.
This role calls for strong technical judgment, cross-functional collaboration, and hands-on problem solving. You will partner closely with teams across applications, quality, reliability, manufacturing, and external vendors to improve package performance, manufacturability, and time to market.
Key Responsibilities
  • Packaging Development: - Lead project-level semiconductor packaging design activities from product conception through manufacturing readiness
  • Manufacturability and Reliability: - Drive design for manufacturability and design for reliability through process characterization, risk assessment, and structured problem solving
  • Root Cause and Yield Improvement: - Partner with quality and reliability teams to perform root cause analysis, improve yield, and implement corrective and preventive actions
  • Engineering Analysis: - Perform detailed package analysis using 3D CAD tools such as SolidWorks and simulation tools such as ANSYS to evaluate mechanical and process performance
  • Process and Quality Methods: - Apply engineering methodologies including control plans, PFMEA, DOE, SPC, 8D, and RCA to improve product and process outcomes
  • Customer Requirements Translation: - Partner with Applications Engineering to translate customer specifications into clear technical direction for internal development teams
  • OSAT Collaboration: - Work with OSAT partners to support rapid prototyping, early builds, and preliminary qualification activities
  • Vendor and Assembly Readiness: - Help reduce time to market by aligning package designs with vendor assembly capabilities and manufacturing constraints
  • Cross-Functional Leadership: - Collaborate with multidisciplinary teams to support execution, issue resolution, and product success across development phases

Required Skills
  • Semiconductor Packaging Expertise: - Strong experience in semiconductor packaging and manufacturing processes, with the ability to support package development from concept through release
  • Materials Knowledge: - Strong understanding of substrates, adhesives, underfills, mold compounds, and interconnect materials used in semiconductor packaging
  • Design for Reliability: - Experience applying reliability and manufacturability principles to package design, qualification readiness, and process optimization
  • Simulation and Analysis Tools: - Hands-on experience with 3D CAD and engineering analysis tools such as SolidWorks and ANSYS
  • Structured Problem Solving: - Demonstrated ability to apply DOE, PFMEA, SPC, 8D, RCA, and related methods to solve technical and manufacturing challenges
  • Cross-Functional Collaboration: - Ability to work effectively across applications, manufacturing, quality, reliability, and external partner teams
  • Technical Communication: - Strong communication skills with the ability to translate technical issues and requirements clearly across stakeholders

Preferred Education and Experience
  • Bachelor's or Master's degree in Mechanical Engineering, Materials Science, Electrical Engineering, or a related technical field
  • 5+ years of relevant experience in semiconductor packaging, process development, or manufacturing engineering
  • Experience supporting MEMS, sensor, or advanced package development is a plus
  • Experience working with OSAT partners and external manufacturing vendors is preferred

We recognize that candidates may not meet every listed requirement. If you bring relevant experience and a willingness to learn, we encourage you to apply.
#LI-PG1
For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls. As such, applicants for this position - except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) - may have to go through an export licensing review process.
Analog Devices is an equal opportunity employer. We foster a culture where everyone has an opportunity to succeed regardless of their race, color, religion, age, ancestry, national origin, social or ethnic origin, sex, sexual orientation, gender, gender identity, gender expression, marital status, pregnancy, parental status, disability, medical condition, genetic information, military or veteran status, union membership, and political affiliation, or any other legally protected group.
EEO is the Law: Notice of Applicant Rights Under the Law.
Job Req Type: Experienced
Required Travel: Yes, 10% of the time
Shift Type: 1st Shift/Days
The expected wage range for a new hire into this position is $110,385 to $151,808.
  • Actual wage offered may vary depending on work location, experience, education, training, external market data, internal pay equity, or other bona fide factors.
  • This position qualifies for a discretionary performance-based bonus which is based on personal and company factors.
  • This position includes medical, vision and dental coverage, 401k, paid vacation, holidays, and sick time, and other benefits.

What Analog Devices employees say

Pay

Benefits

Hours and flexibility

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About Analog Devices

Sourced by ZipRecruiter

Analog Devices (NASDAQ: ADI) designs and manufactures semiconductor products and solutions. We enable our customers to interpret the world around us by intelligently bridging the physical and digital worlds with unmatched technologies that sense, measure and connect.

Industry

Electrical equipment, appliance, and component manufacturing

Company size

5,001 - 10,000 Employees

Headquarters location

Norwood, MA, US

Year founded

1965

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