Semiconductor Process Engineer Jobs in Phoenix, AZ

Engineer, Field Process (Phoenix, AZ)

As a member of the Global Sales and Services business unit, our HVM (High Volume Manufacturing) Field Process Engineering team serves as the on-site process application and execution bridge between the customer, ASM Field Service, ASM account leadership, and ASM global product and business-unit teams.  This role supports ASM tools at our customer fab in North Phoenix with a focus on process performance, qualification execution, tool-to-tool matching, containment, escalation discipline, customer communication, and sustainable improvement.

This is not a generic process engineering role. The Field Process Engineer must be able to work close to the tool, understand customer urgency, organize incomplete data, communicate facts versus hypotheses, partner tightly with Field Service Engineers, and keep customer-facing problems moving without overclaiming root cause or creating uncontrolled risk.

What you'll be working on

• Support ASM tools through installation, start-up, qualification, warranty, HVM ramp, and production-support phases
• Track customer process specifications, tool performance, matching behavior, process stability, watch items, and open issue status through structured data review and follow-up
• Help drive containment, short-term recovery actions, and long-term corrective actions when customer process or tool-performance requirements are not being met
• Design, support, and analyze experiments for qualification, troubleshooting, continuous improvement, tool-to-tool matching, process-window understanding, and customer-requested improvements
• Collect, analyze, and summarize process, metrology, tool-state, trend, and chamber-performance data to support fact-based decision-making
• Apply structured troubleshooting, DOE methodologies, statistical analysis, baseline comparisons, and measurement-system validation before recommending actions
• Partner with customer process teams, customer hardware teams, ASM Field Service, account leadership, and global product/business-unit experts
• Communicate confirmed facts, hypotheses, action plans, ownership, timelines, and open risks clearly during urgent or ambiguous customer situations
• Build clear issue timelines, data packages, passdowns, escalation payloads, and loop-closure records
• Share lessons learned, BKMs, issue summaries, action plans, and watch items across the local team, key account organization, and global support teams
• Maintain discipline around intellectual-property boundaries, customer communication, controlled changes, and escalation leadership

What we are looking for

• Master's degree or PhD preferred in Chemical Engineering, Materials Science, Electrical Engineering, Physics, Chemistry, Mechanical Engineering, or a related technical field; Bachelor's degree candidates will be considered with significant semiconductor process, equipment, customer support, research, or HVM experience
• Strong fundamentals in one or more of the following: semiconductor processing, thin films, deposition, vacuum systems, gases/pressure/flow, reaction kinetics, surface chemistry, plasma/thermal processes, metrology, or data analysis
• Experience with, or a demonstrated ability to quickly learn, ALD., PEALD, epitaxy, CVD, diffusion/furnace, vacuum processing, plasma processing, or thin-film deposition
• Experience designing, running, or interpreting experiments using DOE, SPC, JMP, Python, MATLAB, Excel, or equivalent tools.
• Ability to interpret metrology or process-output data such as film thickness, uniformity, sheet resistance, particles/defects, composition, electrical data, pressure/flow trends, or tool logs
• Ability to work on-site in a customer HVM semiconductor environment and communicate professionally with customers and internal stakeholders
• Ability to organize technical data, distinguish knowns from unknowns, and communicate next steps clearly under pressure
• Willingness and ability to travel as needed for training, technical engagement, or customer support; travel is typically minimal but may vary by business need
• Flexibility to support extended hours, weekends, or additional time in the fab during qualifications, escalations, or urgent customer needs
• Ability to maintain confidentiality and uphold ASM/customer IP boundaries during internal and external communication

What sets you apart

• Direct experience with ASM or other semiconductor capital equipment in HVM, customer support, process development, applications, or field support environment
• Hands-on experience with ALD, PEALD, epitaxy, CVD, diffusion/furnace, plasma processing, vacuum processing, or thin-film characterization
• Demonstrated success supporting customer escalations, qualification activities, tool-to-tool matching, process deviations, process transfer, scale-up, or continuous-improvement projects
• Strong working discipline, including clear documentation, effective passdowns, specific escalation requests, ownership through loop closure, and the ability to separate facts from hypotheses
• Ability to partner effectively with FSEs, customer engineers, account teams, and global experts without losing ownership or creating confusion
• Comfort working close to the tool and with incomplete information while avoiding unsupported root-cause claims or uncontrolled changes
• For senior or principal candidates: experience leading complex escalations, defining release/qualification evidence, coaching engineers, influencing customer alignment, and connecting field learning back to global product or account strategy

Level calibration

This requisition may be calibrated from Engineer I through Principal Field Process Engineer based on experience. Entry-level candidates are expected to show strong fundamentals, learning discipline, data quality, documentation, and structured escalation behavior. Experienced candidates are expected to demonstrate increasing ownership of customer-facing issues, complex troubleshooting, qualification activities, mentoring, and cross-functional technical leadership.