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Semiconductor Process Engineer Jobs in Phoenix, AZ

The ideal candidate combines strong engineering fundamentals with hands-on laboratory execution skills and thrives in a fast-paced semiconductor development environment. Key Responsibilities Process ...

... semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and ... Working closely with Process Engineers and technology development teams, this position enables ...

Process Engineer

Phoenix, AZ · On-site

$95K - $119K/yr

Process Engineer - Semiconductor Precision Cleaning Drive innovation. Improve manufacturing. Make an impact. Are you passionate about solving complex manufacturing challenges and improving high-tech ...

As a Principal Process Engineer at ASM, you will work with semiconductor processing and analytical equipment to research, develop and optimize processes focused on oxidation, annealing, curing ...

As a Principal Process Engineer at ASM, you will work with semiconductor processing and analytical equipment to research, develop and optimize processes focused on oxidation, annealing, curing ...

This is a critical time for the semiconductor industry and for UCT - as technology evolves, we ... A Process Engineer may work in small, medium and large businesses. The work is concerned with ...

At SSOE you will continuously expand your expertise by confronting diverse and complex process engineering challenges unique to the semiconductor and advanced high-tech industrial sectors. From ...

We are seeking a Process Engineer to join our integrated design-build team, supporting the delivery ... Exposure to projects in semiconductor, advanced high-tech manufacturing, cleanroom, or mission ...

Process Engineer II

Phoenix, AZ · On-site

$80 - $110/hr

This is a critical time for the semiconductor industry and for UCT - as technology evolves, we ... A Process Engineer may work in small, medium and large businesses. The work is concerned with ...

New

Process Engineer

Phoenix, AZ · On-site

$108 - $148.50/hr

Process Engineer page is loaded## Process Engineerlocations: Phoenix,AZtime type: Full timeposted ... You will experiment, learn, and collaborate with some of the brightest minds in the semiconductor ...

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Showing results 1-20

Semiconductor Process Engineer information

See Phoenix, AZ salary details

$49.1K

$91.4K

$141.5K

How much do semiconductor process engineer jobs pay per year?

As of Sep 3, 2026, the average yearly pay for semiconductor process engineer in Phoenix, AZ is $91,365.00, according to ZipRecruiter salary data. Most workers in this role earn between $74,000.00 and $102,300.00 per year, depending on experience, location, and employer.

What is a semiconductor process engineer?

A Semiconductor Process Engineer develops, optimizes, and monitors manufacturing processes for semiconductor devices. They work in cleanroom environments, focusing on lithography, etching, doping, and deposition to improve yield and efficiency. Their role involves troubleshooting process issues, collaborating with design and production teams, and ensuring quality standards are met. Strong analytical and problem-solving skills are essential, along with knowledge of semiconductor fabrication techniques and process control methods.

What are the key skills and qualifications needed to thrive as a semiconductor process engineer?

A Semiconductor Process Engineer typically requires a degree in materials science, electrical engineering, or a related field, with strong analytical and problem-solving skills to optimize manufacturing processes. Familiarity with cleanroom protocols, semiconductor fabrication tools like photolithography equipment, and statistical process control (SPC) software is highly beneficial. Effective teamwork, attention to detail, and strong communication abilities help engineers collaborate across multidisciplinary teams and clearly address production issues. These competencies are essential to ensure consistent product quality, operational efficiency, and rapid innovation in a dynamic manufacturing environment.

What are some common challenges faced by semiconductor process engineers in their daily work?

Semiconductor Process Engineers frequently encounter challenges such as troubleshooting yield losses, identifying defects, and addressing variations in process performance. The role requires careful analysis to pinpoint root causes of issues and the ability to swiftly implement solutions without disrupting the overall production schedule. Engineers must also adapt quickly to evolving technologies and stay current with best practices to keep manufacturing lines efficient. Balancing strict quality standards with the fast pace of semiconductor production can be demanding, but it also provides valuable learning opportunities and the satisfaction of directly impacting cutting-edge technology.

What job categories do people searching Semiconductor Process Engineer jobs in Phoenix, AZ look for?

The top searched job categories for Semiconductor Process Engineer jobs in Phoenix, AZ are:

What cities near Phoenix, AZ are hiring for Semiconductor Process Engineer jobs?

Cities near Phoenix, AZ with the most Semiconductor Process Engineer job openings:

Infographic showing various Semiconductor Process Engineer job openings in Phoenix, AZ as of August 2026, with employment types broken down into 91% Full Time, 4% Temporary, and 5% Contract. Highlights an 84% In-person, 5% Hybrid, and 11% Remote job distribution, with an average salary of $91,365 per year, or $43.9 per hour.

Semiconductor Process Applications Engineer

Finetech

Chandler, AZ • On-site

Other

Posted 4 days ago


Job description

Job description

Position Overview

We are seeking an experienced and highly motivated Semiconductor Process Applications Engineer to join our team. We are a leading capital equipment company specializing in sub-micron die bonding solutions for the semiconductor industry. This role is ideal for professionals with several years of hands-on experience in semiconductor manufacturing and advanced packaging processes. The successful candidate will play a key role in supporting our sales team, interfacing with our customers, and driving technical success for our cutting-edge, die-bonding equipment.

Key Responsibilities

  • Serve as a technical resource for customers and internal sales teams regarding sub-micron die bonding equipment and applications in leading-edge technologies like quantum computing and brain-machine interface.
  • Conduct product demonstrations, process development trials, and technical presentations to showcase equipment capabilities.
  • Collaborate with customers to understand application requirements and develop customized process solutions.
  • Support the installation, qualification, and troubleshooting of die bonding equipment at customer sites domestically.
  • Provide technical training to customers and internal staff on equipment operation and process optimization.
  • Gather customer feedback and work with international engineering teams to drive product improvements and new feature development.
  • Prepare and maintain technical documentation, including application notes, process guidelines, and training materials.
  • Represent the company at industry events, conferences, and customer meetings as a technical expert.

Qualifications

  • Bachelor’s or Master’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, or related field.
  • Minimum 3-5 years of experience in semiconductor manufacturing, advanced packaging, or process engineering.
  • Proven expertise working with die bonding, wire bonding, or related semiconductor assembly equipment.
  • Strong understanding of sub-micron process control, wafer-level packaging, and yield optimization.
  • Excellent problem-solving skills and the ability to troubleshoot complex hardware and process issues.
  • Outstanding communication and interpersonal skills; ability to present technical information clearly to diverse audiences.
  • Able to work daily from our office and demo lab in Chandler, AZ. Willingness to travel domestically and internationally as required (up to 30%).

Preferred Skills

  • Customer-focused mindset with a proactive approach to solving challenges.
  • Team player able to collaborate across departments and with external partners.
  • Adaptable and eager to learn about new technologies and industry trends.
  • Self-motivated, organized, and able to manage multiple priorities effectively.
  • Familiarity with advanced packaging trends such as flip-chip, wafer-level bonding, and heterogeneous integration.

Why Join Us?

Become part of an innovative, close-knit team at the forefront of semiconductor assembly technology. You will have the opportunity to make a tangible impact on the industry, work with cutting-edge equipment, and advance your career in a collaborative environment that offers a competitive salary and a comprehensive benefits package.