Rf Module Design Engineer Jobs in Dearborn, MI (NOW HIRING)

The Aggregator Product Hardware Design Team is part of GM’s SDV Aggregators organization and designs, develops, validates, and releases the hardware that forms the zonal backbone of SDV 2.0. The team contributes across the full product hardware lifecycle—from requirements, schematics, BOM and component resiliency through PCB layout, signal and power integrity, EMC, functional safety, thermal and mechanical design, manufacturing readiness, board bring‑up, and validation—while collaborating with semiconductor, networking, mechanical, software, test, and supplier partners. Across the broader SDV Aggregators organization, engineers develop aggregator modules that distribute and monitor smart 12V power, manage local I/O, and connect mechatronic devices such as doors, seats, lighting, HVAC, and other vehicle systems to centralized compute through Ethernet, CAN/CAN‑FD, LIN, and discrete interfaces, enabling scalable vehicle variants and software‑defined functionality. This is an in‑house electronics design environment where candidates can contribute directly to production‑intent hardware and the next generation of GM’s vehicle electrical architecture.

The ECU hardware design team’s mission is to ensure our products are designed to target the growing needs of our customers while ensuring robust, well‑designed hardware which meets GM specifications and testing requirements from early hardware through the production design. We are hiring for Hardware Design Engineers to support our SDV Aggregator & Extender modules. In this role you will be responsible for supporting product development and integration activities.

• Supporting a team of electrical hardware designers. This involves providing/executing technical direction, taking on tasks, and contributing to the team's overall productivity and efficiency.
• Work closely with other teams, such as software engineers, mechanical engineers, and manufacturing teams, to ensure seamless integration of electrical hardware designs into the overall product.
• Contribute to embedded designs for advanced module architectures.
• Lead or support new IC design/development strategies to advance in‑vehicle architectures.
• Lead electrical schematic development and support PCB layout.
• Assess the feasibility of proposed electrical hardware designs, considering factors such as cost, performance, reliability, timing, and manufacturability.
• Support next‑generation designs in digital/analog hardware including low‑voltage (12V) power electronics, Gigabit ethernet, processors and memory.
• Perform/Review electrical worst‑case calculations/analysis on circuit‑level as well as system‑level.
• Represent the GM HW team as a design expert in the core technologies developed among the team.
• Optimize 5‑point parametric tests and finalize end‑of‑line production tests.
• Lead the process as a build‑to‑print engineer that also acts as a liaison with the contract house.
• Apply cost‑effective solutions with improved performance design.
• Lead product development as part of a multi hub engineering organization based in Detroit and San Francisco bay area.
• Refine/optimize requirements with Milford Proving Grounds team.
• Support DFMEA activities including creation, defining, reviewing, and approving DFMEA/PFMEA.
• Support/Lead hardware bench‑level testing, waveform acquisition, vehicle checks and other hardware stress tests.
• Support EMC and Environmental validation workstreams, including developing test plans, support troubleshooting/debugging and countermeasure activities.
• Support design and MFG quality investigations, lead 5‑phases and PRTS to resolution, lead root‑cause analysis with FTA/fishbone tools, etc.

• Bachelor's degree in Engineering.
• Professional experience creating digital/analog HW interfaces including schematic creation and/or PCB layout & supportive documentation.
• Minimum 1 year working experience in automotive hardware electronics design.
• Experience in design & analysis tools like Siemens Xpedition tool set (schematic & layout), Mathcad, PSPICE & Saber.
• Knowledge of hardware tools (oscilloscopes, function generators, soldering, etc.)

• Bachelor's degree in Engineering (with hardware design and/or circuit theory focus area).
• Previous industry experience with automotive body control modules, infotainment, telematics or connectivity 3+ years working experience in automotive hardware electronics design.
• Professional experience creating digital/analog HW interfaces including schematic creation and/or PCB layout & supportive documentation.
• Hardware familiarity with high‑speed automotive signals (Ethernet, PCIe, SerDes).
• Hardware understanding of automotive communication buses (CAN, LIN, SENT, etc.)

The compensation information is a good faith estimate only. It is based on what a successful applicant might be paid in accordance with applicable state laws. The compensation may not be representative for positions located outside of New York, Colorado, California, or Washington. The expected base compensation for this role is: $98,300 - $150,200. Actual base compensation within the identified range will vary based on factors relevant to the position.

An incentive pay program offers payouts based on company performance, job level, and individual performance.

GM offers a variety of health and wellbeing benefit programs. Benefit options include medical, dental, vision, Health Savings Account, Flexible Spending Accounts, retirement savings plan, sickness and accident benefits, life insurance, paid vacation & holidays, tuition assistance programs, employee assistance program, GM vehicle discounts and more.

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This role is categorized as hybrid. This means the selected candidate is expected to report to a specific location at least 3 times a week {or other frequency dictated by their manager}. This job may be eligible for relocation benefits.