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Remote Principal Packaging Engineer Jobs (NOW HIRING)

paradigm

Principal AI Architect - Remote

Lombard, IL · Remote

We are seeking a full-time, remote Principal AI Architect. The Principal AI Architect role provides ... This position requires deep expertise in enterprise software engineering, cloud architecture, AI/ML ...

Fanniemae

Desktop Packaging Engineer

Reston, VA · On-site +1

THE IMPACT YOU WILL MAKE The Desktop Packaging Engineer role is responsible for building, testing ... remote. Fannie Mae is an equal opportunity employer and considers qualified applicants for ...

Paradigm

Principal AI Architect - Remote

Lombard, IL · On-site +1

$125K - $170K/yr

We are seeking a full-time, remote Principal AI Architect.The Principal AI Architect role provides ... This position requires deep expertise in enterprise software engineering, cloud architecture, AI/ML ...

DSC Resources

Principal Data Engineering

Louisville, CO · Remote

$180K - $205K/yr

Remote Principal Software Engineer - Data Architecture and Engineering US-based only | No visa sponsorship | No third-party agencies We're seeking a Principal Engineer to establish data architecture ...

AG1

Packaging Engineer (4-Month Contract)

The location is fully remote (US-based) with occasional travel to copackers and suppliers. WHAT YOU ... Bachelor's degree in Packaging Engineering, Packaging Science, Mechanical/Industrial Engineering ...

Cotality

Principal Software Engineer (Python)

Irvine, CA · On-site +1

$144K - $194K/yr

The hybrid-remote Principal Software Development Engineer leads the design, development, and ... package is built to help you thrive at work and in life. Highlights, depending on role ...

Cotality

Principal Software Engineer (Python)

Austin, TX · On-site +1

$133K - $179K/yr

The hybrid-remote Principal Software Development Engineer leads the design, development, and ... package is built to help you thrive at work and in life. Highlights, depending on role ...

Cotality

Principal Software Engineer (Python)

Sunrise, FL · On-site +1

$128K - $172K/yr

The hybrid-remote Principal Software Development Engineer leads the design, development, and ... package is built to help you thrive at work and in life. Highlights, depending on role ...

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Remote Principal Packaging Engineer information

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$74K

$147.2K

$212.5K

How much do remote principal packaging engineer jobs pay per year?

As of Jul 15, 2026, the average yearly pay for remote principal packaging engineer in the United States is $147,220.00, according to ZipRecruiter salary data. Most workers in this role earn between $118,500.00 and $173,000.00 per year, depending on experience, location, and employer.

What is the difference between Remote Principal Packaging Engineer vs Remote Packaging Engineer?

AspectRemote Principal Packaging EngineerRemote Packaging Engineer
Required CredentialsBachelor's/Master's in Packaging, Engineering, or related field; extensive experienceBachelor's in Packaging or related field; 2-5 years experience
Work EnvironmentLeadership roles, cross-functional teams, strategic planningDesign, testing, and implementation of packaging solutions
Employer & Industry UsageConsumer goods, pharmaceuticals, electronicsManufacturing, logistics, retail sectors

The Remote Principal Packaging Engineer typically holds a senior, strategic role overseeing packaging projects and teams, requiring advanced credentials and extensive experience. In contrast, the Remote Packaging Engineer focuses on designing and testing packaging solutions. Both roles are vital in industries like consumer goods and manufacturing, but the principal position involves higher-level decision-making and leadership responsibilities.

More about Remote Principal Packaging Engineer jobs
What cities are hiring for Remote Principal Packaging Engineer jobs? Cities with the most Remote Principal Packaging Engineer job openings:
What are the most commonly searched types of Principal Packaging Engineer jobs? The most popular types of Principal Packaging Engineer jobs are:
What states have the most Remote Principal Packaging Engineer jobs? States with the most job openings for Remote Principal Packaging Engineer jobs include:
What job categories do people searching Remote Principal Packaging Engineer jobs look for? The top searched job categories for Remote Principal Packaging Engineer jobs are:
Remote Principal Packaging Engineer jobs near you
Infographic showing various Remote Principal Packaging Engineer job openings in the United States as of July 2026, with employment types broken down into 2% As Needed, 78% Full Time, 3% Part Time, and 17% Contract. Highlights an 100% Remote job distribution, with an average salary of $147,220 per year, or $70.8 per hour.
Sr IC Packaging Layout Specialist - (100% Remote)

Sr IC Packaging Layout Specialist - (100% Remote)

Encore Semi, Inc.

Clifton, NJ • On-site, Remote

$150K - $165K/yr

Full-time

Medical, Dental, Vision, Life, Retirement, PTO

Re-posted 22 days ago

Job description

Sr Package Design & Electrical Analysis Engineer - (100% Remote)
We are seeking a Sr ASIC Packaging Engineer to lead the physical architecture of high-performance silicon. You will own the "silicon-to-board" interface, ensuring that advanced ASIC designs meet stringent signal integrity, thermal, and reliability requirements through expert simulation and innovative manufacturing.
Location: Remote (anywhere in US)
Full-time: Salary + Benefits + Bonuses / Contractor
Work Status: US Citizen or Lawful Permanent Resident.
Overview
Seeking an engineer with experience in package layout and electrical analysis, focusing on power distribution and high-frequency signal integrity.
Key Responsibilities
  • Develop and optimize package layouts
  • Perform PDN and signal integrity analysis
  • Run simulations and improve design performance
  • Collaborate with cross-functional engineering teams
Qualifications
  • Degree in Electrical Engineering or related field
  • 10+ years of experience in package design and electrical analysis
  • Strong knowledge of power integrity and high-speed signal integrity
  • Hands-on experience with tools like Cadence APD, Cadence Clarity, Ansys HFSS, or similar (Siemens, Altium, etc.)
Preferred
  • Experience with advanced packaging (2.5D/3D, flip-chip)
  • Strong problem-solving and communication skills

The anticipated annual base salary for this position is between $150,000 to $165,000, which also includes a comprehensive benefits package.
Full-Time Benefits:
•15 days of PTO per calendar year
•10 paid Holidays per calendar year
•Comprehensive Medical Benefits: Company covers 80% of premiums for Employee and Dependents
•Dental & Vision: Company covers 50% of premiums for Employee and Dependents
•Voluntary Benefits: Life Insurance, FSA (Health and Dependent, Limited Purpose), HAS, and Gap Insurance
•Employee Assistant Program (EAP)
•401k - Traditional & Roth
•Life/AD&D and Long-Term Disability
•Tuition reimbursement
Equal Opportunity Policy Statement
Encore Semi, Inc. is an Equal Opportunity Employer that does not discriminate on the basis of actual or perceived race, religion, creed, color, age, sex, sexual orientation, gender, gender identity or expression, national origin, genetics, ancestry, marital status, civil union status, medical condition, disability (mental and physical), military and veteran status, pregnancy, childbirth and related medical conditions, or any other characteristic protected by applicable federal, state, or local laws and ordinances.
Encore Semi is also committed to compliance with all fair employment practices regarding citizenship and immigration status.
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