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Remote Huawei Rf Engineer Jobs in Alabama (NOW HIRING)

$143K - $266K/yr

Location/s; remote role but must be located in the US. The candidate will have expert knowledge of ... RF related to Package and PCB Design is required 5+ years experience with Cadence SI/PI tools ...

Remote Huawei Rf Engineer information

What is the difference between Remote Huawei Rf Engineer vs Remote 5G Network Engineer?

AspectRemote Huawei Rf EngineerRemote 5G Network Engineer
CertificationsHuawei certifications, RF engineering certifications5G, RF, and network certifications (e.g., Cisco, Nokia)
Work EnvironmentTelecom companies, network service providers, remote field supportTelecom firms, network operators, remote network deployment
Industry UsagePrimarily in Huawei-based network projectsAcross multiple vendors including Huawei, Ericsson, Nokia

The Remote Huawei Rf Engineer focuses on Huawei-specific RF network deployment and optimization, often working with Huawei equipment. In contrast, the Remote 5G Network Engineer has a broader scope, working with various vendors' 5G technologies and equipment. Both roles require RF knowledge and certifications but differ in vendor specialization and project scope.

What are the most commonly searched types of Huawei Rf Engineer jobs in Alabama? The most popular types of Huawei Rf Engineer jobs in Alabama are:
What are popular job titles related to Remote Huawei Rf Engineer jobs in Alabama? For Remote Huawei Rf Engineer jobs in Alabama, the most frequently searched job titles are:
What job categories do people searching Remote Huawei Rf Engineer jobs in Alabama look for? The top searched job categories for Remote Huawei Rf Engineer jobs in Alabama are:
What cities in Alabama are hiring for Remote Huawei Rf Engineer jobs? Cities in Alabama with the most Remote Huawei Rf Engineer job openings:
Infographic showing various Remote Huawei Rf Engineer job openings in Alabama as of July 2026, with employment types broken down into 93% Full Time, 4% Part Time, and 3% Contract. Highlights an 89% Physical, 4% Hybrid, and 7% Remote job distribution.
SI/PI for 3DIC Sr Principle Solutions Engineer

SI/PI for 3DIC Sr Principle Solutions Engineer

Cadence Design Systems Inc.

On-site, Remote

$143K - $266K/yr

Full-time

Medical, Dental, Vision, Retirement, PTO

Posted 27 days ago


Job description

At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.

This position involves defining and leading the development of advanced packaging and 3DIC analysis flows for foundry and customer solutions.

Location/s; remote role but must be located in the US.

The candidate will have expert knowledge of the Cadence toolset and/or equivalent competitor toolsets in the context of multiple flows including high-speed signal design, power design, signal integrity, power integrity and definition of electrical constraints. Design experience and industry knowledge of one of Signal, Power, and Thermal analysis associated with IC, package, or PCB design is required .

The candidate needs to have the ability to analyze the customer's environment and evaluate appropriate solutions. Be knowledgeable and aware of competitive technologies. Anticipates technical issues and develops creative solutions before they become a problem. Takes technical lead on a wide range of projects. Ability to understand high-speed, high-performance signal and power integrity-related issues, and work with peers and other business groups.Able to communicate effectively with Cadence R&D, Product Engineering, Marketing and with customers. Understands customer success criteria and is committed to ensuring customer success.

Position requires:
Bachelor's degree (Masters preferred) in Electrical or Electronics Engineering with
Minimum 15 years experience with Signal Integrity, Power Integrity, Electromagnetics, Thermal, and RF related to Package and PCB Design is required
5+ years experience with Cadence SI/PI tools Allegro platform tools including: Sigrity, Clarity, PCB Editor, ICP preferred
Strong knowledge of advanced packaging concepts
Strong knowledge of 2.5D, 3DIC and stacked die technologies
Understanding of chip level CMOS design concepts desired
Strong customer-facing communication and problem-solving skills
Strong personal drive for continuous learning and expanding professional skill sets
Excellent verbal and written communication skills


The annual salary range for California is $143,500 to $266,500. You may also be eligible to receive incentive compensation: bonus, equity, and benefits. Sales positions generally offer a competitive On Target Earnings (OTE) incentive compensation structure. Please note that the salary range is a guideline and compensation may vary based on factors such as qualifications, skill level, competencies and work location. Our benefits programs include: paid vacation and paid holidays, 401(k) plan with employer match, employee stock purchase plan, a variety of medical, dental and vision plan options, and more.

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