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Remote Chip Design Jobs in Indiana (NOW HIRING)

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Remote Chip Design information

What are some common challenges faced by professionals working in remote chip design roles, and how can they be managed?

Remote chip design professionals often encounter challenges such as coordinating across time zones, ensuring secure access to proprietary design tools, and maintaining effective communication with cross-functional teams. To manage these, it's important to establish clear collaboration protocols, use secure cloud-based design platforms, and set regular check-ins with team members. Successful remote designers also prioritize documentation and proactive communication to keep projects on track and aligned with overall goals.

What is remote chip design?

Remote chip design refers to the process of designing integrated circuits (ICs) or semiconductor chips while working from a location outside of a traditional office or lab environment. Professionals in this field use specialized software and collaborate with teams online to create, test, and verify chip designs. Advances in cloud-based design tools and secure data sharing have made it possible for engineers to contribute to chip development projects from anywhere in the world. This flexibility allows companies to tap into a global talent pool and enables engineers to maintain a better work-life balance. Remote chip design is becoming increasingly popular in the semiconductor industry.

What is the difference between Remote Chip Design vs Remote ASIC Design?

AspectRemote Chip DesignRemote ASIC Design
CredentialsBachelor's or Master's in Electrical Engineering or Computer EngineeringBachelor's or Master's in Electrical Engineering or Computer Engineering
Work EnvironmentDesigning integrated circuits, often in collaborative teams, using CAD toolsDesigning custom ASICs, involving detailed specifications and verification processes
Industry UsageSemiconductor companies, hardware firms, tech giantsSemiconductor companies, specialized hardware firms, tech industry
Search & Comparison IntentHigh overlap in skills and tools, often compared for job roles in chip development

Remote Chip Design and Remote ASIC Design share similar educational backgrounds and work environments, focusing on integrated circuit development. While both roles involve hardware design, ASIC Design emphasizes custom chip creation for specific applications, often requiring detailed verification. Candidates should have strong engineering fundamentals and experience with CAD tools. The roles are highly comparable, with differences mainly in project scope and specialization.

What are the key skills and qualifications needed to thrive as a Remote Chip Design Engineer, and why are they important?

To thrive as a Remote Chip Design Engineer, you need a solid background in electrical engineering, digital and analog circuit design, and a relevant degree such as BSEE or MSEE. Expertise in hardware description languages (HDLs) like Verilog or VHDL, familiarity with EDA tools (e.g., Cadence, Synopsys), and knowledge of FPGA or ASIC workflows are typically required. Strong problem-solving skills, attention to detail, and effective remote communication stand out as vital soft skills for collaborating with distributed teams. These capabilities ensure efficient design cycles, high-quality deliverables, and seamless teamwork in a remote engineering environment.
What are the most commonly searched types of Chip Design jobs in Indiana? The most popular types of Chip Design jobs in Indiana are:
What are popular job titles related to Remote Chip Design jobs in Indiana? For Remote Chip Design jobs in Indiana, the most frequently searched job titles are:
What job categories do people searching Remote Chip Design jobs in Indiana look for? The top searched job categories for Remote Chip Design jobs in Indiana are:
What cities in Indiana are hiring for Remote Chip Design jobs? Cities in Indiana with the most Remote Chip Design job openings:
Remote Chip Design jobs near you

Principal Microelectronics Architect

TAP Engineering LLC

Bloomington, IN • On-site, Remote

Full-time

Medical, Dental, Vision, Retirement, PTO

Posted 20 days ago

Job description

Principal Microelectronics Architect (SME)
Remote (U.S.) | Full-Time | Secret Clearance Required
Position: Principal Microelectronics Architect (SME)
Location: Remote (Periodic On-site Support as Needed)
Category: Hardware Engineering / Systems Architecture
Clearance Requirement: U.S. Citizenship Required; Active Secret Clearance
Education Requirement: Bachelor's Degree in Electrical Engineering, Computer Engineering, or related discipline (Master's or PhD preferred)
Experience Requirement: 10+ Years in Microelectronics Design, Semiconductor Development, or IP Architecture
Position Overview
We are seeking an experienced Principal Microelectronics Architect to serve as a Subject Matter Expert (SME) supporting a critical government-sponsored microelectronics modernization initiative. This role will provide technical leadership in the development of a secure, collaborative design environment focused on advancing semiconductor innovation, intellectual property reuse, and next-generation design workflows.
The selected candidate will work within a highly technical team responsible for defining architecture, standards, and governance models that support the development and integration of advanced microelectronics technologies. This position offers the opportunity to influence long-term strategy while working closely with government stakeholders, industry partners, and engineering teams across the semiconductor ecosystem.
The ideal candidate brings deep expertise in microelectronics design, silicon IP, system-on-chip (SoC) architecture, FPGA technologies, and semiconductor design workflows, along with the ability to communicate complex technical concepts to both technical and executive audiences.
Key Responsibilities
Strategic Technical Leadership
  • Serve as a trusted technical advisor supporting the development of secure, cloud-enabled microelectronics design environments.
  • Provide expertise in semiconductor design methodologies, silicon IP reuse, and design ecosystem modernization.
  • Guide architectural decisions that support long-term scalability, interoperability, and sustainability.
Intellectual Property Management & Governance
  • Develop and validate standards for managing reusable design IP repositories.
  • Establish best practices for secure integration and lifecycle management of commercial and government-developed IP assets.
  • Assess technical risks, licensing considerations, and long-term sustainability of IP portfolios.
  • Support governance strategies that promote efficient IP sharing and collaboration.
Design Flow & Technology Integration
  • Evaluate and optimize semiconductor design workflows across modern engineering environments.
  • Support the integration of foundry-qualified design flows and advanced packaging technologies.
  • Promote interoperability across multiple vendors, toolchains, and semiconductor platforms.
  • Identify opportunities to accelerate development timelines and improve engineering productivity.
Technical Assessments & Program Execution
  • Conduct technology evaluations and produce technical assessment reports.
  • Deliver recommendations related to design infrastructure, tool interoperability, and ecosystem scalability.
  • Support milestone reviews and provide technical briefings to program leadership and stakeholders.
  • Contribute to strategic roadmaps that support future program growth and modernization efforts.
Stakeholder Collaboration
  • Coordinate requirements and technical activities across government organizations, industry partners, research institutions, and engineering teams.
  • Facilitate collaboration among stakeholders focused on semiconductor design, fabrication, packaging, and testing.
  • Build consensus around standards, processes, and technical direction.
Required Qualifications
  • Bachelor's degree in Electrical Engineering, Computer Engineering, or a related technical discipline
  • 10+ years of experience in microelectronics design, semiconductor development, FPGA design, or System-on-Chip (SoC) architecture
  • Deep understanding of silicon IP development, integration, validation, and reuse methodologies
  • Experience evaluating and managing third-party intellectual property within complex hardware environments
  • Familiarity with industry-standard Electronic Design Automation (EDA) tools, including:
    • Cadence
    • Synopsys
    • Siemens EDA
  • Understanding of cloud-enabled design environments and collaborative engineering workflows
  • Strong knowledge of semiconductor design processes and technology development lifecycles
  • Exceptional technical writing, documentation, and presentation skills
  • Ability to communicate complex technical concepts to both engineering teams and executive leadership
  • U.S. Citizenship with the ability to obtain and maintain a Secret security clearance
Preferred Qualifications
  • Active Secret clearance or higher preferred
  • Experience supporting government-sponsored microelectronics programs
  • Familiarity with trusted semiconductor manufacturing and supply chain assurance initiatives
  • Experience with advanced packaging technologies and chiplet architectures
  • Knowledge of modern semiconductor fabrication processes and foundry ecosystems
  • Familiarity with radiation-hardened, high-reliability, or mission-critical electronics
  • Experience supporting collaborative research and development initiatives involving government, industry, and academia
  • Knowledge of leading semiconductor foundries and advanced process technologies
Benefits Overview
TAP Engineering offers a comprehensive and highly competitive benefits package designed to support your health, financial well-being, professional growth, and work-life balance.
  • Paid Time Off: 15-25 days of PTO annually based on tenure, plus 11 paid holidays with no use-it-or-lose-it policy.
  • Retirement Benefits: Up to a 15% employer contribution to your 401(k) through a combination of company match and profit-sharing.
  • Comprehensive Medical Coverage: Employer-paid medical insurance for employees, with optional enhanced plans and dependent coverage available.
  • Dental & Vision Insurance: Employer-paid dental and vision coverage with optional buy-up plans.
  • Tuition Reimbursement: Up to $36,000 annually for approved degree programs, certifications, and continuing education opportunities.
  • Wellness & Employee Support Programs: Employee Assistance Program (EAP), wellness incentives, virtual healthcare services, prescription savings programs, and travel assistance resources.
  • Additional Employee Perks: Access to employee discount programs and other company-sponsored benefits.
  • Performance-Based Recognition: Merit increases, performance bonuses, and employee referral bonuses designed to reward contributions and success.
Why Join Us?
This is a unique opportunity to help shape the future of microelectronics design and collaboration within a highly visible national-level initiative. You'll work alongside industry and government leaders, influence next-generation design environments, and contribute to the development of technologies that will impact critical systems for years to come.
The role begins with an initial six-month technical engagement focused on architecture definition, standards development, and technology assessments. Successful completion of Phase 1 is expected to lead to a five-year follow-on effort, providing the opportunity to serve as a technical lead for a major microelectronics modernization initiative and help shape its long-term architecture, standards, and implementation strategy.

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