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Quantum Research Scientist Trainee Jobs in Matawan, NJ

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Quantum Research Scientist Trainee information

See Matawan, NJ salary details

$52.2K

$134.4K

$179.8K

How much do quantum research scientist trainee jobs pay per year?

As of May 28, 2026, the average yearly pay for quantum research scientist trainee in Matawan, NJ is $134,439.00, according to ZipRecruiter salary data. Most workers in this role earn between $111,100.00 and $178,700.00 per year, depending on experience, location, and employer.

What is the difference between Quantum Research Scientist Trainee vs Quantum Research Scientist?

AspectQuantum Research Scientist TraineeQuantum Research Scientist
Required CredentialsTypically a master's or Ph.D. in physics, quantum computing, or related fields; training programsAdvanced degree (Ph.D.) often required; extensive research experience
Work EnvironmentInternship or training programs in labs or research institutionsFull-time research roles in academia, industry, or government labs
Employer & Industry UsageEntry-level training positions in quantum tech companies or research centersEstablished research roles in quantum computing, cryptography, or physics departments

The main difference is that a Quantum Research Scientist Trainee is an entry-level position focused on training and skill development, often part of a structured program. In contrast, a Quantum Research Scientist is a fully qualified professional conducting independent research, with more experience and responsibilities.

Quantum Research Scientist Trainee jobs near you
Research Scientist - Quantum & AI Photonic Chip Simulation

Research Scientist - Quantum & AI Photonic Chip Simulation

Quantum Computing Inc.

Hoboken, NJ • On-site

Full-time

Posted 19 days ago

Job description

Location: Hoboken, NJ
Department: Tomorrow
Reports to: Ting Bu
Position Overview
The Research Scientist will work on the modeling, simulation, and architectural development of
quantum and artificial intelligence (AI) computational structures intended for chip-scale
implementation. This role focuses on translating advanced quantum and AI concepts into
physically realistic, simulation-validated device and system designs suitable for fabrication. It
concentrates on high-fidelity simulation, feasibility analysis, and performance optimization under
practical fabrication constraints. The role serves as a technical bridge between the research
team developing novel quantum/AI architectures and the chip fabrication team responsible for
implementation, ensuring that proposed designs are physically realizable, scalable, and
performance-optimized prior to tape-out.
Duties and Responsibilities
• Develop and simulate quantum and AI-based photonic architectures for on-chip
implementation.
• Translate high-level computational concepts into device-level and system-level
simulation models.
• Perform rigorous electromagnetic and multiphysics simulations to evaluate optical,
nonlinear, and quantum effects.
• Model and simulate quantum photonic circuits and quantum gates under realistic device
conditions.
• Analyze fabrication tolerances and material constraints to assess design robustness.
Optimize photonic device structures for performance, scalability, and manufacturability.
• Collaborate closely with fabrication and packaging teams to ensure simulation models
align with process capabilities.
• Support post-fabrication validation by correlating experimental results with simulation
predictions.
• Document modeling methodologies, simulation results, and architectural trade-offs for
internal and external reporting.
Required Qualifications
Education
• Ph.D. in Physics, Applied Physics, Electrical Engineering, or a closely related discipline.
Technical Background
• Strong foundation in Photonics, Quantum optics, Nonlinear optics
• Demonstrated experience in simulation of photonic integrated circuits.
• Experience modeling and simulating quantum gates or quantum optical systems.
• Understanding of semiconductor/TFLN and photonic chip fabrication processes sufficient
to incorporate realistic constraints into simulations.
• Familiarity with chip testing and packaging considerations from a modeling perspective.
Software Proficiency
• Lumerical (FDTD, MODE, INTERCONNECT)
• Tidy3D
• COMSOL Multiphysics
• Python
• MATLAB

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