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Principal Packaging Engineer Jobs in Massachusetts

Velaura

Principal Packaging Engineer

Boston, MA

$200K - $500K/yr

Role Overview We are looking for a Principal Packaging Engineer to own package architecture and development for Velaura's next-generation SoCs. This role will lead packaging from concept through ...

Bostondynamics

Principal Mechanical Engineer

Waltham, MA · On-site

$155K - $193K/yr

Boston Dynamics is looking for a Principal Mechanical Engineer to join our Atlas team. We are ... Production Rigor: A proven track record of architecting and bringing tightly packaged ...

Akamai

Principal Network Engineer

Cambridge, MA · On-site

$132K - $237K/yr

Partner with the best As a Principal Network Engineer you will lead efforts in designing ... The compensation package may also include incentive compensation opportunities in the form of ...

Recorded Future

Principal Software Engineer

Boston, MA · On-site

$152K - $228K/yr

As a Principal Software Engineer, you will work across application code and infrastructure to ... Your recruiter can share more about the specific details of the compensation and benefit package ...

SA Technologies Inc.

Principal Software Engineer

Lowell, MA · On-site

$133K - $179K/yr

Position: Principal Software Engineer Location: Lowell, MA Duration: 12 Months Rate: Open The ... Board diagnostics, platform or board support package, and drivers. The OS environment is VX works ...

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All JobsPrincipal Packaging Engineer JobsPrincipal Packaging Engineer Jobs in Massachusetts

Principal Packaging Engineer information

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$80.8K

$160.8K

$232.1K

How much do principal packaging engineer jobs pay per year?

As of Sep 2, 2026, the average yearly pay for principal packaging engineer in Massachusetts is $160,782.00, according to ZipRecruiter salary data. Most workers in this role earn between $129,400.00 and $188,900.00 per year, depending on experience, location, and employer.

What is a principal packaging engineer?

A Principal Packaging Engineer is a senior-level professional responsible for designing, developing, and optimizing packaging solutions for products. They ensure packaging meets functional, cost, and sustainability requirements while complying with industry regulations. This role involves cross-functional collaboration with manufacturing, supply chain, marketing, and regulatory teams to improve packaging performance and efficiency. Principal Packaging Engineers also lead innovation initiatives, troubleshoot issues, and implement new technologies to enhance packaging design and reduce environmental impact.

What are the typical responsibilities of a principal packaging engineer in a manufacturing environment?

As a Principal Packaging Engineer in a manufacturing setting, you will lead the design, development, and optimization of packaging solutions for new and existing products. This includes collaborating closely with R&D, quality assurance, supply chain, and production teams to ensure packaging meets performance, safety, and sustainability standards. You may also oversee testing, validation, and process improvements, as well as mentor junior engineers and participate in supplier evaluations. These responsibilities are critical for ensuring product integrity, customer satisfaction, and compliance with industry regulations while driving cost-efficiency.

What are the key skills and qualifications needed to thrive as a principal packaging engineer?

To thrive as a Principal Packaging Engineer, you need deep expertise in packaging design, materials science, regulatory compliance, and project management, usually supported by a degree in engineering or a related field. Experience with CAD software, packaging testing protocols, and knowledge of industry standards (such as ISTA or ISO) are highly valuable, along with relevant certifications like Six Sigma or PMP. Exceptional problem-solving ability, leadership, and cross-functional communication skills help you influence teams and manage complex projects. These capabilities are crucial for developing innovative, cost-effective packaging solutions that meet business objectives and regulatory requirements.

What are the most commonly searched types of Principal Packaging Engineer jobs in Massachusetts?

The most popular types of Principal Packaging Engineer jobs in Massachusetts are:

What are popular job titles related to Principal Packaging Engineer jobs in Massachusetts?

For Principal Packaging Engineer jobs in Massachusetts, the most frequently searched job titles are:

What job categories do people searching Principal Packaging Engineer jobs in Massachusetts look for?

The top searched job categories for Principal Packaging Engineer jobs in Massachusetts are:

Principal Packaging Engineer jobs near you
Infographic showing various Principal Packaging Engineer job openings in Massachusetts as of August 2026, with employment types broken down into 87% Full Time, 8% Part Time, and 5% Contract. Highlights an 86% Physical, 5% Hybrid, and 9% Remote job distribution, with an average salary of $160,782 per year, or $77.3 per hour.

Principal Packaging Engineer

Velaura

Boston, MA

$200K - $500K/yr

Full-time

Medical, Dental, Vision, PTO

Re-posted 19 days ago

Job description

Role Overview
We are looking for a Principal Packaging Engineer to own package architecture and development for Velaura's next-generation SoCs. This role will lead packaging from concept through production, working across silicon, board, system, thermal, mechanical, and manufacturing teams to deliver high-performance, cost-effective, and manufacturable products. The ideal candidate has deep experience with advanced semiconductor packaging, package-level signal and power integrity, substrate and assembly technologies, and cross-functional system optimization.
Responsibilities

 Own package architecture from concept through production for Velaura SoCs.

 Partner with architecture and silicon teams to co-optimize package, die, board, and system design for performance, power, cost, and manufacturability.

 Drive package technology selection, including flip-chip, advanced substrates, fan-out, and future multi-die integration approaches.

Lead package design, bump planning, substrate definition, escape routing, and assembly interactions with OSAT and substrate vendors.

 Own package-level signal integrity and power integrity planning for high-speed interfaces including LPDDR, PCIe, Ethernet, and other high-speed I/O.

Collaborate on thermal architecture, mechanical integration, reliability, DFM, and qualification.

Work with foundry, assembly, substrate, and test partners to successfully deliver products to production.

Help define Velaura's long-term packaging roadmap as future products evolve.

Required Qualifications

Deep experience developing advanced semiconductor packages for high-performance SoCs.

Strong understanding of package architecture, substrate technologies, bumping, assembly flows, and manufacturing.

Experience co-optimizing package design with silicon, board, SI/PI, thermal, and mechanical teams.

Hands-on experience with signal integrity, power integrity, thermal, and reliability

considerations in advanced packages.

Ability to balance technical excellence with cost, yield, manufacturability, and schedule.

Excellent communication skills and a collaborative, first-principles engineering mindset.

Preferred Qualifications

Advanced packaging technologies including chiplets, 2.5D integration, silicon bridges, or heterogeneous integration.

HBM integration and high-bandwidth memory package architecture.

Advanced process nodes (N3, N2, or beyond).

Experience working with leading foundries, OSATs, and substrate vendors.

Experience in an early-stage semiconductor company.

$200,000 - $500,000 a year
Compensation & Benefits

At Velaura, we believe exceptional talent deserves exceptional rewards. Compensation for this role includes a competitive base salary, performance-based incentives, and equity participation, allowing team members to share in the company's long-term success.

Your base pay will depend on your skills, qualifications, experience, and location.

In addition to compensation, Velaura offers a comprehensive benefits package that may include medical, dental, and vision coverage; paid time off; flexible work arrangements; professional development opportunities; and other benefits designed to support the well-being and growth of our team.

Velaura is committed to pay equity and transparency and regularly benchmarks compensation to ensure we remain competitive in the market.

Why Velaura?

Velaura is building next-generation compute technology for cloud, edge, and Physical AI. Our solutions will enable robots, autonomous systems, drones, and other intelligent machines to operate efficiently in the physical world.
This is an opportunity to help build foundational technology at a time when the industry is undergoing fundamental change. You will work alongside experienced leaders, architects, engineers, and operators who have delivered industry-defining products across mobile, cloud, semiconductor, and AI platforms. If you enjoy solving difficult problems, working across disciplines, and helping shape the future of Physical AI, we would love to hear from you.

Equal Employment Opportunity and Accommodations

Velaura is an Equal Opportunity Employer that is committed to inclusion and diversity. Qualified applicants will receive consideration for employment without regard to race, color, religion, national origin, gender, sexual orientation, gender identity, disability or protected veteran status. We also take affirmative action to offer employment
opportunities to minorities, women, individuals with disabilities, and protected veterans.

Velaura is committed to working with qualified individuals with physical or mental disabilities. Applicants who would like to contact us regarding the accessibility of our website or who need special assistance or a reasonable accommodation for any part of the application or hiring process may contact us at: [email protected]. This contact
information is for accommodation requests only. Evaluation of requests for reasonable accommodation will be determined on a case-by-case basis.

We may use artificial intelligence (AI) tools to support parts of the hiring process, such as reviewing applications, analyzing resumes, or assessing responses and identifying potential inconsistencies or verification signals in application materials based on available information. These tools assist our recruitment team but do not replace human judgment. Final hiring decisions are ultimately made by humans. If you would like more information about how your data is processed, please contact us.
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