Power Innovations Jobs in California (NOW HIRING)

Why Consider This Job Opportunity

The Senior Power Engineer leads technical marketing for next generation AI data center power delivery from PDB/IBC through package/on-die delivery networks. Work directly with customers and internal engineering teams to translate emerging system challenges into quantitative requirements, technology roadmaps and new R&D initiatives.

 

Workplace Policy

Hybrid from San Jose, CA.

What To Expect (Essential Job Responsibilities)

• Analyze end to end AI server power delivery from rack/PDB and 48V IBC stages through multiphase VRs, PoL converters, and integrated regulators.
• Translate customer needs into quantitative electrical, thermal, mechanical including voltage, current efficiency, power density, transient response.
• Identify the system-level problem behind customer component specifications.
• Create and advance design-in, joint-evaluation, and co-development opportunities by connecting customer roadmaps with internal product and R&D capabilities.
• Serve as the technical interface among customers, sales, product divisions, corporate R&D, and external partners; proactively initiate communication to obtain required information and drive decisions.

Miscellaneous Job Responsibilities

• Monitor emerging technologies and ecosystem changes, including 800 VDC rack distribution, vertical power delivery, TLVR, switched-capacitor and hybrid converters, IVR, backside power delivery, glass-core substrates, through-glass vias, embedded power components, and advanced cooling.
• Build relationships with universities, startups, semiconductor companies, packaging suppliers, and research institutes to identify collaboration and innovation opportunities.
• Support predominantly virtual collaboration with sales, technical support, and customer teams across Dallas, San Jose, and other U.S. and global locations; travel as required for customer and partner engagements.
• Perform other related duties and support cross-functional initiatives as assigned. This position is currently intended as an individual-contributor role with no direct supervisory responsibility unless otherwise assigned.

What Is Required (Qualifications)

• Bachelor’s degree in electrical engineering, Power Electronics, Semiconductor Engineering, Electronic Packaging, or a closely related technical field.
• 5+ of relevant industry experience in power electronics, server/data center power architecture, board- or package-level PDN/power integrity, semiconductor power applications, power modules, magnetics, or passive components.
• Strong understanding of DC-DC power conversion, including buck and multiphase converters; working knowledge of IBC, POL, switched-capacitor, coupled-inductor, or related architectures.
• Working knowledge of target impedance, decoupling, voltage droop, transient response, and parasitic resistance and inductance across board and package interconnects.
• Ability to convert customer needs into measurable technical requirements, product specifications, technical proposals, or development plans.
• Strong communication and presentation skills with the ability to engage circuit designers, package
• engineers, system architects, commercial teams, and senior leadership.
• Ability to work independently, initiate cross-site communication, and lead projects across organizational and geographic boundaries.

How To Stand Out (Preferred Qualifications)

• Master's degree or Ph.D. in Electrical Engineering, Power Electronics, Semiconductor Engineering, Electronic Packaging, or a related field.
• Experience with Hyperscalers, AI accelerator companies, server OEMs/ODMs, power solution suppliers, or advanced packaging organizations.
• Experience with 48 V/54 V power delivery, high-voltage DC distribution, TLVR, vertical power delivery, IVR, hybrid converters, or processors operating above 1 kW or at kiloampere-class current levels.
• Knowledge of advanced packages, interposers, glass-core substrates, TGV, embedded passives, backside power delivery, thermal design, or liquid cooling.
• Previous technical marketing, product management, field applications, new product definition, customer co-development, design-in, or design-win experience.

Other

Infrequent domestic and international travel.

Minimum Salary: $97,894

Maximum Salary: $162,259

Perks

• Comprehensive benefits package including medical, dental, and vision insurance.
• Generous Paid Time Off including paid holidays and floating holidays.
• 401(k) employer match on retirement planning.
• Hybrid working schedule for eligible positions.
• Tuition reimbursement on approved programs.
• Flexible and health spending accounts.
• Talent Development program.