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Pecvd Process Engineer Jobs (NOW HIRING)

Process Engineer 4

Fremont, CA · On-site

$104K - $231K/yr

The impact you'll make As a Process Engineer at Lam, you will operate on cutting-edge technology ... PECVD), or Physical Vapor Deposition (PVD). * Background in Plasma Physics, Reactive Ion Etching ...

Process Engineer 3

Fremont, CA · On-site

$86K - $192K/yr

The impact you'll make As a Process Engineer at Lam, you will operate on cutting-edge technology ... PECVD), or Physical Vapor Deposition (PVD). * Background in Plasma Physics, Reactive Ion Etching ...

The impact you'll make As a Process Engineer at Lam, you will operate on cutting-edge technology ... PECVD), or Physical Vapor Deposition (PVD). * Background in Plasma Physics, Reactive Ion Etching ...

R&D Senior Process Engineer Job type: Full Time · Department: Microfabrication · Work type ... Define material selection criteria and deposition strategies (ALD, PECVD, sputtering, e-beam ...

... RIE, PECVD, and Wet Etch. * Design, develop and qualify different area of Mfg. Process including ... Provide detailed engineering analysis and documentation to support process deployment and ramp into ...

Process Engineer 3

Fremont, CA · On-site

$86K - $192K/yr

The impact you'll make As a Process Engineer at Lam, you will operate on cutting-edge technology ... PECVD), or Physical Vapor Deposition (PVD). * Background in Plasma Physics, Reactive Ion Etching ...

Process Engineer 3

Fremont, CA · On-site

$86K - $192K/yr

The impact you'll make As a Process Engineer at Lam, you will operate on cutting-edge technology ... PECVD), or Physical Vapor Deposition (PVD). * Background in Plasma Physics, Reactive Ion Etching ...

Showing results 21-40

Pecvd Process Engineer information

See salary details

$49.5K

$92K

$142.5K

How much do pecvd process engineer jobs pay per year?

As of Aug 22, 2026, the average yearly pay for pecvd process engineer in the United States is $92,018.00, according to ZipRecruiter salary data. Most workers in this role earn between $74,500.00 and $103,000.00 per year, depending on experience, location, and employer.

What is a PECVD process engineer?

PECVD Process Engineers are specialists who develop, optimize, and maintain Plasma Enhanced Chemical Vapor Deposition (PECVD) processes used in semiconductor manufacturing and related industries. They work with advanced equipment to deposit thin films on substrates, ensuring uniformity and high-quality results. Their responsibilities include process troubleshooting, equipment maintenance, and collaborating with other engineers to improve film performance and yield. PECVD Process Engineers play a critical role in producing microelectronic devices and other components requiring precise material deposition.

What are the key skills and qualifications needed to thrive as a PECVD process engineer?

To thrive as a PECVD Process Engineer, you need a solid background in materials science, semiconductor processing, and chemical engineering, often supported by a relevant engineering degree. Familiarity with PECVD equipment, process characterization tools (such as ellipsometry, SEM, and profilometry), and statistical process control systems is typically required. Strong analytical thinking, problem-solving abilities, and effective teamwork are essential soft skills in this role. These competencies are crucial for optimizing process performance, ensuring high product quality, and driving innovation in semiconductor manufacturing environments.

What are some common challenges a PECVD process engineer faces when optimizing thin film deposition processes?

PECVD Process Engineers often encounter challenges such as achieving uniform film thickness across large substrates, minimizing defects, and maintaining process stability over long production runs. Balancing deposition rate, film quality, and equipment throughput requires careful tuning of process parameters like gas flow, pressure, and plasma power. Collaboration with equipment maintenance teams and R&D is essential to resolve issues quickly and implement process improvements. Staying up-to-date with advancements in materials and plasma technology also plays a key role in overcoming these challenges.
More about Pecvd Process Engineer jobs

What cities are hiring for Pecvd Process Engineer jobs?

Cities with the most Pecvd Process Engineer job openings:

What states have the most Pecvd Process Engineer jobs?

States with the most job openings for Pecvd Process Engineer jobs include:

Infographic showing various Pecvd Process Engineer job openings in the United States as of August 2026, with employment types broken down into 1% As Needed, 79% Full Time, 16% Part Time, 3% Contract, and 1% Nights. Highlights an 92% Physical, 2% Hybrid, and 6% Remote job distribution, with an average salary of $92,018 per year, or $44.2 per hour.

Senior Engineer, Field Process (Boise, ID)

ASM

Boise, ID • On-site

Full-time

Re-posted 8 days ago


Job description

Senior Field Process Engineer (FPE)

Location: Boise, Idaho

Role Overview

The Senior Field Process Engineer (FPE) is responsible for onsite process development in close collaboration with customer R&D, technology development organizations, and business units. This role owns and drives joint process development and qualification of new ASM systems and products, while fostering strong customer relationships and interfacing with global business unit teams.


Key Responsibilities

New Product Introduction (NPI)

  • Lead joint process development and qualification of new ASM systems and products at customer sites.

  • Receive training from ASM Business Units to gain expertise in newly developed deposition processes (PEALD, PECVD, Epitaxy, LPCVD/vertical furnace) and hardware.

  • Manage the introduction and transfer of new processes and hardware to customer sites.

  • Collaborate closely with field hardware, service, sales teams, and Business Units to support and troubleshoot new product issues.

  • Develop proposals for equipment and process design improvements and conduct experiments with customers.

  • Escalate issues as needed to ensure timely resolution and adherence to project scope and timelines.

  • Document NPI learnings to support future IQ, hardware, and process rollout packages.

  • Facilitate knowledge transfer to local process and service teams at manufacturing sites.

  • Provide indepth process and equipment expertise, troubleshooting leadership, and escalation support to ensure successful NPI implementation.

OnSite Process Development

  • Support customer deposition process and hardware development, including new development and continuous improvement projects (CIP).

  • Work closely with customers to design and execute experiments for device integration, process development, troubleshooting, and CIP needs.

  • Analyze baseline process and system performance and identify gaps relative to technology node requirements.

  • Perform problem assessment and root cause analysis of system performance nonconformances at customer sites.

  • Identify and develop new opportunities for ASM process and hardware introductions at customer sites.

HighVolume Manufacturing (HVM) Process Transfer

  • Lead process transfer to HVM fabs and transfer product knowledge to local field process and service organizations.

  • Document process and hardware learnings from development phases and develop Best Known Methods (BKMs).

  • Ensure effective transfer of BKMs to HVM site teams.


Education

  • PhD preferred; Master's or PhD in Physics, Chemistry, Materials Science, Electrical Engineering, Chemical Engineering, Mechanical Engineering, or a related discipline.


Experience & Skills Requirements

  • Equivalent combination of education and experience with strong fundamentals in thinfilm processing, development, and characterization using deposition reactors such as thermal ALD, PEALD, PECVD, and Epitaxy.

  • Minimum of 3-5 years of experience as a process engineer, or a combination of relevant academic and industry experience.

  • Experience with DRAM and NAND device integration and technology development preferred.

  • Experience with advanced packaging integration and process development (waferlevel hybrid bonding, fusion bonding, dietowafer, HBM) preferred.

  • Strong knowledge of semiconductor device applications (DRAM and NAND), vacuum techniques, film characterization and metrology, and ALD deposition equipment.

  • Demonstrated success in film deposition optimization and process development; experience with ASM ALD, PEALD, PECVD, and Epitaxy tools is a strong plus.

  • Experience with Design of Experiments (DOE), SPC, and statistical analysis methods.

  • Proactive in supporting escalations, developing and managing action plans, and facilitating clear communication among customers, service teams, and business units.

  • Willingness to travel to Business Units for training and to customer sites as required. Primary location is onsite in Boise, Idaho, with domestic and international travel to support escalations, transfers, and HVM sites as needed.

  • Strong understanding of intellectual property boundaries between ASM and customers, with the ability to maintain IP integrity in all interactions.

  • Excellent verbal and written communication skills, with the ability to clearly and concisely convey advanced technical concepts.

  • Candidates with additional experience may be considered for higher job grades or seniorlevel roles.