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Pecvd Process Engineer Jobs (NOW HIRING)

Teledyne FLIR LLC

Process Engineer

Goleta, CA · On-site

$90K - $121K/yr

Under the general supervision of the Process Engineering Manager, coordinates and directs ... ALD & PECVD), & in situ metrology. * Strong preference on experience w/ PlasmaTherm Versaline or ...

Teledyne

Process Engineer

Goleta, CA · On-site

$90K - $121K/yr

Under the general supervision of the Process Engineering Manager, coordinates and directs ... ALD & PECVD), & in situ metrology. * Strong preference on experience w/ PlasmaTherm Versaline or ...

Lam Research Corporation

Process Engineer 5

Albany, NY · On-site

The impact you'll make As a Process Engineer at Lam, you will operate on cutting-edge technology ... PECVD), or Physical Vapor Deposition (PVD). * Background in Plasma Physics, Reactive Ion Etching ...

ASM

Senior Process Engineer - Plasma

Phoenix, AZ · On-site

$103K - $133K/yr

We are seeking R&D-oriented Engineers to join our team in the development and improvement of ... Familiarity with PECVD, PEALD, RIE process mechanisms. Excellent communication skills for technical ...

Lam Research Corporation

Process Engineer 4

Fremont, CA · On-site

$104K - $231K/yr

The impact you'll make As a Process Engineer at Lam, you will operate on cutting-edge technology ... PECVD), or Physical Vapor Deposition (PVD). * Background in Plasma Physics, Reactive Ion Etching ...

Lam Research Corporation

Process Engineer 4

Fremont, CA · On-site

$104K - $231K/yr

The impact you'll make As a Process Engineer at Lam, you will operate on cutting-edge technology ... PECVD), or Physical Vapor Deposition (PVD). * Background in Plasma Physics, Reactive Ion Etching ...

Lam Research Corporation

Process Engineer 6

Fremont, CA · On-site

The impact you'll make As a Process Engineer at Lam, you will operate on cutting-edge technology ... PECVD), or Physical Vapor Deposition (PVD). * Background in Plasma Physics, Reactive Ion Etching ...

Lam Research Corporation

Process Engineer 4

Fremont, CA · On-site

$104K - $231K/yr

The impact you'll make As a Process Engineer at Lam, you will operate on cutting-edge technology ... PECVD), or Physical Vapor Deposition (PVD). * Background in Plasma Physics, Reactive Ion Etching ...

Lam Research Corporation

Process Engineer 4

Austin, TX · On-site

The impact you'll make As a Process Engineer at Lam, you will operate on cutting-edge technology ... PECVD), or Physical Vapor Deposition (PVD). * Background in Plasma Physics, Reactive Ion Etching ...

Lam Research Corporation

Process Engineer 3

Fremont, CA · On-site

$86K - $192K/yr

The impact you'll make As a Process Engineer at Lam, you will operate on cutting-edge technology ... PECVD), or Physical Vapor Deposition (PVD). * Background in Plasma Physics, Reactive Ion Etching ...

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Pecvd Process Engineer information

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How much do pecvd process engineer jobs pay per year?

As of Jul 14, 2026, the average yearly pay for pecvd process engineer in the United States is $92,018.00, according to ZipRecruiter salary data. Most workers in this role earn between $74,500.00 and $103,000.00 per year, depending on experience, location, and employer.

What are the key skills and qualifications needed to thrive as a PECVD Process Engineer, and why are they important?

To thrive as a PECVD Process Engineer, you need a solid background in materials science, semiconductor processing, and chemical engineering, often supported by a relevant engineering degree. Familiarity with PECVD equipment, process characterization tools (such as ellipsometry, SEM, and profilometry), and statistical process control systems is typically required. Strong analytical thinking, problem-solving abilities, and effective teamwork are essential soft skills in this role. These competencies are crucial for optimizing process performance, ensuring high product quality, and driving innovation in semiconductor manufacturing environments.

What are some common challenges a PECVD Process Engineer faces when optimizing thin film deposition processes?

PECVD Process Engineers often encounter challenges such as achieving uniform film thickness across large substrates, minimizing defects, and maintaining process stability over long production runs. Balancing deposition rate, film quality, and equipment throughput requires careful tuning of process parameters like gas flow, pressure, and plasma power. Collaboration with equipment maintenance teams and R&D is essential to resolve issues quickly and implement process improvements. Staying up-to-date with advancements in materials and plasma technology also plays a key role in overcoming these challenges.

What are PECVD Process Engineers?

PECVD Process Engineers are specialists who develop, optimize, and maintain Plasma Enhanced Chemical Vapor Deposition (PECVD) processes used in semiconductor manufacturing and related industries. They work with advanced equipment to deposit thin films on substrates, ensuring uniformity and high-quality results. Their responsibilities include process troubleshooting, equipment maintenance, and collaborating with other engineers to improve film performance and yield. PECVD Process Engineers play a critical role in producing microelectronic devices and other components requiring precise material deposition.
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Pecvd Process Engineer jobs near you
Infographic showing various Pecvd Process Engineer job openings in the United States as of July 2026, with employment types broken down into 2% Locum Tenens, 93% Full Time, 2% Part Time, and 3% Contract. Highlights an 87% Physical, 4% Hybrid, and 9% Remote job distribution, with an average salary of $92,018 per year, or $44.2 per hour.

Junior Coatings Scientist PECVD / DLC

ARMORLUBE LLC

Tucson, AZ • On-site

$63K - $82K/yr

Full-time

Re-posted 11 days ago

Job description


Position Overview
We are seeking a motivated, detail-oriented Junior Coatings Scientist to join our advanced materials development team. In this role, you will work directly alongside a Senior Scientist to develop, optimize, and scale cutting-edge Plasma-Enhanced Chemical Vapor Deposition (PECVD) processes, with a primary focus on Diamond-Like Carbon (DLC) coatings.
This is an exceptional opportunity for a recent graduate or early-career professional to gain hands-on, expert mentorship in thin-film deposition, advanced plasma physics, and industrial surface engineering. You will play a vital role in taking new deposition systems from initial power-on through comprehensive process validation, directly contributing to the growth of our production capabilities.
Key Responsibilities
  • Equipment Commissioning & Turn-on: Assist senior engineering staff in the physical installation, initial powering, and sub-system testing of new PECVD and vacuum deposition hardware.
  • System Validation (IQ/OQ/PQ): Participate in structured equipment validation protocols, including vacuum leak testing, gas flow calibration, power supply tuning, and plasma stability testing.
  • Process Development & Scaling: Assist the Senior Scientist in designing, running, and optimizing PECVD coating recipes and surface preparation to achieve targeted mechanical, tribological, and structural properties.
  • Analytical Characterization: Perform routine thin-film characterization to evaluate coating quality, including thickness, hardness, adhesion (scratch testing), friction coefficients, and microstructure.
  • Data Analysis & Documentation: Meticulously log validation metrics, process parameters, and analytical test results to build a robust baseline for new machinery.
  • Troubleshooting & Maintenance: Assist in diagnosing hardware anomalies during the commissioning phase, monitoring plasma stability, and establishing baseline preventive maintenance routines.

Qualifications & Skills
Required:
  • Education: Bachelors or Masters degree in Materials Science, Chemical Engineering, Physics, Mechanical Engineering, or a closely related STEM discipline.
  • Core Knowledge: Strong foundational understanding of materials characterization, surface science, and thin-film concepts.
  • Hands-on Aptitude: Comfort working around mechanical hardware, vacuum systems, gas delivery lines, or high-power electronics.
  • Methodical Execution: High attention to detail required for following strict equipment startup sequences, validation checklists, and safety protocols.
  • Analytical Mindset: Excellent data collection and documentation habits; proficiency with technical writing and data analysis.
Preferred (Nice-to-Have):
  • Direct undergraduate or internship experience with vacuum technology, plasma processing, or physical/chemical vapor deposition (PVD/CVD).
  • Familiarity with equipment validation procedures, sensor calibration, or mass flow controller (MFC) verification.
  • Basic understanding of plasma diagnostics, power matching, or hollow cathode technology.

What We Offer
  • Direct mentorship from industry-leading experts in DLC and advanced plasma technology.
  • A fast-paced, collaborative R&D environment using state-of-the-art industrial coating systems.
  • High-impact experience involved in the ground-up deployment and qualification of new industrial technology.