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Pecvd Process Engineer Jobs (NOW HIRING)

Senior Process Engineer

Rochester, NY · On-site

$102K - $132K/yr

SeniorProcess Engineer Ideal Candidate: GDI isseekinga highly experienced, hands-on Senior Process ... Lead the development and optimization of silicon anode deposition processes, including PECVD or ...

Principal Field Process Engineer (Hillsboro, OR) The Principal Field Process Engineer (FPE) is a ... Handson experience with ASM ALD, PEALD, PECVD, Epitaxy, or Vertical Furnace LPCVD equipment.

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Pecvd Process Engineer information

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$49.5K

$92K

$142.5K

How much do pecvd process engineer jobs pay per year?

As of Sep 13, 2026, the average yearly pay for pecvd process engineer in the United States is $92,018.00, according to ZipRecruiter salary data. Most workers in this role earn between $74,500.00 and $103,000.00 per year, depending on experience, location, and employer.

What is a PECVD process engineer?

PECVD Process Engineers are specialists who develop, optimize, and maintain Plasma Enhanced Chemical Vapor Deposition (PECVD) processes used in semiconductor manufacturing and related industries. They work with advanced equipment to deposit thin films on substrates, ensuring uniformity and high-quality results. Their responsibilities include process troubleshooting, equipment maintenance, and collaborating with other engineers to improve film performance and yield. PECVD Process Engineers play a critical role in producing microelectronic devices and other components requiring precise material deposition.

What are the key skills and qualifications needed to thrive as a PECVD process engineer?

To thrive as a PECVD Process Engineer, you need a solid background in materials science, semiconductor processing, and chemical engineering, often supported by a relevant engineering degree. Familiarity with PECVD equipment, process characterization tools (such as ellipsometry, SEM, and profilometry), and statistical process control systems is typically required. Strong analytical thinking, problem-solving abilities, and effective teamwork are essential soft skills in this role. These competencies are crucial for optimizing process performance, ensuring high product quality, and driving innovation in semiconductor manufacturing environments.

What are some common challenges a PECVD process engineer faces when optimizing thin film deposition processes?

PECVD Process Engineers often encounter challenges such as achieving uniform film thickness across large substrates, minimizing defects, and maintaining process stability over long production runs. Balancing deposition rate, film quality, and equipment throughput requires careful tuning of process parameters like gas flow, pressure, and plasma power. Collaboration with equipment maintenance teams and R&D is essential to resolve issues quickly and implement process improvements. Staying up-to-date with advancements in materials and plasma technology also plays a key role in overcoming these challenges.
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Infographic showing various Pecvd Process Engineer job openings in the United States as of September 2026, with employment types broken down into 1% As Needed, 76% Full Time, 19% Part Time, 3% Contract, and 1% Nights. Highlights an 90% Physical, 2% Hybrid, and 8% Remote job distribution, with an average salary of $92,018 per year, or $44.2 per hour.

Etch - PECVD - Sr Equipment Engineer

Fremont, CA • On-site

$91K - $150K/yr

Full-time

Medical, Dental, Vision, Retirement, PTO

Re-posted 20 days ago


Job description

Work Setting: 100% onsite semiconductor manufacturing environment in Fremont, CA

Compensation: $91,625 – $150,000 base salary

Bonus: Annual bonus opportunity up to 12%

Benefits: Medical, dental, vision, 401(k), paid time off, employee stock programs, and comprehensive employer benefits package

Relocation: Available on a case-by-case basis

Sponsorship: Will consider H1b-transfers/TN-1 Visas


Position Summary

A global leader in photonics and semiconductor technology is seeking a Senior Equipment Engineer to support critical Etch, PECVD, and Thin Film manufacturing operations within a high-volume semiconductor wafer fabrication environment.

This is a highly visible equipment engineering role responsible for the reliability, performance, qualification, and continuous improvement of critical semiconductor manufacturing equipment. The successful candidate will serve as the primary equipment owner for Etch, PECVD, Sputter, ICP, RIE, and related process tools while partnering closely with Process Engineering, Manufacturing, Facilities, and Maintenance teams to maximize uptime, improve yield, and drive operational excellence.

The ideal candidate is a hands-on semiconductor equipment engineer who enjoys troubleshooting complex tool issues, leading equipment improvement projects, and driving long-term reliability initiatives that directly impact fab performance and production output.


What You'll Do

• Own the performance, reliability, and maintenance strategy for Etch, PECVD, and Thin Film equipment

• Lead troubleshooting efforts, root-cause investigations, and corrective actions for equipment-related issues

• Drive equipment uptime, availability, and reliability improvement initiatives

• Support equipment installation, startup, qualification, and process transfer activities

• Lead TPM, preventive maintenance, and continuous improvement programs

• Manage equipment upgrades, modifications, and capital improvement projects

• Analyze equipment performance data using JMP and other analytical tools to identify improvement opportunities

• Partner with Process Engineering to improve process stability, yield, and manufacturing performance

• Coordinate with OEMs, vendors, and service providers to resolve technical issues and improve equipment support

• Develop maintenance procedures, equipment documentation, and best practices

• Mentor technicians and junior engineers on troubleshooting methodologies and equipment ownership practices

• Support manufacturing operations in a fast-paced production environment


What You Bring

• Bachelor's degree in Engineering or related technical discipline preferred

• 10+ years of semiconductor wafer fabrication equipment engineering experience

• Strong hands-on experience supporting Etch equipment

• Strong hands-on experience supporting PECVD equipment

• Experience supporting Sputter or Thin Film deposition equipment

• Proven expertise in equipment troubleshooting, root-cause analysis, and reliability improvement

• Experience leading equipment qualifications, installations, and startup activities

• Strong JMP experience required

• Experience managing equipment vendors and OEM support organizations

• Strong understanding of semiconductor manufacturing operations and wafer fabrication environments

• Excellent analytical, problem-solving, and communication skills

• Ability to work cross-functionally with Engineering, Manufacturing, Facilities, and Maintenance teams

Preferred Qualifications

• Experience with ICP, RIE, or E-Beam equipment

• Reliability engineering experience

• TPM implementation experience

• Programming, automation, or data analytics experience

• OEM or Field Service Engineering background

• Experience leading capital equipment projects

• Advanced statistical analysis and equipment performance modeling experience

• Compound semiconductor, photonics, or advanced wafer fabrication experience


Why This Opportunity

• Ownership of critical semiconductor manufacturing equipment with direct impact on fab performance

• Opportunity to work with advanced Etch, PECVD, and Thin Film technologies

• Strong technical autonomy and influence within the engineering organization

• Exposure to equipment upgrades, capital projects, and advanced manufacturing initiatives

• Collaborative engineering culture with significant cross-functional interaction

• Opportunity to mentor and develop less-experienced engineers and technicians

• Career growth into Principal Engineer, Reliability Engineering, Technical Leadership, or Engineering Management

• Global technology organization with strong investment in semiconductor manufacturing and advanced photonics technologies

• High-visibility role supporting products that enable next-generation communications, networking, and AI infrastructure technologies