Pcb Box Build Jobs (NOW HIRING)

• Implement and test simple RF building blocks (filters, couplers) from established schematics.
• Run directed simulations (ADS/HFSS/CST); document results and perform basic parameter sweeps.
• Execute bench measurements using VNAs and spectrum analyzers; record first-order data.
• Support BOM creation and EOL data gathering.
• Collaborate with mechanical/software teams on interface details.
• Collect and organize test data accurately, perform basic trend analysis, and prepare clear charts and summary reports under guidance.
• Iterate LNAs/PAs and mixer front ends designs; address biasing, stability, and matching networks.
• Perform simulations; correlate model-to-measurement; refine designs to meet gain, NF, and linearity.
• Develop and execute test plans; interpret results to drive corrective actions.
• Partner with manufacturing on thin-film/PCB/box-build considerations; incorporate DFM/DFT feedback.
• Create accurate BOMs with alternates; assist with EOL analysis.
• Proficient in analyzing RF performance data (gain, noise figure, linearity) and correlating results with simulation outputs. Capable of generating structured reports that include observations, root-cause hypotheses, and recommended corrective actions for review by senior engineers.
• Architect and lead subsystem designs (up/down-converters, mixers, synthesizers); balance gain, NF, linearity, spurious, and thermal stability.
• Own model-to-hardware correlation; employ EM/circuit co-simulation and statistical analyses.
• Direct rigorous validation using VNAs, spectrum analyzers, and custom fixtures; interpret complex data.
• Lead manufacturability integration; manage NPI transitions and reliability/yield tradeoffs.
• Perform EOL analysis; select replacements and manage compliance impacts.
• Interpret complex RF test datasets and simulation results to validate subsystem performance. Prepare comprehensive technical reports for internal design reviews, and customer review meetings.
• Mentor junior engineers and lead design reviews.

Define and oversee RF product architectures and integration into complete systems.

Lead advanced RF design efforts for converters, amplifiers, and complex thin-film circuits; resolve multi-physics/EM interactions.

Establish performance optimization frameworks and acceptance criteria; mentor teams to those standards.

Innovate in simulation/modeling; codify best practices/tool flows.

Direct complex validation campaigns; adjudicate data for architecture-level decisions.

Drive manufacturability/reliability strategies across thin-film, PCB, and box-build; partner with Operations.

Own component lifecycle management and BOM standards; review high-impact bids.

Act as technical liaison across mechanical/software; represent engineering in major customer/executive reviews.

Produces executive-ready/customer-facing technical reports and white papers that articulate design trade-offs, risk assessments, and compliance impacts. Sets standards for data integrity and reporting practices across engineering teams.

Guide adherence to government contract flow-downs and export controls; help scope Technical Assistance Agreements.

Engineer I

• Implement and test simple RF building blocks (filters, couplers) from established schematics.
• Run directed simulations (ADS/HFSS/CST); document results and perform basic parameter sweeps.
• Execute bench measurements using VNAs and spectrum analyzers; record first-order data.
• Support BOM creation and EOL data gathering.
• Collaborate with mechanical/software teams on interface details.
• Collect and organize test data accurately, perform basic trend analysis, and prepare clear charts and summary reports under guidance.

Engineer II

• Iterate LNAs/PAs and mixer front ends designs; address biasing, stability, and matching networks.
• Perform simulations; correlate model-to-measurement; refine designs to meet gain, NF, and linearity.
• Develop and execute test plans; interpret results to drive corrective actions.
• Partner with manufacturing on thin-film/PCB/box-build considerations; incorporate DFM/DFT feedback.
• Create accurate BOMs with alternates; assist with EOL analysis.
• Proficient in analyzing RF performance data (gain, noise figure, linearity) and correlating results with simulation outputs. Capable of generating structured reports that include observations, root-cause hypotheses, and recommended corrective actions for review by senior engineers.

Engineer III (Senior)

• Architect and lead subsystem designs (up/down-converters, mixers, synthesizers); balance gain, NF, linearity, spurious, and thermal stability.
• Own model-to-hardware correlation; employ EM/circuit co-simulation and statistical analyses.
• Direct rigorous validation using VNAs, spectrum analyzers, and custom fixtures; interpret complex data.
• Lead manufacturability integration; manage NPI transitions and reliability/yield tradeoffs.
• Perform EOL analysis; select replacements and manage compliance impacts.
• Interpret complex RF test datasets and simulation results to validate subsystem performance. Prepare comprehensive technical reports for internal design reviews, and customer review meetings.
• Mentor junior engineers and lead design reviews.

Engineer IV (Staff/Principal)

Define and oversee RF product architectures and integration into complete systems.

Lead advanced RF design efforts for converters, amplifiers, and complex thin-film circuits; resolve multi-physics/EM interactions.

Establish performance optimization frameworks and acceptance criteria; mentor teams to those standards.

Innovate in simulation/modeling; codify best practices/tool flows.

Direct complex validation campaigns; adjudicate data for architecture-level decisions.

Drive manufacturability/reliability strategies across thin-film, PCB, and box-build; partner with Operations.

Own component lifecycle management and BOM standards; review high-impact bids.

Act as technical liaison across mechanical/software; represent engineering in major customer/executive reviews.

Produces executive-ready/customer-facing technical reports and white papers that articulate design trade-offs, risk assessments, and compliance impacts. Sets standards for data integrity and reporting practices across engineering teams.

Guide adherence to government contract flow-downs and export controls; help scope Technical Assistance Agreements.

Requirements Basic Qualifications:

• Bachelor’s degree in Electrical Engineering or a related technical discipline
• US Citizenship required for compliance.
• Excellent written and oral communication skills.

Technical Qualifications by Level Engineer I

• 0-2 years RF design and test experience
• Familiarity with RF test equipment (VNA, spectrum analyzer) and basic RF theory.

Engineer II

• MS in RF/Microwave preferred.
• 2–5 years RF design and test experience; proficiency with ADS/HFSS/CST and RF lab equipment.
• Strong understanding of EM theory, impedance matching, and signal integrity.

Engineer III (Senior)

• MS strongly preferred.
• 5–10 years RF design experience across amplifiers, converters, and thin-film circuits; expertise with ADS/HFSS/CST and RF testing methodologies.
• Familiarity with RF manufacturing processes; strong compliance knowledge.

Engineer IV (Staff/Principal)

• MS strongly preferred.
• 10+ years hands-on RF design with production delivery; expert in simulation tools and advanced RF test methodologies.
• Deep expertise in EM theory, impedance matching, and signal integrity; fluency in RF manufacturing processes.