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Packaging Technical Program Manager Jobs (NOW HIRING)

Technical Program Manager

Van Buren, MO · On-site

$108K - $140K/yr

We are seeking an experienced Technical Program Manager (TPM) with 10+ years of experience managing complex technical programs within software development environments. The ideal candidate will have ...

Technical Program Manager

Chicago, IL · On-site +1

$89K - $110K/hr

Job Title: Technical Program Manager Location(s): Irvine, CA, Milpitas, CA or Chicago, IL ... Generous benefits package including medical, dental, vision, long-term disability, and life ...

Technical Program Manager

Philadelphia, PA · On-site

$130K - $168K/yr

Senior Technical Program Manager Work location: Spoke: Philadelphia, PA. Duration: 6 to 12+ Months Background and Meet and Greet: MANDATORY "Capgemini is seeking a Senior Technical Program Manager ...

Technical Program Manager

San Jose, CA · On-site

$175K - $208K/yr

As a Technical Program Manager at Muon Space, you delight our customers and users with high-quality ... Taking Care of Our Team At Muon salary is only part of our total compensation package. In addition ...

Technical Program Manager

Goleta, CA · On-site

$165K - $220K/yr

The Technical Program Manager will be responsible for initiating and maintaining extensive contact ... WE OFFER AN EXCEPTIONAL EMPLOYEE BENEFITS PACKAGE! * Competitive Industry Pay * 100% Employer-Paid ...

Technical Program Manager

Austin, TX · On-site

$127K - $165K/yr

Technical Program Manager - Electromechanical NPI - Austin, TX | Hybrid flexibility Stelivo is ... The company offers a comprehensive benefits package, stock options, potential relocation assistance ...

Technical Program Manager

Eagan, MN · On-site +1

$90K - $120K/yr

The Technical Program Manager serves as a bridge between technical and business teams, ensuring alignment across priorities, dependencies, risks, timelines, and delivery objectives. This role ...

Technical Program Manager

Chandler, AZ · On-site

$126K - $164K/yr

Technical Program Manager (TPM) About Us We're on a mission to turn ambitious ideas into impactful realities. Our teams design and deliver technology solutions that solve real-world problems-whether ...

Proven experience leading technical programs from inception through delivery and adoption. * Strong stakeholder management and executive communication skills. * Experience managing program risks ...

Technical Program Manager

Madison, WI · On-site

$130K - $168K/yr

Technical Program Manager - Insurance & IT Service Management Overview / Summary We are seeking an ... At HTC Global Services, our employees have access to a comprehensive benefits package. Benefits can ...

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Packaging Technical Program Manager information

See salary details

$89K

$145.6K

$168.5K

How much do packaging technical program manager jobs pay per year?

As of Sep 10, 2026, the average yearly pay for packaging technical program manager in the United States is $145,648.00, according to ZipRecruiter salary data. Most workers in this role earn between $129,000.00 and $167,000.00 per year, depending on experience, location, and employer.

What is a Packaging Technical Program Manager?

Packaging Technical Program Managers (PTPMs) are professionals who oversee and coordinate the development, design, and implementation of packaging solutions within a company. They work across teams such as engineering, manufacturing, supply chain, and marketing to ensure packaging meets technical requirements, quality standards, and project deadlines. PTPMs manage timelines, budgets, and resources while resolving any issues that arise during the packaging development lifecycle. Their work helps companies deliver products safely and efficiently to customers while optimizing costs and sustainability.

How does a Packaging Technical Program Manager typically collaborate with cross-functional teams during a new product launch?

A Packaging Technical Program Manager works closely with design, engineering, procurement, and manufacturing teams to ensure packaging solutions meet functional, aesthetic, and cost requirements. During a new product launch, they coordinate timelines, manage risks, and facilitate communication to resolve technical challenges swiftly. Their role involves aligning stakeholders on project goals, conducting regular check-ins, and adapting plans based on feedback or shifting priorities. This collaboration is crucial for delivering innovative packaging that aligns with company standards and customer expectations.

What are the key skills and qualifications needed to thrive as a Packaging Technical Program Manager, and why are they important?

To thrive as a Packaging Technical Program Manager, you need strong project management abilities, a solid understanding of packaging engineering principles, and typically a degree in engineering or a related field. Familiarity with CAD software, PLM systems, and certifications like PMP or Six Sigma are often required for managing complex technical projects. Excellent communication, stakeholder management, and problem-solving skills help you coordinate cross-functional teams and drive innovation. These competencies are crucial for delivering high-quality packaging solutions on time and within budget, ensuring both technical excellence and business success.

What is the difference between Packaging Technical Program Manager vs Packaging Engineer?

AspectPackaging Technical Program ManagerPackaging Engineer
CredentialsBachelor's degree in engineering, supply chain, or related field; PMP or project management certifications often preferredBachelor's or master's in packaging engineering, mechanical engineering, or related field
Work EnvironmentCross-functional teams, project management, coordination roles within manufacturing and supply chainDesign, testing, and development of packaging solutions within R&D or manufacturing
Industry UsageUsed in companies managing complex packaging projects, overseeing timelines and budgetsPrimarily involved in designing and improving packaging products and materials

The Packaging Technical Program Manager focuses on managing packaging projects, coordinating teams, and ensuring timely delivery, while the Packaging Engineer concentrates on designing and developing packaging solutions. Both roles require technical knowledge, but the Program Manager emphasizes project oversight and cross-functional collaboration.

Is packaging technical program manager a stressful job?

A packaging technical program manager often faces pressure to meet project deadlines, coordinate cross-functional teams, and ensure product quality, which can contribute to stress. The role requires strong organizational skills, technical knowledge, and the ability to manage multiple priorities simultaneously.

What cities are hiring for Packaging Technical Program Manager jobs?

Cities with the most Packaging Technical Program Manager job openings:

What are popular job titles related to Packaging Technical Program Manager jobs?

For Packaging Technical Program Manager jobs, the most frequently searched job titles are:

Infographic showing various Packaging Technical Program Manager job openings in the United States as of August 2026, with employment types broken down into 1% As Needed, 79% Full Time, 16% Part Time, and 4% Contract. Highlights an 95% Physical, 1% Hybrid, and 4% Remote job distribution, with an average salary of $145,648 per year, or $70 per hour.

IC packaging Technical Program Manager

Santa Clara, CA • On-site

$150K - $194K/yr

Other

Posted 25 days ago


Key responsibilities

  • Coordinate and manage all customer project activities, including risk analysis, planning, and milestone delivery.

  • Manage and resolve customer quality events by collaborating with factory teams such as RnD, NPI, SCM, and sales.

  • Coordinate customer visits and audits to the factory.


Job description

About The Business

Tata Electronics Private Limited (TEPL) is a greenfield venture of the Tata Group with expertise in manufacturing precision components.

Tata Electronics (a wholly owned subsidiary of Tata Sons Pvt. Ltd.) is building India’s first AI-enabled state-of-the-art Semiconductor Foundry. This facility will produce chips for applications such as power management IC, display drivers, microcontrollers (MCU) and high-performance computing logic, addressing the growing demand in markets such as automotive, computing and data storage, wireless communications and artificial intelligence.

Tata Electronics is a subsidiary of the Tata group. The Tata Group operates in more than 100 countries across six continents, with the mission 'To improve the quality of life of the communities we serve globally, through long term stakeholder value creation based on leadership with Trust.’

Responsibilities


Senior Technical Program Manager will support the VP of field application engineering. The TPM manager must have hands-on experience in semiconductor packaging technologies with a focus on flip chip, bumping, and wafer level packaging and their applications. Must be familiar with all phases of IC packaging processes and equipment. The TPM will coordinate with the factory RnD, NPI, SCM, and Production teams to ensure successful execution of customers’ projects and programs. Requires excellent verbal and written communication skills. Good interpersonal skills are essential.


Responsibilities: Will include the following, other duties may be assigned:

  1. Coordinate and manage all customer project related activities, including initiating the risk analysis and mitigation actions, establishing plans and key milestones for the customer projects and delivering the objectives on time.
  2. Manage and resolve customer quality events through closely collaborating with factory teams including RnD, NPI, SCM, and sales account managers.
  3. Coordinate customer visits and audit to the factory
  4. Establish technical credibility, building trust and strong relationships with the customers to ensure quick problem solving above and beyond customer expectations.


Essential Attributes


Qualifications

  1. Bachelor’s degree in engineering or related fields.
  2. Minimum of 10+ years of semiconductor manufacturing experience in assembly and test with in-depth understanding of the IC assembly and test processes, focusing on flip chip assembly and wafer level technologies. Knowledge on wire bond process is a plus.
  3. Experience in working with customers and stakeholders to resolve technical issues to support the business success.
  4. Strong verbal and written communication skills in English are essential along with interpersonal communications skills. Must be a team player with good organizational, computer and project management skills.
  5. Be a quick learner, a good listener, like a fast pace and matrix organization, able to follow instructions and work independently


Desired Experience Level

  1. MS with 5 years or PhD degree with 3 years of experience
  2. Working experience with a major OSAT for three years or more