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Packaging Development Engineer Jobs (NOW HIRING)

Overview The Senior Packaging Engineer leads packaging development initiatives from concept through commercialization, supporting new product launches, packaging improvements, supplier qualifications ...

We are seeking a Packaging Development Manager to create innovative, elevated, and commercially ... Develop dielines, structures, and artwork in collaboration with engineering and suppliers. Brand ...

We are seeking a Packaging Development Manager to create innovative, elevated, and commercially ... Develop dielines, structures, and artwork in collaboration with engineering and suppliers. Brand ...

Aegis Worldwide R&D Engineer $90,000 - 100,000 Must Haves * Bachelor's degree in Engineering, Science, Packaging, Plastics, Materials Science, or related technical field * 5-10 years of experience in ...

Packaging Engineer

Salisbury, MD · On-site

$78 - $116/hr

From promoting growth and development to prioritizing work‑life balance, we're committed to ... As a Packaging Engineer, you will support the development and improvement of food products by ...

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Packaging Development Engineer information

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$19

$42

$67

How much do packaging development engineer jobs pay per hour?

As of Aug 22, 2026, the average hourly pay for packaging development engineer in the United States is $42.37, according to ZipRecruiter salary data. Most workers in this role earn between $32.69 and $49.28 per hour, depending on experience, location, and employer.

What does a packaging development engineer do?

A Packaging Development Engineer is responsible for designing, developing, and improving packaging solutions for products. They work closely with product design, manufacturing, and marketing teams to create packaging that is functional, cost-effective, and environmentally friendly. Their role often involves selecting materials, testing prototypes, ensuring compliance with regulations, and optimizing packaging for supply chain efficiency. They play a critical part in protecting products, enhancing shelf appeal, and supporting sustainability goals.

What are the key skills and qualifications needed to thrive as a packaging development engineer?

To thrive as a Packaging Development Engineer, you need a solid background in engineering, materials science, and packaging design, typically supported by a relevant degree. Familiarity with CAD software, packaging testing tools, and knowledge of industry standards such as ISTA or ASTM are commonly required. Strong problem-solving, project management, and cross-functional communication skills help professionals excel in collaborative and fast-paced environments. These skills ensure innovative, cost-effective, and sustainable packaging solutions that meet product protection and regulatory requirements.

What are some typical challenges packaging development engineers face when introducing new packaging solutions?

Packaging Development Engineers often encounter challenges such as balancing cost-effectiveness with sustainability, meeting regulatory requirements, and ensuring compatibility with existing manufacturing lines. They must also address performance criteria like durability and shelf-life while collaborating closely with cross-functional teams in marketing, procurement, and quality assurance. Successfully managing these challenges requires strong project management skills and adaptability to evolving industry trends.

What states have the most Packaging Development Engineer jobs?

States with the most job openings for Packaging Development Engineer jobs include:

Infographic showing various Packaging Development Engineer job openings in the United States as of August 2026, with employment types broken down into 1% As Needed, 83% Full Time, 14% Part Time, and 2% Contract. Highlights an 90% Physical, 3% Hybrid, and 7% Remote job distribution, with an average salary of $88,120 per year, or $42.4 per hour.

Senior IC Packaging Development Engineer

Nvidia

Santa Clara, CA • On-site

Full-time

Re-posted 7 days ago


Nvidia rating

9.6

Company rating: 9.6 out of 10

Based on 17 frontline employees who took The Breakroom Quiz

7th of 245 rated software companies


Job description

We are looking for an experienced Engineerwho will lead the development of rapid IC packaging of individual die, to enable Failure Analysis and NPI tasks ahead of high-volume manufacturing. This will include planning &drivingrelated R&D with multiple internal and external partners and you will be responsible for establishing advanced packaging processes needed to meet our NPI goals regarding packaging turn-around-time, reliability, and chip-package interaction. Prior knowledge of Package related Failure Analysis is beneficial.

What you will be doing:

  • Package Development & Prototyping:Drive the process, mechanical, thermal, and material evaluation ofthe latestIC packages. Manage rapid prototyping builds, package stack-ups, and assembly processes to bring new packaging architectures from concept to small volume for FA and NPI use cases.

  • Material Characterization:Pioneer new packaging & die-level processing methodologies and evaluateinnovativepackaging materials (e.g., molding compounds, substrates, adhesives).

  • Failure Analysis & Debug:Coordinate comprehensive physical and electrical failure analysis on prototype builds, reliability-tested components to determine root causes of failures.

  • Multi-functionalCollaboration:You'll be embedded into the IC Failure Analysis team and collaborate with IC & Package design teams, process & product engineering. Collaboratewith foundries and OSAT (Outsourced Semiconductor Assembly and Test) partners to develop & test the required processes, tooling, and workflows.

What we need to see:

  • B.S., M.S., or Ph.D., or equivalent experiencein Materials Science, Mechanical Engineering, Electrical Engineering, Physics, or a related semiconductor field.

  • Packaging Expertise:Deep understanding of flip-chip, 2.5D/3D packaging, wire bonding, and advanced substrate architectures.

  • Experience:12+ years of hands-on experience in IC packaging development and/or package design, NPI (New Product Introduction).

  • Design & Simulation Tools:Familiarity with IC package EDA software (e.g., Cadence Allegro Package Designer) and Finite Element Modeling (FEM) tools like ANSYS or ABAQUS is a strong plus.

  • FA Tooling Proficiency:At a minimum, you'll need basic understanding of advanced packaging related FA techniques and equipment, such as SEM, EDX, CSAM, X-Ray, and LIT.

With competitive salaries and a generous benefits package, we are widely considered to be one of the technology world's most desirable employers; we have some of the most forward-thinking and hardworking people in the world working for us and, due to unparalleled growth, best-in-class teams are rapidly growing. If you're creative and autonomous with a real passion for your work, we want to hear from you!

Your base salary will be determined based on your location, experience, and the pay of employees in similar positions. The base salary range is 168,000 USD - 270,250 USD for Level 5, and 216,000 USD - 345,000 USD for Level 6.

You will also be eligible for equity and benefits.

Applications for this job will be accepted at least until July 19, 2026.

This posting is for an existing vacancy.

NVIDIA uses AI tools in its recruiting processes.

NVIDIA is committed to fostering an inclusive work environment and proud to be an equal opportunity employer. As we highly value diversity in our current and future employees, we do not discriminate (including in our hiring and promotion practices) on the basis of race, religion, color, national origin, gender, gender expression, sexual orientation, age, marital status, veteran status, disability status or any other characteristic protected by law.

What Nvidia employees say

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About Nvidia

Sourced by ZipRecruiter

NVIDIA has been transforming computer graphics, PC gaming, and accelerated computing for more than 25 years. It's a unique legacy of innovation that's fueled by great technology--and amazing people. Today, we're tapping into the unlimited potential of AI to define the next era of computing. An era in which our GPU acts as the brains of computers, robots, and self-driving cars that can understand the world. Doing what's never been done before takes vision, innovation, and the world's best talent.

Industry

Computer and electronic product manufacturing

Company size

10,000+ Employees

Headquarters location

Santa Clara, CA, US

Year founded

1993