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Packaging Development Engineer Jobs in California

Nokia

Senior Packaging Development Engineer

Sunnyvale, CA · On-site

$159K - $296K/yr

Are you passionate about pushing the boundaries of optical package design? We're seeking a talented and driven Packaging Development Engineer to lead the development of next-generation packaging ...

Gilead

Packaging Engineer III

Foster City, CA · On-site

Execute packaging development activities supporting product development and clinical study supplies across OSD, biologics, and combination products. * Apply pharmaceutical packaging principles to ...

Lancesoft

Packaging Engineer

Foster City, CA · On-site

$70 - $96.30/hr

... resides within the Packaging Development team, with a primary focus on the development ... Degree in industrial engineering, mechanical engineering, biomedical engineering, chemical ...

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Packaging Development Engineer information

See California salary details

$19

$41

$66

How much do packaging development engineer jobs pay per hour?

As of Aug 1, 2026, the average hourly pay for packaging development engineer in California is $41.81, according to ZipRecruiter salary data. Most workers in this role earn between $32.26 and $48.65 per hour, depending on experience, location, and employer.

What does a Packaging Development Engineer do?

A Packaging Development Engineer is responsible for designing, developing, and improving packaging solutions for products. They work closely with product design, manufacturing, and marketing teams to create packaging that is functional, cost-effective, and environmentally friendly. Their role often involves selecting materials, testing prototypes, ensuring compliance with regulations, and optimizing packaging for supply chain efficiency. They play a critical part in protecting products, enhancing shelf appeal, and supporting sustainability goals.

What are some typical challenges Packaging Development Engineers face when introducing new packaging solutions?

Packaging Development Engineers often encounter challenges such as balancing cost-effectiveness with sustainability, meeting regulatory requirements, and ensuring compatibility with existing manufacturing lines. They must also address performance criteria like durability and shelf-life while collaborating closely with cross-functional teams in marketing, procurement, and quality assurance. Successfully managing these challenges requires strong project management skills and adaptability to evolving industry trends.

What are the key skills and qualifications needed to thrive as a Packaging Development Engineer, and why are they important?

To thrive as a Packaging Development Engineer, you need a solid background in engineering, materials science, and packaging design, typically supported by a relevant degree. Familiarity with CAD software, packaging testing tools, and knowledge of industry standards such as ISTA or ASTM are commonly required. Strong problem-solving, project management, and cross-functional communication skills help professionals excel in collaborative and fast-paced environments. These skills ensure innovative, cost-effective, and sustainable packaging solutions that meet product protection and regulatory requirements.
Packaging Development Engineer jobs near you
Infographic showing various Packaging Development Engineer job openings in California as of July 2026, with employment types broken down into 1% As Needed, 81% Full Time, 15% Part Time, and 3% Contract. Highlights an 93% Physical, 2% Hybrid, and 5% Remote job distribution, with an average salary of $86,966 per year, or $41.8 per hour.

Senior Packaging Development Engineer

Nokia

Sunnyvale, CA • On-site

Full-time

Medical, Dental, Life, Retirement, PTO

Re-posted 14 days ago

Nokia rating

7.9

Company rating: 7.9 out of 10

Based on 6 frontline employees who took The Breakroom Quiz

31st of 96 rated telecommunications companies

Job description

Are you passionate about pushing the boundaries of optical package design? We're seeking a talented and driven Packaging Development Engineer to lead the development of next-generation packaging solutions. In this role, you'll be at the forefront of innovation, collaborating with cross-functional teams to optimize electrical assembly and RF signal efficiency and ensure seamless transition to mass production. If you're eager to own the design and development of flip chip, fan out, semiconductor dicing, and reflow processes, while staying abreast of cutting-edge technologies, we encourage you to apply!

Advancing connectivity to secure a brighter world.

Nokia is a global leader in connectivity for the AI era. With expertise across fixed, mobile and transport networks, powered by the innovation of Nokia Bell Labs, we're advancing connectivity to secure a brighter world. 

Learn more about life at Nokia.


Our recruitment process

We act inclusively and respect the uniqueness of people. Our employment decisions are made regardless of race, color, national or ethnic origin, religion, gender, sexual orientation, gender identity or expression, age, marital status, disability, protected veteran status or other characteristics protected by law. We are committed to a culture of inclusion built upon our core value of respect.

If you're interested in this role but don't meet every listed requirement, we still encourage you to apply. Unique backgrounds, perspectives, and experiences enrich our teams, and you may be just the right candidate for this or another opportunity.

The length of the recruitment process may vary depending on the specific role's requirements. We strive to ensure a smooth and inclusive experience for all candidates. Discover more about the recruitment process at Nokia. 

Some of our benefits in US:
  • Corporate Retirement Savings Plan
  • Health and dental benefits
  • Short-term disability, and long-term disability
  • Life insurance, and AD&D - Company paid 2x base pay
  • Optional or Supplemental life and AD&D insurance (Employee/Spouse/Child)
  • Paid time off for holidays and Vacation
  • Employee Stock Purchase Plan
  • Tuition Assistance Plan
  • Adoption assistance
  • Employee Assistance Program/Work Life Resource Program

The above benefits exclude students.


Disclaimer for US/Canada

Nokia Maintains broad annual base salary ranges for its roles in order to account for variations in knowledge, skills, experience and market conditions, and with consideration to internal peer equity. Check the salary ranges in the job info section for this role.

All North America job posts will post for a minimum of 7 calendar days and up to 180 days or until candidate/s identified.

You have:

  • 5-8 years of experience in high-speed electronics and Silicon Photonics package design.
  • Experience with flip chip, fanout, thermo-compression bonding, underfill, hot bar soldering, wirebonding, die attach.
  • Experience in microelectronics, optoelectronics packaging design and assembly.
  • Knowledgeable in packaging technologies and processes, with glass/ceramic/metal material properties and multilayer materials interfaces after bonding.
  • Experience in high-volume packaging of optical transceivers, co-packaged optics, multi-chips module, pluggables, 2.5/ 3D packages.
  • Experience with documentation of fabrication, inspection, and assembly processes.
  • Solid interpersonal, communication and problem-solving skills in order to interact with engineering staff, external vendors and contractors effectively.
  • Experience with package and process design/development from design to production.
  • Experience with metrology techniques such as SEM/XSEM, confocal microscopy, or acoustic imaging - or equivalent practical work experience.
     

It would be nice if you also have:

  • Familiar with optical coupling, fiber pigtail and free space optics.
  • Knowledgeable in materials properties and process, yield analysis and enhancement, failure mode and analysis, quality tools (such as DOE, SPC and Six-Sigma process and analysis).
  • Familiar with Industry Test Standard, such as JEDEC, EIA, Telcordia, Mil-Std, etc.
  • Knowledge of material properties and associated mechanical part fabrication processes.
  • Lead next generation Silicon Photonics package design in collaboration with cross-functional teams, stakeholders and vendors to ensure package requirements are met.
  • Own all the development of all the advanced packaging activities and designs: flip chip, reflow, fanout, thermo-compression bonding, underfill, hot bar soldering, wirebonding, etc...
  • Optimize the assembly of electrical and optical engines and apply Design for Manufacturing principles to meet production volumes and cost targets.
  • Survey advanced SiPh packaging solutions, materials and vendors to stay current with new technological advancements.
  • Own and maintain the process and the manufacturing documentation, along with Bill of Materials for new products.
  • Drive package debug activities during product validation and qualification.
  • Support the development activities at our Contract Manufacturers, both remotely and on-site to ensure a smooth transition to mass production.

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