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Package Design Jobs in Seattle, WA (NOW HIRING)

K2 Space

Senior ASIC Package Design Engineer

Seattle, WA · On-site

$180K - $260K/yr

The Role We are seeking a Senior ASIC Package Design Engineer to implement advanced ASIC package architecture, with a strong focus on flip-chip BGA (FC-BGA) and multi-chip module (MCM) solutions.

K2 Space

Principal ASIC Package Design Engineer

Seattle, WA · On-site

$200K - $280K/yr

The Role We are seeking a Principal ASIC Package Design Engineer to lead advanced ASIC package architecture and execution, with a strong focus on flip-chip BGA (FC-BGA) and multi-chip module (MCM ...

K2 Space

Senior ASIC Package Design Engineer

Seattle, WA · On-site

$180K - $260K/yr

The Role We are seeking a Senior ASIC Package Design Engineer to implement advanced ASIC package architecture, with a strong focus on flip-chip BGA (FC-BGA) and multi-chip module (MCM) solutions.

Sigma Design

Semiconductor Packaging Engineer

Redmond, WA · On-site

$115K - $145K/yr

Experience in System-in-Package (SiP) or Multi-Chip Module (MCM) design, manufacturing, and validation preferred * Experience with signal integrity or power integrity simulation tools (e.g., HFSS ...

Sigma Design

Semiconductor Packaging Engineer

Redmond, WA · On-site

$115K - $145K/yr

Experience in System-in-Package (SiP) or Multi-Chip Module (MCM) design, manufacturing, and validation preferred * Experience with signal integrity or power integrity simulation tools (e.g., HFSS ...

Philips

Packaging Engineer (Bothell, WA)

Bothell, WA · On-site

$103K - $177K/yr

Oversee packaging design process, ensuring designs meet Philips requirements for customer attractiveness, structural quality and sustainability. * Create specifications for packaging designs ...

Philips

Packaging Engineer (Bothell, WA)

Bothell, WA · On-site

$103K - $177K/yr

Oversee packaging design process, ensuring designs meet Philips requirements for customer attractiveness, structural quality and sustainability. * Create specifications for packaging designs ...

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Package Design information

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How much do package design jobs pay per hour?

As of Jul 16, 2026, the average hourly pay for package design in Seattle, WA is $20.46, according to ZipRecruiter salary data. Most workers in this role earn between $18.08 and $21.35 per hour, depending on experience, location, and employer.

Is packaging design in demand?

Packaging design is in demand due to the growth of e-commerce and retail industries, which require attractive and functional packaging to stand out and protect products. Professionals in this field often use design software like Adobe Illustrator and need a strong understanding of branding and consumer appeal. The job outlook remains positive as companies prioritize innovative packaging solutions to enhance customer experience.

What is the highest paid design job?

In the field of package design, senior roles such as Creative Director or Design Director tend to have the highest salaries, often exceeding six figures, especially in large companies or agencies. These positions require extensive experience, leadership skills, and proficiency with design tools like Adobe Creative Suite and 3D modeling software.

What does a package designer do?

A package designer creates the visual and structural design of product packaging to attract consumers and communicate brand identity. They use graphic design tools and knowledge of materials to develop functional, appealing packaging that meets safety and regulatory standards. The role often involves collaboration with marketing, product development, and manufacturing teams.

What is the difference between Package Design vs Graphic Designer?

AspectPackage DesignGraphic Designer
CredentialsDesign degree or related certificationDesign degree or related certification
Work EnvironmentPackaging companies, branding agencies, manufacturingAdvertising agencies, media companies, freelance
Industry UsageProduct packaging, branding, retailMarketing materials, digital media, branding

Package Design focuses on creating packaging solutions for products, emphasizing structural and visual aspects of packaging. Graphic Designers work on visual content across various media, including branding, advertising, and digital design. While both roles require design skills and similar credentials, Package Designers specialize in packaging materials and structures, whereas Graphic Designers have a broader scope in visual communication across multiple platforms.

How do you get into package design?

To pursue a career in package design, develop skills in graphic design, illustration, and 3D modeling using tools like Adobe Illustrator and Photoshop. A relevant degree in graphic design, industrial design, or a related field can be helpful, along with building a portfolio to showcase your work and gaining experience through internships or freelance projects.
What are the most commonly searched types of Package Design jobs in Seattle, WA? The most popular types of Package Design jobs in Seattle, WA are:
Package Design jobs near you
Infographic showing various Package Design job openings in Seattle, WA as of July 2026, with employment types broken down into 84% Full Time, 12% Part Time, 1% Temporary, and 3% Contract. Highlights an 86% Physical, 4% Hybrid, and 10% Remote job distribution, with an average salary of $42,556 per year, or $20.5 per hour.
Principal ASIC Package Design Engineer

Principal ASIC Package Design Engineer

K2 Space

Seattle, WA

$200K - $280K/yr

Other

Medical, Dental, Vision, Life, PTO

Posted 14 days ago

Job description

The Role

We are seeking a Principal ASIC Package Design Engineer to lead advanced ASIC package architecture and execution, with a strong focus on flip-chip BGA (FC-BGA) and multi-chip module (MCM) solutions. This role owns the end-to-end package strategy for high-performance mixed-signal and digital SoCs from early architecture and trade studies through vendor engagement, qualification, and production ramp. You will operate as the technical authority for package design, defining standards, influencing silicon and system architecture, and ensuring first-pass success for complex, high-speed, power-dense ASICs.

Responsibilities

  • Own ASIC package architecture for FC-BGA and MCM solutions, including substrate stack-up, ball-map strategy, power delivery, signal breakout, and mechanical constraints.
  • Lead package-level trade studies across cost, performance, power integrity (PI), signal integrity (SI), thermal, manufacturability, and reliability.
  • Define long-term packaging roadmap aligned with future ASIC nodes, bandwidth scaling, and multi-die integration.
  • Establish organizational package design standards, methodologies, and best practices.
  • Drive detailed design of FC-BGA packages for high-pin-count ASICs with high-speed SerDes, dense power grids, and RF signal content.
  • Define and review substrate stack-ups, via strategies, impedance control, escape routing, and reference plane planning.
  • Partner with silicon, RF, and systems teams to co-optimize die floorplans and package interfaces.
  • Own package-level SI/PI strategy, including high-speed digital interfaces (e.g., SerDes, JESD, Interlaken), power delivery network (PDN) design, and decoupling strategy
  • Lead thermal architecture at the package level, including lid selection, TIMs, heat-spreaders, and mechanical interfaces to system cooling.
  • Serve as the primary technical interface to substrate vendors, assembly houses, and OSATs.
  • Drive material selection, substrate technology choices, and assembly process optimization.

Qualifications 

  • Bachelor's degree in Packaging Engineering, Mechanical Engineering, Electrical Engineering, or a related field.
  • 10+ years of experience in ASIC package design, with deep expertise in FC-BGA.
  • Proven experience delivering high-pin-count, high-performance ASIC packages into production.
  • Strong understanding of substrate technologies and materials, SI/PI fundamentals at the package level, and thermal management for power-dense ASICs.
  • Fluent in SI/PI and EM simulation tools such as SIWave, HFSS, and ADS.
  • Experience working directly with OSATs and substrate vendors.
  • Knowledge of packaging qualification and test methodologies.

Nice to Have

  • Experience with MCM or heterogeneous integration (chiplets, interposers, advanced laminates).
  • Background in high-speed digital or mixed-signal SoCs.
  • Familiarity with aerospace, space, or high-reliability electronics.
  • Experience defining packaging strategy from early architecture through first silicon and volume ramp.
  • Demonstrated history of building or scaling package design methodology within an organization.

Compensation and Benefits:

  • Base salary range for this role is $200,000 - $280,000 + equity in the company
  • Salary will be based on several factors including, but not limited to: knowledge and skills, education, and experience level
  • Comprehensive benefits package including paid time off, medical/dental/vision/ coverage, life insurance, paid parental leave, and many other perks
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About K2 Space

Sourced by ZipRecruiter

Industry

Guided missile and space vehicle manufacturing

Company size

11 - 50 Employees

Headquarters location

Los Angeles, CA, US

Year founded

2022

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