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Overnight Principal Packaging Engineer Jobs (NOW HIRING)

Herbalife

Associate Packaging Engineer

Winston Salem, NC

$13.75 - $17/hr

Will work in a multi-functional environment to support Packaging Engineering projects by applying Packaging Engineering principals to develop and commercialize new packaging components or revise ...

Perdue Farms

Packaging Engineer

Salisbury, MD

$78K - $116K/yr

As a Packaging Engineer, you will support the development and improvement of food products by ... Principal Essential Duties & Responsibilities * Promotes applicable safety, regulatory, GMP ...

Perdue Farms

Packaging Engineer

Salisbury, MD · On-site

$78K - $116K/yr

As a Packaging Engineer, you will support the development and improvement of food products by ... Principal Essential Duties & Responsibilities * Promotes applicable safety, regulatory, GMP ...

Perdue Farms

Packaging Engineer

Salisbury, MD · On-site

$78K - $116K/yr

As a Packaging Engineer, you will support the development and improvement of food products by ... Principal Essential Duties & ResponsibilitiesPromotes applicable safety, regulatory, GMP ...

Perdue Farms

Packaging Engineer

Salisbury, MD · On-site

$78K - $116K/yr

As a Packaging Engineer, you will support the development and improvement of food products by ... Principal Essential Duties & Responsibilities * Promotes applicable safety, regulatory, GMP ...

BUNZL

Flexible Packaging Engineer

Salinas, CA · Hybrid

$75K - $80K/hr

Destiny Packaging, a Bunzl company, is seeking a Flexible Packaging Engineer to act as a technical ... Travel as needed, sometimes with overnight stays Destiny Packaging's salary range is $75-80k plus ...

Bunzl

Flexible Packaging Engineer

Salinas, CA · On-site

Destiny Packaging, a Bunzl company, is seeking a Flexible Packaging Engineer to act as a technical ... Travel as needed, sometimes with overnight stays Destiny Packaging's salary range is $75-80k plus ...

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Overnight Principal Packaging Engineer information

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$74K

$147.2K

$212.5K

How much do overnight principal packaging engineer jobs pay per year?

As of Jul 20, 2026, the average yearly pay for overnight principal packaging engineer in the United States is $147,220.00, according to ZipRecruiter salary data. Most workers in this role earn between $118,500.00 and $173,000.00 per year, depending on experience, location, and employer.
What cities are hiring for Overnight Principal Packaging Engineer jobs? Cities with the most Overnight Principal Packaging Engineer job openings:
What are the most commonly searched types of Principal Packaging Engineer jobs? The most popular types of Principal Packaging Engineer jobs are:
What states have the most Overnight Principal Packaging Engineer jobs? States with the most job openings for Overnight Principal Packaging Engineer jobs include:
Overnight Principal Packaging Engineer jobs near you
Infographic showing various Overnight Principal Packaging Engineer job openings in the United States as of July 2026, with employment types broken down into 95% Full Time, 2% Part Time, and 3% Contract. Highlights an 87% Physical, 4% Hybrid, and 9% Remote job distribution, with an average salary of $147,220 per year, or $70.8 per hour.
Photonic Packaging Engineer, Principal

Photonic Packaging Engineer, Principal

Astera Labs

San Jose, CA • On-site

$205K - $255K/yr

Full-time

Posted 23 hours ago

Job description

Astera Labs (NASDAQ: ALAB) provides rack-scale AI infrastructure through purpose-built connectivity solutions. By collaborating with hyperscalers and ecosystem partners, Astera Labs enables organizations to unlock the full potential of modern AI. Astera Labs' Intelligent Connectivity Platform integrates CXL®, Ethernet, NVLink, PCIe®, and UALink™ semiconductor-based technologies with the company's COSMOS software suite to unify diverse components into cohesive, flexible systems that deliver end-to-end scale-up, and scale-out connectivity. The company's custom connectivity solutions business complements its standards-based portfolio, enabling customers to deploy tailored architectures to meet their unique infrastructure requirements. Discover more at www.asteralabs.com.
We are seeking a visionary and technically strong Photonic Packaging Engineer, Principal to lead the design, development, and productization of advanced packaging solutions for advanced optics. This role will drive the intersection of photonics, high-speed electronics, thermal management, and mechanical integration to enable next-generation data center and networking platforms.
You will guide a multidisciplinary team through all phases of product realization-from concept and design through manufacturing scale-up-working closely with silicon photonics, electrical packaging, systems, and supply chain teams to achieve world-class optical and electrical performance.
Key Responsibilities
  • Lead the end-to-end development of photonic packaging strategies for Silicon Photonics Modules, including EIC/PIC co-packaging, optical coupling, fiber attach, and thermal and mechanical design.
  • Define technical requirements and package architectures that balance performance, manufacturability, and cost with compatibility with established electronic packaging flows.
  • Collaborate with IC packaging, optical connector, and silicon photonics teams to achieve co-design optimization
  • Build and mentor a high-performing team of packaging engineers and scientists.
  • Drive supplier engagement and technology partnerships for packaging partnerships and innovations.
  • Oversee failure analysis, reliability testing, and yield improvement efforts.
  • Contribute to the long-term package technology roadmap for advanced optical integration and scalability with ALAB's signal connectivity portfolio.
Qualifications
  • Ph.D. or M.S. in Electrical Engineering, Physics, Materials Science, Mechanical Engineering, or related field.
  • 10+ years of experience in photonic packaging, optical transceivers, or advanced semiconductor packaging.
  • Proven expertise in high-speed optical/electrical packaging, thermal management, and precision optomechanical design.
  • Deep understanding of optoelectronic package integration
  • Track record of leading complex hardware from R&D through high-volume manufacturing.
  • Strong program management and cross-functional leadership skills.
  • Excellent communication, negotiation, and organizational abilities.
Preferred Experience
  • Experience with silicon photonics integrated devices
  • Familiarity with advanced packaging optics trends and data center network architectures.
  • Background in contract manufacturing, vendor qualification, and global supply chain management.

Salary range is $205,000 to $255,000 depending on experience, level, and business need. This role may be eligible for discretionary bonus, incentives and benefits.
We know that creativity and innovation happen more often when teams include diverse ideas, backgrounds, and experiences, and we actively encourage everyone with relevant experience to apply, including people of color, LGBTQ+ and non-binary people, veterans, parents, and individuals with disabilities.

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