Maintain, repair, upgrade, and monitor wafer fabrication equipment in Metrology (4-point probe, Atomic Force Microscopy, CDSEM, Film Thickness measurement tools, Defect inspection tools, etc.) * The ...
Maintain, repair, upgrade, and monitor wafer fabrication equipment in Metrology (4-point probe, Atomic Force Microscopy, CDSEM, Film Thickness measurement tools, Defect inspection tools, etc.) * The ...
Maintain, repair, upgrade, and monitor wafer fabrication equipment in Metrology (4-point probe, Atomic Force Microscopy, CDSEM, Film Thickness measurement tools, Defect inspection tools, etc.) * The ...
Maintain, repair, upgrade, and monitor wafer fabrication equipment in Metrology (4-point probe, Atomic Force Microscopy, CDSEM, Film Thickness measurement tools, Defect inspection tools, etc.) * The ...
Experience in optical microscopy, confocal microscopy, slide scanner, multiphoton in vivo experiments, TIRF, spinning disk confocal, and atomic force microscopy. * Knowledge in designing imaging ...
Experience in optical microscopy, confocal microscopy, slide scanner, multiphoton in vivo experiments, TIRF, spinning disk confocal, and atomic force microscopy. * Knowledge in designing imaging ...
Experience in optical microscopy, confocal microscopy, slide scanner, multiphoton in vivo experiments, TIRF, spinning disk confocal, and atomic force microscopy. * Knowledge in designing imaging ...
Experience in optical microscopy, confocal microscopy, slide scanner, multiphoton in vivo experiments, TIRF, spinning disk confocal, and atomic force microscopy. * Knowledge in designing imaging ...
Experience in optical microscopy, confocal microscopy, slide scanner, multiphoton in vivo experiments, TIRF, spinning disk confocal, and atomic force microscopy. * Knowledge in designing imaging ...
Experience in optical microscopy, confocal microscopy, slide scanner, multiphoton in vivo experiments, TIRF, spinning disk confocal, and atomic force microscopy. * Knowledge in designing imaging ...
Experience in optical microscopy, confocal microscopy, slide scanner, multiphoton in vivo experiments, TIRF, spinning disk confocal, and atomic force microscopy. * Knowledge in designing imaging ...
Experience in optical microscopy, confocal microscopy, slide scanner, multiphoton in vivo experiments, TIRF, spinning disk confocal, and atomic force microscopy. * Knowledge in designing imaging ...
Postdoctoral Scholar
San Marcos, TX · On-site
$60K/yr
The successful candidate will have access to shared research facilities including X-ray diffraction, scanning electron microscopy, atomic force microscopy, and cryogenic measurement systems.
Postdoctoral Scholar
San Marcos, TX · On-site
$60K/yr
The successful candidate will have access to shared research facilities including X-ray diffraction, scanning electron microscopy, atomic force microscopy, and cryogenic measurement systems.
Overnight Atomic Force Microscopy information
What is the difference between Overnight Atomic Force Microscopy vs Overnight Scanning Electron Microscope Operator?
| Aspect | Overnight Atomic Force Microscopy | Overnight Scanning Electron Microscope Operator |
|---|---|---|
| Credentials | Typically requires a degree in physics, materials science, or engineering; specialized training in AFM techniques | Requires a degree in physics, materials science, or related fields; training in SEM operation and sample preparation |
| Work Environment | Laboratory settings with cleanroom conditions; often involves detailed surface analysis | Laboratories or industrial facilities; focuses on imaging and analyzing samples with SEM |
| Industry Usage | Research institutions, nanotechnology, materials development | Manufacturing, quality control, research labs |
Both roles involve advanced microscopy techniques, require similar educational backgrounds, and are used in research and industrial settings. The main difference lies in the specific equipment operated and the type of analysis performed, with AFM focusing on surface topography at the nanoscale and SEM providing detailed imaging of sample morphology.
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Full-time
This job post has expired today. Applications are no longer accepted.
Job description
Primary Responsibilities:
Qualifications:
NXPis an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.
More information about NXP in the United States...
NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.
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- The candidate(s) selected will be responsible for performing scheduled and unscheduled maintenance in the ATMC Photo/Metro/AMHS Equipment area.
- Maintain, repair, upgrade, and monitor wafer fabrication equipment in Metrology (4-point probe, Atomic Force Microscopy, CDSEM, Film Thickness measurement tools, Defect inspection tools, etc.)
- The tasks include, but are not limited to, troubleshooting and repair of electrical/electronic systems, pneumatic and mechanical systems, scheduled maintenance, consumable changes, and various other activities relevant to the success of the area.
- Complete documentation and train others on equipment maintenance.
- While performing the duties of this job, the applicant will be required to communicate effectively using both written and verbal skills
- The applicant will also be required to stand for long periods of time (up to 12 hours) and should be physically able to do so in addition to occasionally stooping and or crawling in confined spaces
- The applicant must be able to lift and carry objects up to 50 pounds.
Qualifications:
- Education Requirements: AS, AAS in electronics or other industrial engineering, or related is preferred. Education requirements can be satisfied by equivalent experience.
- Specific knowledge of the Maintenance job functions are required. Minimum of 8 years of experience in the semiconductor industry.
- AA degree in Electronics or related discipline and 5 years technical maintenance experience, or an equivalent combination of education and experience may be acceptable.
- Minimum 5 years of experience with the Metrology/Defect area.
- Excellent verbal and written communication skills and demonstrate excellent problem-solving skills
- Solid understanding of both SPC and FDC and work to improve overall equipment performance based on these types of controls
- Problem solving skills and have excellent interaction and communication with all Operations and Engineering personnel
- Ability to interface with other internal and external groups to ensure all safety, performance, and reliability requirements are satisfied
NXPis an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.
More information about NXP in the United States...
NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.
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