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Oregon Wafer Assembly Process Engineer Jobs (NOW HIRING)

Apple

Process Engineer

San Francisco, CA · On-site

In this role, you will own the process development of New Product Introduction, architecting new ... Expert-level knowledge in assembly steps: wafer thinning, wafer dicing, die attach (including flip ...

Element Solutions Inc

Process Engineer II

Fremont, CA · On-site

$78K - $118K/yr

... wafer fabrication processes for enhanced efficiency and performance Semiconductor Assembly ... Under the guidance of our Engineering Manager, you'll be the go-to person for keeping our key ...

Thomas Built Buses, Inc.

$100 - $125/hr

Inside the Role Corporate Manufacturing Engineering is seeking an experienced and highly motivated Manufacturing Assembly Process Engineer III to serve as a technical leader and mentor within the ...

Forge Nano, Inc.

Wafer Process Engineer

Thornton, CO · On-site

$80 - $100/hr

... a Wafer Process Engineer to develop and sustain our atomic layer deposition (ALD) TEPHRA cluster ... Perform tasks relating to assembly and maintenance of vacuum systems and thin film equipment. Learn ...

Element Solutions Inc

Process Engineer II

Fremont, CA · On-site

$78K - $118K/yr

... wafer fabrication processes for enhanced efficiency and performance Semiconductor Assembly ... Under the guidance of our Engineering Manager, you'll be the go-to person for keeping our key ...

Mesh Optical Technologies

Process Engineer

Gardena, CA · On-site

$90K - $140K/yr

Hands-on experience in semiconductor packaging, assembly, or advanced manufacturing environments ... Familiarity with equipment and processes such as flip-chip bonding, wafer processing, plasma ...

Element Solutions

Process Engineer II

Fremont, CA · On-site

$78K - $118K/yr

... wafer fabrication processes for enhanced efficiency and performance Semiconductor Assembly ... Under the guidance of our Engineering Manager, you'll be the go-to person for keeping our key ...

Actalent

Senior Process Engineer

Carlsbad, CA · On-site

$106K - $138K/yr

... assembly. * Proven experience with Die-to-Wafer or Wafer-Level Packaging processes. * Thermo ... Bachelor's degree in Engineering, Physics, Materials Science, or a related field preferred.

Daimler Truck North America LLC.

$100 - $125/hr

Inside the Role Corporate Manufacturing Engineering is seeking an experienced and highly motivated Manufacturing Assembly Process Engineer III to serve as a technical leader and mentor within the ...

Mesh Optical Technologies

Process Engineer

Gardena, CA · On-site

$90K - $140K/yr

Hands-on experience in semiconductor packaging, assembly, or advanced manufacturing environments ... Familiarity with equipment and processes such as flip-chip bonding, wafer processing, plasma ...

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Oregon Wafer Assembly Process Engineer information

See salary details

$49.5K

$92K

$142.5K

How much do oregon wafer assembly process engineer jobs pay per year?

As of Sep 9, 2026, the average yearly pay for oregon wafer assembly process engineer in the United States is $92,018.00, according to ZipRecruiter salary data. Most workers in this role earn between $74,500.00 and $103,000.00 per year, depending on experience, location, and employer.

What is the difference between Oregon Wafer Assembly Process Engineer vs Oregon Semiconductor Equipment Technician?

AspectOregon Wafer Assembly Process EngineerOregon Semiconductor Equipment Technician
CredentialsBachelor's in Engineering or related field, technical certificationsTechnical diploma or associate degree, certifications in equipment maintenance
Work EnvironmentDesigning, developing, and optimizing wafer assembly processes in cleanroom settingsMaintaining, troubleshooting, and repairing semiconductor manufacturing equipment
Industry UsageUsed in process development and process engineering teamsCommonly employed in manufacturing and maintenance departments

The Oregon Wafer Assembly Process Engineer focuses on developing and improving wafer assembly processes, while the Oregon Semiconductor Equipment Technician specializes in maintaining and repairing manufacturing equipment. Both roles require technical skills and certifications relevant to semiconductor manufacturing, but they differ in daily responsibilities and focus areas within the industry.

What are popular job titles related to Oregon Wafer Assembly Process Engineer jobs?

For Oregon Wafer Assembly Process Engineer jobs, the most frequently searched job titles are:

Infographic showing various Oregon Wafer Assembly Process Engineer job openings in the United States as of September 2026, with employment types broken down into 1% As Needed, 79% Full Time, 16% Part Time, 3% Contract, and 1% Nights. Highlights an 90% Physical, 2% Hybrid, and 8% Remote job distribution, with an average salary of $92,018 per year, or $44.2 per hour.

Process Engineer

San Francisco, CA • On-site

Apple
Computer and Electronic Product Manufacturing • 10K+ employees
Learn more about Appleexternal

Full-time

Re-posted 15 days ago

Apple rating

8.1

Company rating: 8.1 out of 10

Based on 684 frontline employees who took The Breakroom Quiz

6th of 30 rated technology retailers

Job description

Join Apple's ATG Sensing Group as a Senior Electronic Packaging Engineer to drive the development of innovative module packaging solutions for new consumer products. In this role, you will own the process development of New Product Introduction, architecting new concepts and defining process flows to ensuring successful high-volume manufacturing with external OSAT partners. You will work at the intersection of design, materials science, and manufacturing, collaborating with internal cross-functional teams and external suppliers to solve complex integration challenges and successfully bring next-generation sensing technologies to market. This position requires a candidate with a proven track record of shipping products, deep technical expertise in assembly processes, and strong leadership skills.
Description
Apple's ATG Sensing Group is looking for a senior level electronic packaging engineer to work on developing exciting new products. This role will be responsible for providing module packaging solutions to be integrated in systems for consumer markets. This role will be working with internal device design, product design, operation, as well as external suppliers to develop and deploy new packaging technologies. We are looking for individuals who are innovative as well as experienced in a high volume manufacturing environment.
A successful candidate should have a proven track record of successfully shipped products with 3rd party manufacturing partners. Candidate must demonstrate the ability to lead cross functional teams to success. Candidate should be experienced with operating independently as well as collaboratively in a complex multi-disciplinary development program.
Minimum Qualifications
BS and 10 +years of relevant industry experience.
Preferred Qualifications
Understand and keep up-to-date with industry landscape on relevant technologies.
Strong interpersonal and team-building skills.
Proven track record of work with OSAT to bring up a product from conceptual to MP stage.
Strong materials science and failure analysis (FA) knowledge related to assembly chip-packaging interactions and reliability failures.
Proficient in applying DOE vs. Hypothesis tool for root cause analysis.
Excellent written and verbal communication skills.
In-depth knowledge in the area of semiconductor sensor packaging technologies.
Expert-level knowledge in assembly steps: wafer thinning, wafer dicing, die attach (including flip chip and multi-die stacking), wirebond, encapsulation and underfill, SMT, transfer/compression molding, singulation, and wafer level packaging processes.
Working level knowledge in wafer bumping, RDL, and TSV.
Experience in using simulation to guide process setup.
Experience in using AI to support process development.
Experience in capacitive sensing module packaging.
Experience in customer facing cosmetic packaging.

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About Apple

Sourced by ZipRecruiter

Imagine what you could do here! At Apple, new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish. Dynamic, intelligent people and inspiring, innovative technologies are the norm here. The people who work here have reinvented entire industries with all Apple Hardware products. The same real passion for innovation that goes into our products also applies to our practices strengthening our dedication to leave the world better than we found it.

Industry

Computer and electronic product manufacturing

Company size

10,000+ Employees

Headquarters location

Cupertino, CA, US

Year founded

1976

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