Position Summary:The Backend Process Engineer -InPWafer Fab positionis responsible fordevelopment, optimization, and manufacturing support of backend wafer fabrication processes for Indium Phosphide (InP)-based photonic devices, including DFB lasers, Semiconductor Optical Amplifiers (SOAs), and Gain Chip products. This role provides technical ownership of critical backend modules including wafer lapping/thinning, n-side metallization, rapid thermal annealing (RTA),andautomated optical inspection (AOI). The position also supports singulation, optical coatings, reliability readiness, and packaging interfaces, with a strong focus on yield, defect reduction, and manufacturing stability.
Backend Process Ownership and Optimization (35%):
Yield Improvement, Defect Reduction, and AOI Control (25%):
Singulation,OpticalCoatings, and Packaging Interface Support (20%):
New Product Introduction and Technology Support (10%):
Documentation, Process Control, and Manufacturing Support (10%)
Bachelor's degree or higher in Chemical Engineering, Materials Science, Electrical Engineering, Physics, or a related field
The intent of this job description is to describe the major duties and responsibilities performed by incumbents of this job. Incumbents maybe requiredto perform job-related tasks other than those specifically included in this description.
All duties and responsibilities are essentialjobfunctions and requirements and are subject topossible modificationtoreasonably accommodateindividuals with disabilities.
A reasonable estimate of the pay range for this position is $100,000 - $135,000. There are several factors taken into consideration indeterminingbase salary, including but not limited to: job-related qualifications, skills,educationand experience, as well as job location and the value of other elements of an employee's total compensation package.
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