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Module Development Engineer Jobs in Tolleson, AZ

The Role and Impact Join Intel as a Packaging Module Development Engineer in Laser Assembly and play a pivotal role in shaping the future of semiconductor packaging technologies. This position offers ...

AWS infra engineer Job Location: Phoenix AZ Job Type: Contract * Strong understanding and ... Terraform module development Should have built AWS services modules and provisioned the services on ...

Terraform module development Should have built AWS services modules and provisioned the services on AWS through terraform Mandatory Skills : AWS Lambda,AWS S3,AWS Database Service,AWS Infra Services ...

Terraform module development Should have built AWS services modules and provisioned the services on AWS through terraform Mandatory Skills : AWS Lambda,AWS S3,AWS Database Service,AWS Infra Services ...

... module development Should have built AWS services modules and provisioned the services on AWS through terraform Mandatory Skills : AWS Lambda,AWS S3,AWS Database Service,AWS Infra Services,AWS VPC ...

Own product engineering execution for advanced power modules from NPI through high-volume ... Working knowledge of new product development, qualification, and high-volume manufacturing transfer

Own product engineering execution for advanced power modules from NPI through high-volume ... Working knowledge of new product development, qualification, and high-volume manufacturing transfer

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Module Development Engineer information

See Tolleson, AZ salary details

$48.1K

$94.4K

$150.7K

How much do module development engineer jobs pay per year?

As of Jul 17, 2026, the average yearly pay for module development engineer in Tolleson, AZ is $94,427.00, according to ZipRecruiter salary data. Most workers in this role earn between $78,100.00 and $104,600.00 per year, depending on experience, location, and employer.

What is the difference between Module Development Engineer vs Hardware Design Engineer?

AspectModule Development EngineerHardware Design Engineer
Required CredentialsBachelor's or Master's in Electrical Engineering, Computer Engineering, or related fieldsBachelor's or Master's in Electrical Engineering, Computer Engineering, or related fields
Work EnvironmentDesign, develop, and test electronic modules and componentsDesign and develop electronic hardware and circuit layouts
Employer & Industry UsageElectronics, automotive, consumer electronics, telecommunicationsElectronics, consumer devices, industrial equipment, telecommunications

Both roles require similar educational backgrounds and are common in electronics and tech industries. The Module Development Engineer focuses on creating complete modules or subsystems, while the Hardware Design Engineer concentrates on designing individual hardware components and circuits. Understanding these distinctions helps job seekers target the right roles based on their skills and career goals.

What are the key skills and qualifications needed to thrive as a Module Development Engineer, and why are they important?

To thrive as a Module Development Engineer, you need a strong background in electrical or mechanical engineering, along with experience in module design, testing, and manufacturing processes. Familiarity with CAD software (such as AutoCAD or SolidWorks), simulation tools, and industry-specific standards or certifications (like ISO or Six Sigma) is typically required. Strong analytical thinking, problem-solving abilities, and effective teamwork skills help you excel in cross-functional environments. These competencies ensure high-quality module development, efficient collaboration, and adherence to industry standards for successful project delivery.

What are Module Development Engineers?

Module Development Engineers are professionals who design, develop, and optimize specific modules or components within larger engineering systems, often in industries like semiconductor manufacturing, automotive, or software development. Their work involves collaborating with cross-functional teams, conducting experiments, and integrating new technologies to improve module performance and reliability. They are responsible for troubleshooting issues, implementing design changes, and ensuring that modules meet technical specifications and quality standards.

What are some common challenges a Module Development Engineer faces when integrating new modules into existing systems?

Module Development Engineers often encounter challenges related to compatibility and seamless integration of new modules with legacy systems. Ensuring that new modules meet performance standards without disrupting current workflows requires careful planning and thorough testing. Collaborating closely with cross-functional teams, such as software developers and quality assurance, is essential to identify potential integration issues early. Strong communication skills and a proactive approach to troubleshooting help Module Development Engineers overcome these challenges effectively.
What cities near Tolleson, AZ are hiring for Module Development Engineer jobs? Cities near Tolleson, AZ with the most Module Development Engineer job openings:
ATD Experienced Laser Development Engineer

ATD Experienced Laser Development Engineer

Intel Corporation

Phoenix, AZ • On-site

Full-time

Medical, Retirement, PTO

Posted 10 days ago


Intel rating

8.7

Company rating: 8.7 out of 10

Based on 147 frontline employees who took The Breakroom Quiz

11th of 143 rated electronics manufacturers


Job description

Job Details:
Job Description:
The Role and Impact
Join Intel as a Packaging Module Development Engineer in Laser Assembly and play a pivotal role in shaping the future of semiconductor packaging technologies. This position offers a unique opportunity to contribute to the development of cutting-edge processes and equipment that enable Intel to stay at the forefront of innovation. Your work will directly impact the performance, quality, and reliability of Intel's assembly and packaging solutions, driving advancements in technology that address the dynamic needs of the semiconductor industry. Through technical expertise and collaboration with cross-functional teams, you will help Intel achieve its mission of delivering world-class packaging solutions.
Key Responsibilities
- Design and develop laser assembly packaging processes and equipment to enable next-generation packaging technologies.
- Optimize manufacturing processes to meet stringent quality, reliability, cost, yield, productivity, and manufacturability requirements.
- Develop process and equipment specifications using Design of Experiments (DOE) and data analysis principles.
- Oversee the manufacturability of physical layout designs and manage the full cycle of packaging processes, procedures, and flows.
- Establish laser process specifications and collaborate with suppliers to meet quality and performance standards.
- Innovate new techniques, tools, and quality screens for early identification of potential packaging quality and reliability issues.
- Set laser process reliability requirements based on a strong understanding of failure mechanisms, influencing design, material selection, and process development.
- Drive standardization in qualification procedures, manufacturing quality systems, and processes while collaborating with engineering teams to meet critical milestones.
- Influence material selection, process design, and equipment development to align with customer needs and product requirements.
Qualifications:
Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
Minimum Qualifications:
  • Bachelor's degree in Physics, Mechanical Engineering, Optical Engineering, or a related STEM field with 4+ years of industry experience.
  • -OR-Master's degree in Physics, Mechanical Engineering, Optical Engineering, or a related STEM field with 3+ years of industry experience.
  • -OR- PhD in Engineering, Physics, Mechanical Engineering, Optical Engineering, or a related STEM field with 6 months+ of Industry experience.

Industry Experience should include the following:
- Proficiency in Statistical Process Control (SPC), Design of Experiments (DOE), and process characterization techniques.
- Demonstrated experience applying engineering principles to develop innovative laser solutions for packaging processes and equipment.
- Strong analytical skills with expertise in data analysis, risk assessment, and problem-solving methodologies.
Preferred Qualifications:
- Hands-on experience in a technology manufacturing environment or semiconductor packaging processes and troubleshooting laser based equipment/systems.
- Familiarity with equipment adjustment, process characterization, and manufacturability in semiconductor or electronics assembly.
- Demonstrated ability to collaborate with cross-functional teams and deliver results in time-sensitive projects.
- Capability to apply Data Science and Statistics tools (Python, Numpy/Pandas, SQL, JMP, Minitab) to manipulate large complex data sets.
We invite you to bring your expertise, creativity, and passion for technology innovation to Intel. Join us in driving the future of semiconductor packaging and make a lasting impact on the technology landscape. Apply today.
Job Type:
Experienced Hire
Shift:
Shift 1 (United States of America)
Primary Location:
US, Arizona, Phoenix
Additional Locations:
Business group:
Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $115,110.00-219,550.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

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About Intel

Sourced by ZipRecruiter

Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth

Industry

Manufacturing

Company size

10,000+ Employees

Headquarters location

Santa Clara, CA, US

Year founded

1968