WATD Module Development Engineer
$148K - $209K/yr
Join the Wafer Assembly Technology Development Group (WATD) As a Module Development Engineer, you will play a key role in driving innovation and excellence within Intel's advanced semiconductor ...
$148K - $209K/yr
Join the Wafer Assembly Technology Development Group (WATD) As a Module Development Engineer, you will play a key role in driving innovation and excellence within Intel's advanced semiconductor ...
$148K - $209K/yr
Join the Wafer Assembly Technology Development Group (WATD) As a Module Development Engineer, you will play a key role in driving innovation and excellence within Intel's advanced semiconductor ...
The Role and Impact As a Senior HBI Module Development Engineer for Die-to-Wafer Hybrid Bonding (HBI), you will drive equipment development and manufacturability for next-generation hybrid bonding ...
New
The Role and Impact As a Senior HBI Module Development Engineer for Die-to-Wafer Hybrid Bonding (HBI), you will drive equipment development and manufacturability for next-generation hybrid bonding ...
New
The Role and Impact As a Senior HBI Module Development Engineer for Die-to-Wafer Hybrid Bonding (HBI), you will drive equipment development and manufacturability for next-generation hybrid bonding ...
New
The Role and Impact As a Senior HBI Module Development Engineer for Die-to-Wafer Hybrid Bonding (HBI), you will drive equipment development and manufacturability for next-generation hybrid bonding ...
New
$148K - $209K/yr
Join the Wafer Assembly Technology Development Group (WATD) As a Module Development Engineer, you will play a key role in driving innovation and excellence within Intel's advanced semiconductor ...
$148K - $209K/yr
Join the Wafer Assembly Technology Development Group (WATD) As a Module Development Engineer, you will play a key role in driving innovation and excellence within Intel's advanced semiconductor ...
The Role and Impact As a Senior HBI Module Development Engineer for Die-to-Wafer Hybrid Bonding (HBI), you will drive equipment development and manufacturability for next-generation hybrid bonding ...
New
The Role and Impact As a Senior HBI Module Development Engineer for Die-to-Wafer Hybrid Bonding (HBI), you will drive equipment development and manufacturability for next-generation hybrid bonding ...
New
Join the Wafer Assembly Technology Development Group (WATD) As a Module Development Engineer, you will play a key role in driving innovation and excellence within Intel's advanced semiconductor ...
Join the Wafer Assembly Technology Development Group (WATD) As a Module Development Engineer, you will play a key role in driving innovation and excellence within Intel's advanced semiconductor ...
Join the Wafer Assembly Technology Development Group (WATD) As a Module Development Engineer, you will play a key role in driving innovation and excellence within Intel's advanced semiconductor ...
Join the Wafer Assembly Technology Development Group (WATD) As a Module Development Engineer, you will play a key role in driving innovation and excellence within Intel's advanced semiconductor ...
The Role and Impact As a Senior HBI Module Development Engineer for Die-to-Wafer Hybrid Bonding (HBI), you will drive equipment development and manufacturability for next-generation hybrid bonding ...
New
The Role and Impact As a Senior HBI Module Development Engineer for Die-to-Wafer Hybrid Bonding (HBI), you will drive equipment development and manufacturability for next-generation hybrid bonding ...
New
The Role and Impact As a Senior HBI Module Development Engineer for Die-to-Wafer Hybrid Bonding (HBI), you will drive equipment development and manufacturability for next-generation hybrid bonding ...
New
The Role and Impact As a Senior HBI Module Development Engineer for Die-to-Wafer Hybrid Bonding (HBI), you will drive equipment development and manufacturability for next-generation hybrid bonding ...
New
LTD Module Development Engineers are responsible for leading scientific research enabling the manufacture of innovative device architectures but not limited to: * Lead scientific research enabling ...
LTD Module Development Engineers are responsible for leading scientific research enabling the manufacture of innovative device architectures but not limited to: * Lead scientific research enabling ...
LTD Module Development Engineers are responsible for leading scientific research enabling the manufacture of innovative device architectures but not limited to: * Lead scientific research enabling ...
LTD Module Development Engineers are responsible for leading scientific research enabling the manufacture of innovative device architectures but not limited to: * Lead scientific research enabling ...
LTD Module Development Engineers are responsible for leading scientific research enabling the manufacture of innovative device architectures but not limited to: * Lead scientific research enabling ...
LTD Module Development Engineers are responsible for leading scientific research enabling the manufacture of innovative device architectures but not limited to: * Lead scientific research enabling ...
LTD Module Development Engineers are responsible for leading scientific research enabling the manufacture of innovative device architectures but not limited to: * Lead scientific research enabling ...
LTD Module Development Engineers are responsible for leading scientific research enabling the manufacture of innovative device architectures but not limited to: * Lead scientific research enabling ...
LTD Module Development Engineers are responsible for leading scientific research enabling the manufacture of innovative device architectures but not limited to: * Lead scientific research enabling ...
LTD Module Development Engineers are responsible for leading scientific research enabling the manufacture of innovative device architectures but not limited to: * Lead scientific research enabling ...
LTD Module Development Engineers are responsible for leading scientific research enabling the manufacture of innovative device architectures but not limited to: * Lead scientific research enabling ...
LTD Module Development Engineers are responsible for leading scientific research enabling the manufacture of innovative device architectures but not limited to: * Lead scientific research enabling ...
$133K - $255K/yr
Intel Foundry Module Development Engineers are responsible for leading scientific research enabling the manufacture of innovative device architecture but not limited to: * Led scientific research ...
$133K - $255K/yr
Intel Foundry Module Development Engineers are responsible for leading scientific research enabling the manufacture of innovative device architecture but not limited to: * Led scientific research ...
Working closely with internal engineering teams and external suppliers, this individual will lead process development efforts, optimize manufacturing capabilities, and contribute to technology ...
Working closely with internal engineering teams and external suppliers, this individual will lead process development efforts, optimize manufacturing capabilities, and contribute to technology ...
Technical expertise in module engineering or fab process/hardware technology development. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in ...
Technical expertise in module engineering or fab process/hardware technology development. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in ...
Portland, OR · On-site
$148K - $209K/yr
We are seeking an experienced Plasma Etch Process Development Engineer to join our advanced packaging team. The successful candidate will be responsible for developing, optimizing, and implementing ...
Portland, OR · On-site
$148K - $209K/yr
We are seeking an experienced Plasma Etch Process Development Engineer to join our advanced packaging team. The successful candidate will be responsible for developing, optimizing, and implementing ...
Lafayette, OR · On-site
$148K - $209K/yr
We are seeking an experienced Plasma Etch Process Development Engineer to join our advanced packaging team. The successful candidate will be responsible for developing, optimizing, and implementing ...
Lafayette, OR · On-site
$148K - $209K/yr
We are seeking an experienced Plasma Etch Process Development Engineer to join our advanced packaging team. The successful candidate will be responsible for developing, optimizing, and implementing ...
$51.7K - $61.7K
3% of jobs
$61.7K - $71.7K
4% of jobs
$71.7K - $81.7K
16% of jobs
$82.7K is the 25th percentile. Wages below this are outliers.
$81.7K - $91.7K
19% of jobs
The median wage is $95K / yr.
$91.7K - $101.7K
24% of jobs
$108.6K is the 75th percentile. Wages above this are outliers.
$101.7K - $111.8K
13% of jobs
$111.8K - $121.8K
6% of jobs
$121.8K - $131.8K
5% of jobs
$131.8K - $141.8K
3% of jobs
$141.8K - $151.8K
5% of jobs
$151.8K - $161.8K
1% of jobs
$51.7K
$101.4K
$161.8K
| Aspect | Module Development Engineer | Hardware Design Engineer |
|---|---|---|
| Required Credentials | Bachelor's or Master's in Electrical Engineering, Computer Engineering, or related fields | Bachelor's or Master's in Electrical Engineering, Computer Engineering, or related fields |
| Work Environment | Design, develop, and test electronic modules and components | Design and develop electronic hardware and circuit layouts |
| Employer & Industry Usage | Electronics, automotive, consumer electronics, telecommunications | Electronics, consumer devices, industrial equipment, telecommunications |
Both roles require similar educational backgrounds and are common in electronics and tech industries. The Module Development Engineer focuses on creating complete modules or subsystems, while the Hardware Design Engineer concentrates on designing individual hardware components and circuits. Understanding these distinctions helps job seekers target the right roles based on their skills and career goals.

$148K - $209K/yr
Full-time
Medical, Retirement, PTO
Posted 7 days ago
8.7
Based on 147 frontline employees who took The Breakroom Quiz
11th of 142 rated electronics manufacturers
Join the Wafer Assembly Technology Development Group (WATD)
As a Module Development Engineer, you will play a key role in driving innovation and excellence within Intel's advanced semiconductor packaging technology development. Your efforts will contribute to the design, optimization, and enablement of cutting-edge manufacturing processes, ensuring the successful integration of advanced technologies. By collaborating with cross-functional teams and external partners, you will help shape the technological roadmap, enabling next-generation device architectures and reinforcing Intel's leadership in semiconductor innovation. Your work will directly impact Intel's ability to meet product performance, yield, and reliability standards while advancing the boundaries of high-volume manufacturing capabilities.
Key Responsibilities
- Drive technology development and enablement for both high-volume manufacturing and future technologies.
- Lead the design and development of advanced manufacturing processes, including material selection, parameter optimization, equipment metrology, and system design.
- Perform feasibility studies and pathfinding activities to meet desired device specifications through simulations and practical engineering methods.
- Develop and implement technology roadmaps to guide future manufacturing needs and industry standards.
- Collaborate with equipment and material suppliers to design and implement enabling process technologies.
- Recommend and execute modifications to operational equipment to improve efficiency, scalability, and production output.
- Employ statistical process control, data analytics, and machine learning techniques to enhance process stability and enable continuous improvement.
- Optimize production efficiency, manufacturing techniques, and output for existing and new products.
- Partner with cross-functional teams to ensure process integration and alignment with project deliverables.
Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications
- Bachelor's degree in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related STEM discipline with 6+ years of relevant experience.
- OR Master's degree in the same fields with 4+ years of experience.
- OR PhD in the same fields with 2+ years of experience.
Experience listed above should be a combination of the following:
- Development methodologies, statistical process control, and/or data analytics.
- Wafer-level assembly, semiconductor equipment developing/processing, or advanced packaging technology development.
This position is not eligible for Intel Immigration Sponsorship
Preferred Qualifications
- Experience in wafer-level assembly, epoxy, mold materials, or related fields in advanced packaging.
- Demonstrated expertise in leading programs from early strategy formation through high-volume production.
- Recognized technical leadership with a proven track record of solving complex engineering challenges.
- Experience with advanced packaging technologies such as hybrid bonded interconnects, RDL-based packaging, or ultra-fine pitch solder connections.
- Strong collaboration skills with internal and external teams, including yield, operations, and supplier management.
Join Intel's mission to advance the future of semiconductor technology and make a lasting impact on a global scale. Apply now to bring your expertise and passion to our team.
Sourced by ZipRecruiter
Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth
Manufacturing
10,000+ Employees
Santa Clara, CA, US
1968