We are seeking a highly experienced Mixed-Signal IC Design Leader to join our growing team. In this ... Master's Degree (MEng) in Electrical Engineering or related field is required * A Ph.D. in ...
We are seeking a highly experienced Mixed-Signal IC Design Leader to join our growing team. In this ... Master's Degree (MEng) in Electrical Engineering or related field is required * A Ph.D. in ...
Recent Grad - Test Engineer/Test Technician
Edison, NJ ยท On-site
$50K - $150K/yr
... guide design decisions Qualifications: โข RF & mmWave testing (S-parameters, jitter, ENOB ... modeling for IC design โข Statistical analysis & data interpretation โข Programming: Python ...
Recent Grad - Test Engineer/Test Technician
Edison, NJ ยท On-site
$50K - $150K/yr
... guide design decisions Qualifications: โข RF & mmWave testing (S-parameters, jitter, ENOB ... modeling for IC design โข Statistical analysis & data interpretation โข Programming: Python ...
Nuclear I&C Design Lead
Manhattan, NY ยท On-site
A leading engineering firm is seeking an E&IC Design Supervisor to oversee the design and drafting of complex electrical and instrumentation systems. This role requires a Bachelor's degree in ...
Nuclear I&C Design Lead
Manhattan, NY ยท On-site
A leading engineering firm is seeking an E&IC Design Supervisor to oversee the design and drafting of complex electrical and instrumentation systems. This role requires a Bachelor's degree in ...
High-Speed Package Design Engineer
Murray Hill, NJ ยท On-site
$143.20K/yr
Nokia Bell Labs is seeking a High-Speed Package Design Engineer to drive the design, simulation, and validation of advanced IC packages for high-performance RF, photonics, and mixed-signal systems.
High-Speed Package Design Engineer
Murray Hill, NJ ยท On-site
$143.20K/yr
Nokia Bell Labs is seeking a High-Speed Package Design Engineer to drive the design, simulation, and validation of advanced IC packages for high-performance RF, photonics, and mixed-signal systems.
Design Engineer
New York, NY ยท On-site
What makes a Design Engineer different from a Product Designer? Both roles care deeply about craft ... This might mean growing into a world-class IC, owning a line of business, or leading teams.
Design Engineer
New York, NY ยท On-site
What makes a Design Engineer different from a Product Designer? Both roles care deeply about craft ... This might mean growing into a world-class IC, owning a line of business, or leading teams.
I&C Design Supervisor
Manhattan, NY ยท On-site
Job Overview We're seeking an E&IC Design Supervisor to lead the design and drafting of complex ... Coordinate with engineering, procurement, and field teams to ensure design integrity and ...
I&C Design Supervisor
Manhattan, NY ยท On-site
Job Overview We're seeking an E&IC Design Supervisor to lead the design and drafting of complex ... Coordinate with engineering, procurement, and field teams to ensure design integrity and ...
Design Engineer, Brand
New York, NY ยท Remote
$172K - $286K/yr
About the Role We're looking for a Design Engineer to own and elevate Ramp's brand experience on ... as an IC * Front-end fluency: you can prototype and build what you design in code (HTML/CSS/JS ...
Quick apply
Design Engineer, Brand
New York, NY ยท Remote
$172K - $286K/yr
About the Role We're looking for a Design Engineer to own and elevate Ramp's brand experience on ... as an IC * Front-end fluency: you can prototype and build what you design in code (HTML/CSS/JS ...
Design Engineer, Brand
New York, NY ยท On-site +1
$172K - $286K/yr
About the Role We're looking for a Design Engineer to own and elevate Ramp's brand experience on ... as an IC * Front-end fluency: you can prototype and build what you design in code (HTML/CSS/JS ...
Design Engineer, Brand
New York, NY ยท On-site +1
$172K - $286K/yr
About the Role We're looking for a Design Engineer to own and elevate Ramp's brand experience on ... as an IC * Front-end fluency: you can prototype and build what you design in code (HTML/CSS/JS ...
Principal SI/PI Design Engineer
$157.10K - $250.90K/yr
As an SI/PI Design Engineer, you will be an integral part of the Ciena engineering team and lead ... Familiar with package substrate technologies including 2.5-D IC and 3-D IC interposers * Problem ...
Principal SI/PI Design Engineer
$157.10K - $250.90K/yr
As an SI/PI Design Engineer, you will be an integral part of the Ciena engineering team and lead ... Familiar with package substrate technologies including 2.5-D IC and 3-D IC interposers * Problem ...
Principal SI/PI Design Engineer
New Providence, NJ ยท On-site
$157.10K - $250.90K/yr
As an SI/PI Design Engineer, you will be an integral part of the Ciena engineering team and lead ... Familiar with package substrate technologies including 2.5-D IC and 3-D IC interposers * Problem ...
Principal SI/PI Design Engineer
New Providence, NJ ยท On-site
$157.10K - $250.90K/yr
As an SI/PI Design Engineer, you will be an integral part of the Ciena engineering team and lead ... Familiar with package substrate technologies including 2.5-D IC and 3-D IC interposers * Problem ...
Principal SI/PI Design Engineer
$157.10K - $250.90K/yr
As an SI/PI Design Engineer, you will be an integral part of the Ciena engineering team and lead ... Familiar with package substrate technologies including 2.5-D IC and 3-D IC interposers * Problem ...
Principal SI/PI Design Engineer
$157.10K - $250.90K/yr
As an SI/PI Design Engineer, you will be an integral part of the Ciena engineering team and lead ... Familiar with package substrate technologies including 2.5-D IC and 3-D IC interposers * Problem ...
Optoelectronic IC Package Design Director
New Providence, NJ ยท On-site
$235.60K - $376.40K/yr
As Optoelectronic IC Package Design Director, you will be an integral part of the xPO engineering team and lead package development for custom in-house photonic, analog, and digital ICs, supporting ...
Optoelectronic IC Package Design Director
New Providence, NJ ยท On-site
$235.60K - $376.40K/yr
As Optoelectronic IC Package Design Director, you will be an integral part of the xPO engineering team and lead package development for custom in-house photonic, analog, and digital ICs, supporting ...
Optoelectronic IC Package Design Director
$235.60K - $376.40K/yr
As Optoelectronic IC Package Design Director, you will be an integral part of the xPO engineering team and lead package development for custom in-house photonic, analog, and digital ICs, supporting ...
Optoelectronic IC Package Design Director
$235.60K - $376.40K/yr
As Optoelectronic IC Package Design Director, you will be an integral part of the xPO engineering team and lead package development for custom in-house photonic, analog, and digital ICs, supporting ...
Optoelectronic IC Package Design Director
New Providence, NJ ยท On-site
$235.60K - $376.40K/yr
As Optoelectronic IC Package Design Director, you will be an integral part of the xPO engineering team and lead package development for custom in-house photonic, analog, and digital ICs, supporting ...
Optoelectronic IC Package Design Director
New Providence, NJ ยท On-site
$235.60K - $376.40K/yr
As Optoelectronic IC Package Design Director, you will be an integral part of the xPO engineering team and lead package development for custom in-house photonic, analog, and digital ICs, supporting ...
This includes working with various global teams in IC design, verification, validation, Product Engineering, manufacturing, and quality to characterize, qualify, and set up manufacturing flows for ...
This includes working with various global teams in IC design, verification, validation, Product Engineering, manufacturing, and quality to characterize, qualify, and set up manufacturing flows for ...
3D Heterogeneous Integration Design Enablement Engineer (2026 New College Graduate)
New York, NY ยท On-site
$79.10K - $145.80K/yr
... IC) design to be manufacturable. * Advanced packaging liaison to the DM and PDK (Process Design Kit ... Education - PhD with completed defended thesis in Electrical Engineering and Materials Science or ...
3D Heterogeneous Integration Design Enablement Engineer (2026 New College Graduate)
New York, NY ยท On-site
$79.10K - $145.80K/yr
... IC) design to be manufacturable. * Advanced packaging liaison to the DM and PDK (Process Design Kit ... Education - PhD with completed defended thesis in Electrical Engineering and Materials Science or ...
Senior Engineer II - Test
Hauppauge, NY ยท On-site
This includes working with various global teams in IC design, verification, validation, Product Engineering, manufacturing, and quality to characterize, qualify, and set up manufacturing flows for ...
Senior Engineer II - Test
Hauppauge, NY ยท On-site
This includes working with various global teams in IC design, verification, validation, Product Engineering, manufacturing, and quality to characterize, qualify, and set up manufacturing flows for ...
Senior Firmware Engineer
$101.50K - $162.10K/yr
Design, Develop and Debug embedded software for driving Photonic IC's. * Design and develop ... Review code developed by other engineers and provide feedback to ensure best practices.
Senior Firmware Engineer
$101.50K - $162.10K/yr
Design, Develop and Debug embedded software for driving Photonic IC's. * Design and develop ... Review code developed by other engineers and provide feedback to ensure best practices.
Senior Firmware Engineer
New Providence, NJ ยท On-site
$101.50K - $162.10K/yr
Embedded Software Engineer As the global leader in high-speed connectivity, Ciena is committed to a ... Design, Develop and Debug embedded software for driving Photonic IC's. * Design and develop ...
Senior Firmware Engineer
New Providence, NJ ยท On-site
$101.50K - $162.10K/yr
Embedded Software Engineer As the global leader in high-speed connectivity, Ciena is committed to a ... Design, Develop and Debug embedded software for driving Photonic IC's. * Design and develop ...
Senior Firmware Engineer
New Providence, NJ ยท On-site
$101.50K - $162.10K/yr
Design, Develop and Debug embedded software for driving Photonic IC's. * Design and develop ... Review code developed by other engineers and provide feedback to ensure best practices.
Senior Firmware Engineer
New Providence, NJ ยท On-site
$101.50K - $162.10K/yr
Design, Develop and Debug embedded software for driving Photonic IC's. * Design and develop ... Review code developed by other engineers and provide feedback to ensure best practices.
Mmwave Ic Design Engineer information
See Borough of Queens, NY salary details
$42.3K - $53.5K
2% of jobs
$53.5K - $64.6K
11% of jobs
$70.6K is the 25th percentile. Wages below this are outliers.
$64.6K - $75.8K
23% of jobs
The median wage is $83K / yr.
$75.8K - $87K
22% of jobs
$87K - $98.2K
17% of jobs
$98.5K is the 75th percentile. Wages above this are outliers.
$98.2K - $109.4K
9% of jobs
$109.4K - $120.6K
6% of jobs
$120.6K - $131.8K
3% of jobs
$131.8K - $143K
3% of jobs
$143K - $154.2K
2% of jobs
$154.2K - $165.4K
1% of jobs
$42.3K
$92K
$165.4K
How much do mmwave ic design engineer jobs pay per year?
What are the key skills and qualifications needed to thrive as a Mmwave IC Design Engineer, and why are they important?
What are some common challenges faced by mmWave IC Design Engineers when working on high-frequency circuit design?
What does a mmWave IC Design Engineer do?
What is the difference between Mmwave Ic Design Engineer vs RFIC Design Engineer?
| Aspect | Mmwave Ic Design Engineer | RFIC Design Engineer |
|---|---|---|
| Required Credentials | Bachelor's/Master's in Electrical Engineering, RF or Microwave specialization | Bachelor's/Master's in Electrical Engineering, RF or Microwave specialization |
| Work Environment | Semiconductor companies, telecom, aerospace | Semiconductor companies, wireless communication, telecom |
| Industry Usage | Designing millimeter-wave integrated circuits for 5G, radar, satellite | Designing radio frequency integrated circuits for wireless devices |
Both roles focus on RF and microwave circuit design, often requiring similar educational backgrounds. However, Mmwave Ic Design Engineers specialize in millimeter-wave frequencies used in 5G and radar, while RFIC Design Engineers work across a broader range of RF frequencies for wireless communication. The roles overlap in skills and work environment but differ in specific frequency applications and project focus.
Full-time
This job post hasย expired today.ย Applications are no longer accepted.
Job description
We are seeking a highly experienced Mixed-Signal IC Design Leader to join our growing team. In this role, you will be the technical lead in the design and development of cutting-edge mixed-signal ICs. You will be involved in the technical aspects of the IC design and development, from concept through to production. This is a hands-on technical position that requires in-depth technical expertise, and the ability to work in a team of highly experienced engineers to accomplishing the goals.
Key Responsibilities:
- Design and development of mixed-signal ICs for cutting edge AI and Cloud Computing systems
- Ownership of the full design cycle, including architecture definition, block-level design, simulation, verification, layout and evaluation
- Drive high-speed interconnect design, including PAM4 SerDes >112Gbps in bulk CMOS and FinFET
- Design and optimization of Fractional-N synthesizers, multi-phase clock generation, and analog building blocks (e.g., Charge Pumps, Power Control)
- Implement and verify high-speed interconnects, Equalizers (CTLE/FFE/DFE, sample/hold), and other key components
- Collaborate with cross-functional teams to ensure timely project execution and design tape-outs
- Stay updated with the latest trends and technologies in mixed-signal IC design and apply them to improve project outcomes
- Occasional travel to the Bay Area (
- 10+ years of hands-on experience in CMOS Mixed-Signal IC Design
- Proven expertise in designing high-speed interconnects, Fractional-N synthesizers, PAM4 SerDes (>112Gbps), Equalizers, and multi-phase clock generation
- Strong background in analog and digital mixed-signal design, including charge pumps, power control, and other analog building blocks
- Strong communication, leadership, and project management skills
- Master's Degree (MEng) in Electrical Engineering or related field is required
- A Ph.D. in Electrical Engineering, Computer Engineering or a related field is preferred
- Experience with bulk CMOS and FinFET technologies.
- Ability to drive innovation and implement new design methodologies.
- Experience working in fast-paced environments with a strong track record of delivering high-quality designs on time.
- Competitive salary
- Stock options plan
- Flex time off
- Health benefits
AttoTude is an equal opportunity employer. We're committed to building a diverse and inclusive workplace and providing equal employment opportunities to all applicants and employees. We do not discriminate on the basis of race, color, religion, sex, sexual orientation, gender identity or expression, national origin, age, disability, veteran status, or any other legally protected characteristic.
Annual Salary Range