Microwave Jobs (NOW HIRING)

Please note this position supports our Weekend Night Shift working Friday, Saturday and Sunday from 3:00PM to 3:00AM. You will work 36 Hours and be paid for 40 Hours plus earn a 15% pay premium.
See what you're missing. Our employees work on the world's most advanced electronics - from detecting threats for F-35 pilots to illuminating the night for soldiers. Spanning air, land, sea, and space, we are developing the technology of tomorrow, delivered today. Drawing strength from our differences, we're innovating for the future. And you can, too. Our flexible work environment provides you a chance to change the world without giving up your personal life. We put our customers first - exemplified by our mission: "We Protect Those Who Protect Us®." Sound like a team you want to be a part of? Come build your career with BAE Systems.
Electronic Combat Solutions (ECS) has technology, engineering and program teams that educate and mentor colleagues to deliver leading Electronic Warfare capabilities. We welcome all those who have big ideas, crave innovation, want to drive fielding velocity, and have the passion to bring the warfighter home safe.
The selected individual will fabricate and/or modify complex micro-integrated circuit modules or microwave/RF integrated circuit modules and sub-assemblies by following specific instructions, such as for wire and ribbon bonding utilizing various manual and automatic bonding machines or using an MRSI microwave component automated pick and place machine. Must be familiar with substrate attach (duroid/ceramic), MMICs, IC's, caps, diodes and resistors, soldering skills and eutectic die attach. Must be familiar with lamination presses, bladder bag ovens and sheet epoxies (mainly with the focus of attaching substrates to modules/housings). Must be familiar with working with a wide variety of adhesives and epoxy's. Must be familiar with operating an MRSI 505 and 605. Must be able to work with a microscope for an entire shift. Can fabricate and/or modify complex microwave/RF integrated circuit modules and sub-assemblies. Must be familiar with MIL-STD-883 and working with bonding complex microwave modules.
About BAE Systems Electronic Systems
BAE Systems, Inc. is the U.S. subsidiary of BAE Systems plc, an international defense, aerospace and security company which delivers a full range of products and services for air, land and naval forces, as well as advanced electronics, security, information technology solutions and customer support services. Improving the future and protecting lives is an ambitious mission, but it's what we do at BAE Systems. Working here means using your passion and ingenuity where it counts - defending national security with breakthrough technology, superior products, and intelligence solutions. As you develop the latest technology and defend national security, you will continually hone your skills on a team-making a big impact on a global scale. At BAE Systems, you'll find a rewarding career that truly makes a difference. Electronic Systems (ES) is the global innovator behind BAE Systems' game-changing defense and commercial electronics. Exploiting every electron, we push the limits of what is possible, giving our customers the edge and our employees opportunities to change the world. Our products and capabilities can be found everywhere - from the depths of the ocean to the far reaches of space. At our core are more than 14,000 highly talented Electronic Systems employees with the brightest minds in the industry, we make an impact - for our customers and the communities we serve.
This position will be posted for at least 5 calendar days. The posting will remain active until the position is filled, or a qualified pool of candidates is identified.
Required Skills and Education
High School Diploma or GED. 1 year of work experience or equivalent experience required in lieu of a High School Diploma or GED.
The selected individual will fabricate and/or modify complex micro-integrated circuit modules or microwave/RF integrated circuit modules and sub-assemblies by following specific instructions, such as for wire and ribbon bonding utilizing various manual and automatic bonding machines or using an MRSI microwave component automated pick and place machine. Must be familiar with substrate attach (duroid/ceramic), MMICs, IC's, caps, diodes and resistors, soldering skills and eutectic die attach. Must be familiar with lamination presses, bladder bag ovens and sheet epoxies (mainly with the focus of attaching substrates to modules/housings). Must be familiar with working with a wide variety of adhesives and epoxy's. Must be familiar with operating an MRSI 505 and 605. Must be able to work with a microscope for an entire shift. Can fabricate and/or modify complex microwave/RF integrated circuit modules and sub-assemblies. Must be familiar with MIL-STD-883 and working with bonding complex microwave modules.
Preferred Skills and Education
Solumina/Paperless experience
TIPQA experience
Secret Clearance
Wire and ribbon bonding experience
Manual and automatic bonding experience