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Metallurgical Failure Analysis Engineer Jobs (NOW HIRING)

Apple

Silicon Failure Analysis Engineer

Austin, TX

We have an opportunity for a forward-thinking and especially motivated Silicon Failure Analysis Engineer! As a member of our dynamic group, you will have the rare and great opportunity to work on ...

IOActive

Failure Analysis Engineer

Seattle, WA · On-site

$100K - $150K/yr

We are seeking a Failure Analysis Engineer who will work with other team members to deliver the highest quality results to IOActive's clients throughout the world. Who you are: Our experts operate at ...

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Metallurgical Failure Analysis Engineer information

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$94K

$145.5K

How much do metallurgical failure analysis engineer jobs pay per year?

As of Jul 5, 2026, the average yearly pay for metallurgical failure analysis engineer in the United States is $94,030.00, according to ZipRecruiter salary data. Most workers in this role earn between $77,500.00 and $108,500.00 per year, depending on experience, location, and employer.

What is the difference between Metallurgical Failure Analysis Engineer vs Materials Scientist?

AspectMetallurgical Failure Analysis EngineerMaterials Scientist
Primary FocusInvestigating metal failures, analyzing fracture surfaces, and determining causes of failure in metalsStudying properties, structure, and behavior of various materials, including metals, polymers, and ceramics
Work EnvironmentIndustrial settings, laboratories, manufacturing plantsResearch labs, academic institutions, industry research divisions
CredentialsBachelor's or higher in Metallurgy, Materials Science, or related fields; certifications like ASM or NACEBachelor's or higher in Materials Science, Chemistry, or Physics; advanced degrees often preferred

While both roles involve materials analysis, Metallurgical Failure Analysis Engineers focus specifically on metal failures and fracture analysis in industrial environments, whereas Materials Scientists study a broader range of materials' properties and behaviors across various industries.

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What cities are hiring for Metallurgical Failure Analysis Engineer jobs? Cities with the most Metallurgical Failure Analysis Engineer job openings:
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Metallurgical Failure Analysis Engineer jobs near you
Infographic showing various Metallurgical Failure Analysis Engineer job openings in the United States as of June 2026, with employment types broken down into 97% Full Time, 1% Part Time, and 2% Contract. Highlights an 97% Physical, 2% Hybrid, and 1% Remote job distribution, with an average salary of $94,030 per year, or $45.2 per hour.

Failure Analysis Engineer

Foxconn Assembly LLC

San Jose, CA • On-site

Full-time

Posted 24 days ago

Job description

JOB SUMMARY
Member of the engineering team responsible for investigating and resolving product issues for Industry Standard Servers. Works closely with customers and internal teams-including Foxconn R&D, Product Engineering, and Quality Engineering-to analyze factory and field failure symptoms. Performs detailed hardware and circuit failure analysis to identify root causes at the component level. Supports the implementation of corrective actions and provides feedback to improve product quality. Collaborates with cross-functional engineering disciplines and participates in special capture programs to drive continuous improvement within the ESSN Server Products portfolio.
II. ESSENTIAL FUNCTIONS
  • Perform engineering investigations of significant customer returns, field failures, and line escalations related to hardware issues.
  • Improve customer satisfaction and product quality through timely resolution of hardware-related failures.
  • Interface directly with design and manufacturing teams to determine root cause of hardware failures down to the component level.
  • Collaborate with various internal engineering disciplines (hardware, software, mechanical, materials, reliability) to resolve hardware issues.
  • Facilitate execution of special capture programs such as ARDAP, Early Field Capture, and Selective Field Capture.
  • Provide feedback to internal and external design and process teams based on failure analysis findings.
  • Support internal communication of failure analysis techniques and processes to be deployed across global RMA and service centers, improving product knowledge and enhancing PCA debug efficiency.
  • Drive best practices implementation across worldwide operational, RMA, and service sites.
  • Perform additional duties as assigned.

III. MINIMUM QUALIFICATIONS
A. Education, Experience, and Training
  • Bachelor's degree in Electrical/Electronic Engineering or a related field, with a minimum of 2 years of relevant experience.
  • Proven ability to debug complex hardware issues using logic analyzers, oscilloscopes, and other diagnostic test equipment.
  • Experience with electrical and electronic design tools, including CAD, schematic capture, and PCB layout software. Knowledge of testing methodologies such as functional testing, boundary scan, and in-circuit testing is required.
  • Working knowledge of key server technologies, including Intel and AMD multi-core processors, DDR3/DDR4 memory, NAND flash memory, and PCA design. Familiarity with protocols and technologies such as PCIe, SAS, SCSI, SATA, Fibre Channel, Ethernet, WiFi, Bluetooth, NVMe, and SSDs is preferred.
  • Self-motivated team player capable of working independently in a customer-focused, fast-paced, and demanding environment.
  • Understanding of the full hardware and software development lifecycle.
  • Experience with hardware, firmware, and software development and testing methodologies.
  • Proven ability to collaborate effectively with both internal teams and external partners.
  • Strong analytical and problem-solving skills.

B. Knowledge and Skills
  • Fluency in programming languages such as C#, JavaScript, Python, SQL etc.
  • Familiar with Computer OS such as Windows, CentOS, Ubuntu, Linux or Tiny Linux etc.
  • Experience in troubleshooting analog and digital circuits. Troubleshoots, debugs, and determines root cause at PCBA and system levels for customer devices.
  • Highly proficient in reading and interpreting assembly drawings, schematics, and board layout. Analyzes circuits and layout to identify marginal failure root causes.
  • Familiar with the use of a variety of testing and measuring devices such as Functional generator, DMM, oscilloscopes, and Adjustable power supplies.
  • Familiar with RMA process. Fluency with data collection and analysis.
  • Develops, maintains, and improves all troubleshooting solutions within area or responsibility.
  • Demonstrated problem solving and organizational skills. Works with various engineering groups to make sure the RMA products asap return back to customer as requested.
  • Knowledge of PCA, System, RMA & Service manufacturing environments.
  • Skill in isolating and safely injecting failures to segregate problems during debug from the Server layer into specific PCAs.
  • Working knowledge of Linux commands and structures, preferably with at least exposure to IPMITools
  • Ability to create, develop and debug algorithms and test tools to aid in isolation of failures, along with strong documentation skills needed to share with others on the team.

Foxconn Assembly, LLC is an Equal Opportunity Employer (EOE). All qualified candidates will receive consideration without regard to race, color, religion, gender, sexual orientation, national origin, age, disability, or marital status in accordance with applicable federal, state and local laws.
Foxconn Assembly, LLC participates in E-Verify and will provide the federal government with your Form I-9 information to confirm that you are authorized to work in the U.S.
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