Labview Jobs in Texas (NOW HIRING)

Location: Austin, TX

• Develop and execute RF test plans for K-band (18-27 GHz), Ka-band (27-40 GHz), and W-band (75-110 GHz) microsystems at wafer, die, module, and system levels.
• Perform S-parameter characterization, on-wafer probing, noise figure measurements, and power sweeps using vector network analyzers, spectrum analyzers, and signal generators.
• Design and implement automated test sequences using Python, MATLAB, or LabVIEW to drive measurement instruments and collect production-grade data across process corners and temperature.
• Develop de-embedding methodologies and calibration strategies for high-frequency measurements, including TRL, LRRM, and multi-line calibrations for on-wafer and package-level probing.
• Correlate measured RF results against EM simulation models (HFSS, ADS, AWR, CST) to validate design intent and feed deviations back to the design and packaging teams.
• Characterize passive and active RF components—including transmission lines, filters, LNAs, PAs, and T/R modules—within 3.0D heterogeneously integrated assemblies.
• Support test infrastructure buildout, including fixture design, probe card specification, and lab setup for TIE's RF characterization capabilities.
• Author test reports, standard operating procedures, and design-for-test guidelines to support ecosystem partners and internal engineering teams.

• Define and own the RF test strategy for TIE's 3.0D heterogeneously integrated microsystems across K-band (18-27 GHz), Ka-band (27-40 GHz), and W-band (75-110 GHz), spanning wafer, die, module, and system levels.
• Architect end-to-end test flows—from design-for-testability requirements through production screening—ensuring robust, repeatable, and scalable characterization of RF, mixed-signal, and antenna-in-package subsystems.
• Lead development of advanced de-embedding, calibration, and measurement methodologies for novel 3DHI interconnect structures, including hybrid bonding interfaces, glass/Si interposers, and redistribution layers.
• Drive test-to-model correlation across EM simulation (HFSS, ADS, AWR, CST) and measured data, establishing feedback loops with design, process, and packaging teams to accelerate yield learning and performance optimization.
• Specify, procure, and commission RF test infrastructure—including probe stations, VNA configurations, automated handlers, and environmental chambers—for TIE's characterization lab buildout.
• Establish and mentor the RF test engineering team, setting technical standards, review processes, and best practices for measurement automation, data management, and statistical analysis.
• Engage with foundry, EDA, metrology, and defense-program partners to define and validate test enablement requirements for next-generation RF packaging technologies.
• Author test strategies, reliability qualification plans, reference test procedures, and design-for-test guidelines that become part of TIE's Assembly Design Kit (ADK) deliverables.

• M.S. in Electrical Engineering, Microwave Engineering, Applied Physics, or a related discipline with emphasis on RF/microwave measurement and characterization.
• 5+ years of hands‑on experience in RF/microwave testing, characterization, or validation of ICs, modules, or packaged systems operating at K‑band frequencies and above.
• Deep working knowledge of S‑parameter measurement, VNA calibration techniques, de‑embedding, and on‑wafer probing methodologies.
• Proficiency with RF test instruments (VNAs, spectrum analyzers, signal generators, power meters) and measurement automation using Python, MATLAB, or LabVIEW.
• Familiarity with RF simulation tools such as Keysight ADS, Ansys HFSS, Cadence AWR, or CST Studio for test‑to‑model correlation.
• Understanding of electromagnetic effects in advanced packaging—signal integrity, coupling, and loss across interposers, redistribution layers, and 3D stacked assemblies.
• Ability to work cross‑functionally with design, packaging, EDA, and process teams in a fast‑paced R/D environment.

• M.S. in Electrical Engineering, Microwave Engineering, Applied Physics, or a related discipline with emphasis on RF/microwave measurement, calibration science, or test methodology.
• 10+ years of progressively responsible experience in RF/microwave test engineering, characterization, or validation—including at least 3 years in a technical leadership or principal role.
• Expert‑level knowledge of S‑parameter characterization, advanced VNA calibration (TRL, LRRM, multi‑line), de‑embedding, and on‑wafer probing techniques at millimeter‑wave frequencies.
• Proven ability to architect automated RF test frameworks for R/D characterization and production screening using Python, MATLAB, LabVIEW, or equivalent.
• Deep understanding of electromagnetic effects in advanced packaging—signal integrity, coupling, loss, and thermal interactions across interposers, RDLs, and 3D stacked assemblies.
• Strong proficiency with RF simulation tools (Keysight ADS, Ansys HFSS, Cadence AWR, CST Studio) for rigorous test‑to‑model correlation and root‑cause analysis.
• Track record of building or scaling RF test organizations, including lab infrastructure planning, team development, and process definition.
• Ability to influence cross‑functional roadmaps and partner with design, packaging, EDA, and program management teams in a defense‑adjacent R/D setting.

TIE pays industry‑competitive salaries.

• May work around standard office conditions
• Repetitive use of a keyboard at a workstation
• Use of manual dexterity (e.g., using a mouse)

• Monday – Friday: 8am – 5pm.

A criminal history background check will be required for finalists under consideration for this position.

The University of Texas at Austin, as an equal opportunity/affirmative action employer, complies with all applicable federal and state laws regarding nondiscrimination and affirmative action. The University is committed to a policy of equal opportunity for all persons and does not discriminate on the basis of race, color, national origin, age, marital status, sex, sexual orientation, gender identity, gender expression, disability, religion, or veteran status in employment, educational programs and activities, and admissions.