Internship Rfic Design Engineer Jobs in Portland, OR

Job Details:Job Description: 

The world is transforming - and so is Intel. Intel is a company of bold and curious inventors and problem solvers who create some of the most astounding technology advancements and experiences in the world. With a legacy of relentless innovation and a commitment to bring smart, connected devices to every person on Earth, our diverse and brilliant teams are continually searching for tomorrow's technology and revel in the challenge that changing the world for the better brings. We work every single day to design and manufacture silicon products that empower people's digital lives. Come join us and do something wonderful.

We are seeking a Mechanical System and Component Architect to lead mechanical architecture and design execution for next-generation server platforms. This role is responsible for delivering robust mechanical designs across server chassis, liquid cooling systems, and loading mechanisms for LGA sockets. The ideal candidate combines deep mechanical engineering fundamentals with system-level thinking and strong cross-functional leadership to drive high-quality designs from concept through validation and production.
Key Responsibilities

• Own mechanical architecture for server platform hardware, ensuring subsystem and component designs align to product requirements, schedule, and cost targets.
• Lead mechanical design of server chassis structures, brackets, retention features, airflow interfaces, and serviceability elements.
• Define and deliver mechanical solutions for liquid cooling systems, including cold plates, manifolds, tubing/routing constraints, sealing interfaces, and assembly/service requirements.
• Architect and develop LGA socket loading mechanisms, including retention/load path strategies, tolerance stack-up control, and manufacturability considerations.
• Create and review 3D CAD models, detailed drawings, interface control documentation, and engineering change packages.
• Drive tolerance analysis, structural/thermal design tradeoffs, and reliability-focused design decisions.
• Partner with thermal, signal integrity, electrical, package, and manufacturing teams to optimize system-level performance and integration.
• Collaborate with suppliers/ODMs on DFM, tooling readiness, material/process selection, and qualification plans.
• Lead failure analysis and root-cause resolution for mechanical and integration issues discovered in build, validation, or field returns.

Qualifications:

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your degree, research and or relevant previous job and or internship experiences.

Minimum Qualifications:
Bachelor's degree in Mechanical Engineering or related discipline.

• 6+ years of mechanical design experience in server, compute, or high-performance electronics hardware.
• 4+ years of experience in CREO 3d CAD Tool and creation of manufacturing-ready drawings/GD T.
• 4+ years of experience in tolerance analysis, material behavior, structural mechanics, and thermal-mechanical interactions.

Preferred Qualifications:

• Master's degree in Mechanical Engineering or related field.
• Experience with server platform development in hyperscale or enterprise environments.
• Familiarity with FEA/CFD-informed mechanical design decisions and interpretation of simulation results.
• Experience working with ODM/JDM partners and high-volume manufacturing transitions.
• Knowledge of socket ecosystem standards, board-level constraints, and package/socket co-design considerations.
• Demonstrated expertise in server chassis mechanical design and component integration.
• Hands-on experience with liquid cooling hardware mechanical design for electronics systems.
• Proven experience designing or integrating LGA socket loading and retention mechanisms.
• Experience with design validation, reliability testing, and issue resolution workflows.
• Effective communication and technical leadership across global cross-functional teams.

Job Type:Intel Contract EmployeeShift:Shift 1 (United States of America)Primary Location: US, Oregon, HillsboroAdditional Locations:Business group:At the Data Center Group (DCG), we're committed to delivering exceptional products and delighting our customers. We offer both broad-market Xeon-based solutions and custom x86-based products, ensuring tailored innovation for diverse needs across general-purpose compute, web services, HPC, and AI-accelerated systems. Our charter encompasses defining business strategy and roadmaps, product management, developing ecosystems and business opportunities, delivering strong financial performance, and reinvigorating x86 leadership. Join us as we transform the data center segment through workload driven leadership products and close collaboration with our partners.Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $52,000.00-$200,000.00The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

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ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.