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Internship Mems Process Engineer Jobs (NOW HIRING)

Hp

Wafer Bond Process Engineer

Corvallis, OR · On-site

Wafer Bond Process Engineer Description - HP is seeking a highly motivated Process Engineer to ... Serve as the technical owner for wafer bonding processes supporting MEMS manufacturing. * Sustain ...

Broadcom

Photolithography Process Engineer

Fort Collins, CO · On-site

$109K - $175K/yr

Ownership of photo processes on ASML i-line steppers and high-topography exposure systems for MEMS ... Collaborate with Equipment Engineering and R&D to conceptualize and progress opportunities that ...

nEye.ai

Senior MEMS Design Engineer

Santa Clara, CA · On-site

$180K - $260K/yr

You'll work closely with Silicon Photonics, Mechanical, and Process Engineers to ensure our MEMS structures are not only high-performing but also robust and reliable for high-volume manufacturing.

nEye.ai

Senior MEMS Design Engineer

Santa Clara, CA · On-site

$180K - $260K/yr

You'll work closely with Silicon Photonics, Mechanical, and Process Engineers to ensure our MEMS structures are not only high-performing but also robust and reliable for high-volume manufacturing.

QCi

Process Engineer - H1

Arizona, LA

Senior Process Engineer - H1 Location: Tempe, AZ Department: Operations Reports to: Director of ... MEMS and electronic devices. * Experience modeling and measuring photonic integrated circuits

QUANTUM COMPUTING, INC.

Process Engineer - H1

Tempe, AZ · On-site

$108K - $130K/yr

Job Title: Senior Process Engineer - H1 Location : Tempe, AZ Division: Operations Department ... MEMS and electronic devices. * Experience modeling and measuring photonic integrated circuits

Quantum Computing Inc.

Process Engineer - H1

Tempe, AZ · On-site

Senior Process Engineer - H1 Location : Tempe, AZ Department : Operations Reports to : Director of ... MEMS and electronic devices. * Experience modeling and measuring photonic integrated circuits

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Internship Mems Process Engineer information

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How much do internship mems process engineer jobs pay per hour?

As of Jul 14, 2026, the average hourly pay for internship mems process engineer in the United States is $22.18, according to ZipRecruiter salary data. Most workers in this role earn between $18.27 and $25.96 per hour, depending on experience, location, and employer.

What is the difference between Internship Mems Process Engineer vs Mems Process Engineer?

AspectInternship Mems Process EngineerMems Process Engineer
QualificationsEnrolled in or recent graduate of engineering or related programBachelor's or higher in engineering, with experience preferred
Work EnvironmentInternship setting, often in R&D labs or manufacturing facilitiesFull-time professional role in MEMS fabrication or design
ResponsibilitiesAssisting process development, learning fabrication techniquesDesign, optimize, and troubleshoot MEMS manufacturing processes
Industry UsageEntry-level, educational focus, training periodOperational, development, and production tasks in MEMS industry

The main difference between an Internship Mems Process Engineer and a Mems Process Engineer is experience level and scope. Internships are educational roles for students or recent graduates, focusing on learning and assisting, while Mems Process Engineers are full-time professionals responsible for designing and improving MEMS manufacturing processes.

What cities are hiring for Internship Mems Process Engineer jobs? Cities with the most Internship Mems Process Engineer job openings:
What are the most commonly searched types of Mems Process Engineer jobs? The most popular types of Mems Process Engineer jobs are:
What states have the most Internship Mems Process Engineer jobs? States with the most job openings for Internship Mems Process Engineer jobs include:
Internship Mems Process Engineer jobs near you
Fab Process Engineer

Fab Process Engineer

HP Development Company, L.P.

Corvallis, OR • On-site

$93K - $143K/yr

Full-time

Medical, Dental, Vision, Life, PTO

Posted 12 days ago

Job description

Fab Process Engineer
Description -
Job Summary
The process engineer is a team member of the MEMS organization and is responsible for sustaining the existing generation of technology, leading and supporting the transition of products and manufacturing processes from prototype to full production, and for developing new processes in support of new product or technology development. The process engineer is responsible for employing equipment technology, process technology and problem-solving methodologies to improve manufacturing performance, decrease proto cycles of learning, and enable the development of next-generation technology. The process engineer is the technical leader of their respective workcenter, and is expected to partner with world-wide workcenter counterparts, Operations, Integration Engineering and Product Engineering. The process engineer specifies tooling and equipment that is necessary for workcenter Assurance of Supply and throughput requirements and uses the organization's capital expenditure process to purchase the tooling. The process engineer also takes an active role in the MEMS quality system.
Responsibilities
  • Uses Design of Experiment methodology to characterize process space and develop new production processes. Creates test plans to validate processes.
  • Qualifies new production processes using organizational change management procedures, in partnership with engineering and operations stakeholders.
  • Specifies new tooling and capital equipment purchases that are necessary for workcenter Assurance of Supply
  • Leads the workcenter and drives improvement in the following key areas: process sustaining, quality, equipment and capacity, and process development.
  • Exercises technical judgement, creativity, and initiative with attention to detail consistently throughout work output.
  • Collaborates and communicates with management, worldwide engineering partners, internal, and outsourced development partners regarding status, project progress, and issue resolution.
  • Leads project team of other process engineers and internal and outsourced development partners to develop reliable, cost effective and high quality solutions for moderately-complex products.
  • Represents the workcenter team for all phases of larger and more- complex development projects.
  • Solves difficult and complex problems with fresh perspective, demonstrating good judgment in selecting creative solutions and managing projects independently.
  • Delivers professionally written reports, and supports realization of operational and strategic plans.
  • Provides guidance and mentoring to less- experienced staff members to set an example of process design and development, innovation, and excellence.

Education & Experience Recommended
  • Four-year or Graduate Degree in Chemical Engineering, Mechanical Engineering, Electrical Engineering, Materials Science, Physics, or other related discipline.
  • Typically has 4-7 years of work experience, preferably in wafer or package fab process engineering, with experience in process development, stabilization, sustaining, and quality systems.
  • Prior experience with Atomic Layer Deposition (ALD), Physical Vapor Deposition (PVD), and Plasma Enhanced Chemical Vapor Deposition (PECVD) strongly preferred.

Knowledge & Skills
  • Process development and characterization
  • Process qualification
  • Change management
  • Process and tooling
  • Equipment specification
  • Technical communication
  • Electrical Engineering
  • Chemical Engineering
  • Mechanical Engineering
  • Materials Science
  • Physics
  • Wafer fab
  • Package fab
  • Plasma physics
  • Plasma processes
  • Atomic Layer Deposition (ALD)
  • Physical Vapor Deposition (PVD)
  • Plasma Enhanced Chemical Vapor Deposition (PECVD)

The pay range for this role is $93,400 to $143,800 USD annually with additional opportunities for pay in the form of bonus and/or equity (applies to United States of America candidates only). Pay varies by work location, job-related knowledge, skills, and experience.
Benefits:
HP offers a comprehensive benefits package for this position, including:
  • Health insurance
  • Dental insurance
  • Vision insurance
  • Long term/short term disability insurance
  • Employee assistance program
  • Flexible spending account
  • Life insurance
  • Generous time off policies, including;
  • 4-12 weeks fully paid parental leave based on tenure
  • 11 paid holidays
  • Additional flexible paid vacation and sick leave (US benefits overview)

The compensation and benefits information is accurate as of the date of this posting. The Company reserves the right to modify this information at any time, with or without notice, subject to applicable law.
Job -
Engineering
Schedule -
Full time
Shift -
No shift premium (United States of America)
Travel -
Not Specified
Relocation -
Yes
Equal Opportunity Employer (EEO) -
HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s).
Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.
For more information, review HP's EEO Policy or read about your rights as an applicant under the law here: "Know Your Rights: Workplace Discrimination is Illegal"

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