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Internship Electroplating Process Engineer Jobs in Albuquerque, NM

Through mentoring, students will be exposed to various areas of the electrical process with the ... Engineering, and/or Project Management. You will learn all the tasks that each one of these ...

Internship - Paid

Albuquerque, NM · On-site

$14.50 - $19.50/hr

Through mentoring, students will be exposed to various areas of the electrical process with the ... Engineering, and/or Project Management. You will learn all the tasks that each one of these ...

By submitting your interest, you'll be among the first to know when internship opportunities open ... Producing documentation to support medical device regulatory processes Who This Is For * Students ...

With decades of expertise in manufacturing cutting-edge processors and integrated circuits, Intel ... internship experiences and or schoolwork/classes/research. Minimum Qualifications: * Bachelor ...

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Internship Electroplating Process Engineer information

See Albuquerque, NM salary details

$13

$21

$29

How much do internship electroplating process engineer jobs pay per hour?

As of Aug 17, 2026, the average hourly pay for internship electroplating process engineer in Albuquerque, NM is $21.50, according to ZipRecruiter salary data. Most workers in this role earn between $17.69 and $25.14 per hour, depending on experience, location, and employer.

What is the difference between Internship Electroplating Process Engineer vs Electroplating Process Engineer?

AspectInternship Electroplating Process EngineerElectroplating Process Engineer
QualificationsEnrolled in or recent graduate of relevant engineering or chemistry programBachelor's or higher in chemical, materials, or metallurgical engineering
Work EnvironmentInternship setting, supervised, entry-level tasksFull-time, professional environment, responsible for process optimization
ResponsibilitiesAssisting with electroplating processes, data collection, learning proceduresDesigning, improving, and overseeing electroplating processes, troubleshooting

In summary, the Internship Electroplating Process Engineer role is an entry-level position focused on learning and assisting, while the Electroplating Process Engineer is a full-time professional responsible for process development and optimization.

What are the most commonly searched types of Electroplating Process Engineer jobs in Albuquerque, NM?

The most popular types of Electroplating Process Engineer jobs in Albuquerque, NM are:

What are popular job titles related to Internship Electroplating Process Engineer jobs in Albuquerque, NM?

For Internship Electroplating Process Engineer jobs in Albuquerque, NM, the most frequently searched job titles are:

What job categories do people searching Internship Electroplating Process Engineer jobs in Albuquerque, NM look for?

The top searched job categories for Internship Electroplating Process Engineer jobs in Albuquerque, NM are:

Infographic showing various Internship Electroplating Process Engineer job openings in Albuquerque, NM as of August 2026, with employment types broken down into 1% As Needed, 77% Full Time, 17% Part Time, 4% Contract, and 1% Nights. Highlights an 92% Physical, 2% Hybrid, and 6% Remote job distribution, with an average salary of $44,725 per year, or $21.5 per hour.

Copper Plating Engineering Group Leader

3D Glass Solutions

Albuquerque, NM • On-site

Full-time

Re-posted 5 hours ago


Job description

Job/Position Summary
The Copper Plating Engineering Group Leader is a hands-on leader who will lead process development and provide manufacturing support for advanced copper plating technologies. This role requires deep technical expertise in electroplating and electroless copper processes, strong experimental leadership, and the ability to mentor and guide a team of process engineers. The ideal candidate will be both a technical authority and an active contributor in lab and fab environments.
Primary Responsibilities
  • Lead and manage a team of process engineers focused on copper plating and related unit processes.
  • Drive experimental design, execution, and data analysis to optimize plating performance, yield, and reliability.
  • Provide hands-on technical leadership in lab and production environments, including tool setup, process tuning, and troubleshooting.
  • Develop, qualify, and maintain copper plating processes for wafer-level and/or panel-level manufacturing.
  • Serve as the technical owner for copper electroplating and electroless plating modules.
  • Collaborate cross-functionally with equipment, integration, yield, reliability, and manufacturing teams.
  • Establish robust problem-solving methodologies (DOE, SPC, FMEA, root cause analysis) to address process challenges.
  • Support technology transfers from R&D to high-volume manufacturing
  • Mentor junior engineers and elevate the overall team's technical capability
  • Interface with chemical and equipment suppliers for process optimization and roadmap alignment.
  • Perform additional functions and other duties as assigned or required.

Requirements
  • Bachelor's degree or higher in Materials Science, Chemical Engineering, Electrical Engineering, or a related field required.
  • 5-10 years of industry experience in copper plating or advanced packaging process engineering.
  • Willing to relocate to Albuquerque, New Mexico, for 1-2 years and willing to relocate to India for 2 years or permanently.
  • This position will require lawful access to ITAR/EAR controlled information, and employees in these roles will need to meet those requirements. Requirements include US Citizenship, US Permanent Resident, or the ability to meet contract-specific licensure requirements.

Knowledge, Skills, and Abilities
  • Demonstrated experience leading technical teams or serving as a senior technical authority.
  • Proven track record of solving complex plating and integration challenges.
  • Experience with plating equipment operation, optimization, and qualification.
  • Experience with plating chemistry additives, including suppressors, accelerators, and levelers.
  • Knowledge of wafer-level and/or panel-level plating process development and manufacturing.
  • Knowledge of microvia electroplating and void-free fill techniques.
  • Knowledge of plating seed layer etching and related metallization removal processes.
  • Experience in through Glass Via (TGV) filling.
  • Familiarity with high-volume manufacturing requirements and process control methodologies.
  • Ability to balance technical depth with project and people leadership.
  • Excellent communication and mentoring skills.
  • Supplier and equipment vendor engagement experience.
  • Experience in advanced packaging, heterogeneous integration, or semiconductor manufacturing environments.
  • Experience in through Silicon Via (TSV) filling.
  • Knowledge of photoresist stripping and post-plating cleaning processes.
  • Experience with redistribution Layer (RDL) electroplating.
  • Knowledge of electroless copper plating chemistries, including copper seed layer formation.
  • Experience with Electroplating waveforms, including DC, pulse, and pulse-reverse plating.
  • Demonstrated experience with Copper electroplating chemistries, including acid copper systems and additive interactions.
  • Strong experimental design and data analysis skills.

Physical/Working Requirements
  • Must be able to wear personal protective gear most of the day (where applicable).
  • Prolonged periods of sitting or standing.

Behavioral Traits
  • Strong verbal and written communication skills to convey quality standards, expectations, and feedback clearly to team members and stakeholders.
  • A willingness to adjust to changing circumstances, processes, or technologies for continuous improvement in dynamic environments.
  • The ability to work well with others, fostering a cooperative atmosphere, driving data management initiatives, and engaging all levels of the organization.

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About 3D Glass Solutions

Sourced by ZipRecruiter

Industry

Electrical equipment, appliance, and component manufacturing

Company size

11 - 50 Employees

Headquarters location

Albuquerque, NM, US

Year founded

2006