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Internship Chip Jobs in Oregon (NOW HIRING)

... chip designs. This position is at the forefront of innovation, requiring collaboration with cross ... or internship experiences. Minimum Qualifications: * BS degree in Electrical Engineering or ...

... chip designs. This position is at the forefront of innovation, requiring collaboration with cross ... internship experiences. * BS degree in Electrical Engineering or Computer Engineering or similar ...

... chip designs. Participates actively in the definition of architecture and microarchitecture ... internship experience. Benefits at Intel Our total rewards package goes above and beyond just a ...

Software Engineer 3

Hillsboro, OR · On-site

$115K - $197K/yr

Enabling the movement towards advanced chip design, KLA's Global Products Group (GPG), which is ... Interns are eligible for some of the benefits listed. Our pay ranges are determined by role, level ...

Enabling the movement towards advanced chip design, KLA's Global Products Group (GPG), which is ... Interns are eligible for some of the benefits listed. Our pay ranges are determined by role, level ...

Showing results 21-36

Internship Chip information

What is the difference between Internship Chip vs Data Analyst?

AspectInternship ChipData Analyst
Required CredentialsTypically pursuing or recent graduate, some technical skillsBachelor's degree in related field, some certifications
Work EnvironmentTemporary, learning-focused, entry-levelFull-time, professional setting, analytical tasks
Employer & Industry UsageInternships offered by tech, finance, marketing firmsCompanies across industries, including tech, finance, healthcare
Search & Comparison IntentLooking for entry-level, learning opportunitiesSeeking professional, ongoing data analysis roles

The main difference between Internship Chip and Data Analyst is that the internship is a temporary, learning-focused position for students or recent graduates, while a Data Analyst is a full-time professional role requiring more experience and skills. Internships serve as a stepping stone into the industry, whereas Data Analysts perform ongoing data interpretation and reporting tasks in a professional setting.

What are popular job titles related to Internship Chip jobs in Oregon?

For Internship Chip jobs in Oregon, the most frequently searched job titles are:

What cities in Oregon are hiring for Internship Chip jobs?

Cities in Oregon with the most Internship Chip job openings:

Infographic showing various Internship Chip job openings in Oregon as of July 2026, with employment types broken down into 11% Internship, 59% Full Time, 26% Part Time, 1% Temporary, 2% Contract, and 1% Nights. Highlights an 89% Physical, 3% Hybrid, and 8% Remote job distribution.

WPM C4 Quality and Reliability Engineer

Intel

Hillsboro, OR

$78K - $101K/yr

Full-time

Medical, Retirement, PTO

Posted 12 days ago


Intel rating

8.7

Company rating: 8.7 out of 10

Based on 147 frontline employees who took The Breakroom Quiz

19th of 159 rated electronics manufacturers


Job description

Job Details:Job Description: 

As a world's leading chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art. From semiconductor process development and manufacturing, through yield improvement to final test and optimization, and lastly advanced die prep and packaging. Employees in Intel Foundry are part of a worldwide network of manufacturing, advanced packaging, and assembly/test facilities.
As a Quality and Reliability Engineer (QRE), you will be part of FQRL (Foundry Quality, Reliability, and Labs), Intel's Quality and Reliability organization. We are strong believers in partnership, collaboration and teamwork. You will routinely work with the fab module engineers, process integration[RB1.1] and worldwide employees both internal and external to Intel. This is an on-site role that requires living in Oregon. This role requires evening meetings most work days.
The Wafer Packaging Manufacturing (WPM) organization owns a crucial part of semiconductor wafer processing, testing, and die-to-wafer assembly. In addition to traditional product types, we drive Intel's advanced packaging strategy - bringing compelling capabilities to market and enabling large-scale AI computing. C4 (bumping) QREs cover several critical process segments[RB2.1] such as interposer, micro-logical, and package side bumping in the WPM organization.
Your key deliverables will include:
Manage customer quality (both internal and external) issues on products.
Extract and Analyze data to support risk assessment of suspect/non-conforming material.
Support and engage with down-stream partners to manage excursions, down-stream investigations, and respond to issues.
Partnering with other organizations to proactively drive improvements in quality and reliability performance.
Ensure that the metrics and goals for the end-of-line-hold operations are met, as well as MRB (Material Review Board) [RB3.1]inventory.
Identify and drive activities and projects to improve detection and containment of potentially discrepant or unreliable material.
Support Certification and Ramp of new technologies from on-site and off-site development teams.
24x7 on-call response (as part of an engineering rotation) to respond to urgent line issues, excursions, or to support task force-level projects.

The ideal candidate should exhibit the following behavioral traits:
Strong communication and collaboration skills with the ability to work effectively across cross-functional teams.
Experience in manufacturing environments or familiarity with high-volume production processes.
A growth mindset and active interest in continuous learning and development.
Make technical decisions and provide technical direction.
Evidence of organizational and planning skills for engineering projects.
Demonstrate effective communication up and down the organization, including skills to communicate technical issues and status to factory and program leadership.
Effectively work in a highly networked, cross organization role.
Exhibit strong team building and influencing skills.
Work under pressure, and in an ever-changing and dynamic environment

Qualifications:

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.


Minimum Qualifications:
- Master's degree in a specialized field such as Engineering, Science, or a related discipline

At least 6 months of experience in the following:
- Knowledge of manufacturing processes, semiconductor fabrication, and quality assessment methodologies.
- Familiar with excursion management, reliability fundamentals, or problem-solving techniques.
- Proficiency in statistical analysis techniques and tools, such as JMP or Minitab.
Preferred Qualifications:
- Master's degree in Engineering or Science, with semiconductor foundry experience.
-Ability to write automation scripts to improve efficiency of data extraction and analysis.
- Proven ability to collaborate across cross-functional teams and represent quality functions in engineering forums.
- Strong communication and leadership skills, with a proactive approach to driving process optimization.
- Demonstrated ability to manage change control processes and drive continuous improvement programs

- Familiarity with product and process reliability principles and methods.
- Knowledge of quality control systems and methodologies.


Join Intel and contribute to shaping the future of semiconductor manufacturing through innovation, excellence, and collaboration. Apply today to be part of a team that values your expertise and empowers your career growth.

Job Type:College GradShift:Shift 1 (United States of America)Primary Location: US, Oregon, HillsboroAdditional Locations:Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $89,010.00-125,660.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

*

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

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About Intel

Sourced by ZipRecruiter

Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth

Industry

Manufacturing

Company size

10,000+ Employees

Headquarters location

Santa Clara, CA, US

Year founded

1968