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Internship Chip Design Jobs in Vermont (NOW HIRING)

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Internship Chip Design information

What is an internship in chip design?

An internship in chip design is a temporary, practical work experience where students or recent graduates assist in the design, development, and testing of semiconductor chips, such as microprocessors or integrated circuits. Interns typically work with engineering teams, learning about electronic design automation (EDA) tools, circuit simulation, and layout design. The role offers hands-on exposure to the chip development process, from concept to testing, and is valuable for those pursuing careers in electrical engineering or related fields.

What is the difference between Internship Chip Design vs Chip Design Engineer?

AspectInternship Chip DesignChip Design Engineer
Required CredentialsEnrolled in or recent graduate of Electrical Engineering or related fieldBachelor's or Master's in Electrical Engineering, Computer Engineering, or related
Work EnvironmentInternship programs, team projects, supervised tasksFull-time professional setting, independent project work
Employer & Industry UsageInternship positions in semiconductor and electronics companiesFull-time roles in chip design companies, tech firms, or semiconductor industry
Comparison Search IntentLearning about entry-level opportunities and trainingUnderstanding professional career roles and responsibilities

Internship Chip Design positions are entry-level opportunities aimed at students or recent graduates, focusing on training and skill development under supervision. Chip Design Engineers are full-time professionals responsible for designing, testing, and implementing integrated circuits independently. While internships provide foundational experience, engineers hold advanced responsibilities in the industry.

Are internship chip designers in demand?

Internship chip design roles are in demand due to the growing need for advanced semiconductor components in electronics, AI, and IoT devices. Candidates with skills in VHDL, Verilog, and familiarity with EDA tools like Cadence or Synopsys are sought after, especially in companies focusing on hardware development and innovation.

What types of projects and responsibilities can I expect during an internship in chip design?

As an intern in chip design, you can expect to work on a variety of tasks that may include assisting with schematic capture, running simulation tools, performing layout verification, and supporting senior engineers with design documentation. You will likely participate in team meetings and collaborate with both hardware and verification engineers, gaining exposure to the full chip development lifecycle. The projects assigned are typically tailored to your skill level, offering hands-on experience with industry-standard EDA tools and methodologies. This environment provides an excellent opportunity to develop technical and teamwork skills while contributing to real-world semiconductor products.

What are the key skills and qualifications needed to thrive as an internship chip design, and why are they important?

To thrive as an Internship Chip Design, you need a solid background in electrical engineering fundamentals, digital/analog circuit design, and a relevant academic degree in progress. Familiarity with hardware description languages (such as VHDL or Verilog), EDA tools (like Cadence or Synopsys), and simulation software is typically required. Strong analytical thinking, attention to detail, and effective teamwork are crucial soft skills in this role. These competencies are vital to ensure accurate chip functionality, efficient design cycles, and successful collaboration on complex engineering projects.

How to get a job in internship chip design?

To secure an internship in chip design, candidates should have a strong foundation in electrical engineering or computer engineering, proficiency in hardware description languages like VHDL or Verilog, and experience with CAD tools such as Cadence or Synopsys. Relevant coursework, personal projects, or research in digital or analog circuit design can strengthen applications, and applying through company career portals or university programs is common practice.
What job categories do people searching Internship Chip Design jobs in Vermont look for? The top searched job categories for Internship Chip Design jobs in Vermont are:
What cities in Vermont are hiring for Internship Chip Design jobs? Cities in Vermont with the most Internship Chip Design job openings:
Internship Chip Design jobs near you

Principal Advanced Packaging Design Engineer

Marvell

Burlington, VT • On-site

Full-time

Life, Retirement

Re-posted 19 days ago

Job description

About Marvell

Marvell's semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities.

At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead.

Your Team, Your Impact

The Marvell Advanced Packaging team is responsible for package design and technology development to meet the electrical, mechanical, thermal and system requirements for the next generation high performance computing (HPC), Artificial Intelligence (AI) and networking solutions. The group focuses on signal integrity, power integrity, thermal integrity, mechanical integrity, processability, manufacturability, and reliability, involving high speed signaling and complex power delivery networks (PDNs) requiring innovative and custom solutions to meet constantly evolving customer needs. Many of the new designs require multi-chip, multiple component configurations involving, but not limited to, 2.5D and 3D packages, Co-packaged copper or optics and advanced substrates. Marvell has partnered with the world's leading manufacturers to solve our customer's most challenging designs and integrations with industry-leading packaging technologies.

What You Can Expect

This engineer will be responsible for leading small project teams of design and simulation engineers to deliver innovative high quality packaging solutions. The engineer will also interface with package suppliers to select package technology to ensure manufacturability, and compliance with performance, reliability, and cost requirements.

What We're Looking For

  • Extensive experience in substrate and/or board design for advanced package technologies with basic understanding of design for manufacturing and reliability as well as electrical performance and the ability to make trade off decisions accordingly

  • Proven ability to lead complex package architecture development projects involving all relevant internal and external customer stakeholders

  • Mastery in tools and workflows: Cadence 3DIC/ISP/APD/SiP

  • Bachelor's degree in electrical engineering or related fields and 15+ years of related professional experience or master's degree and 12+ years of related professional experience or PhD degree with 8+ years of experience.

Skills needed to be successful in this role:

  • Innovative thinking, fundamental understanding of design rules, breakout, place and route, signal shielding, reference plane, power distribution, pinout considering overall package and system requirements.

  • Experience with current generation HBM, DDR, SerDes, D2D, D2H, ADC, DAC, PCIE, Ethernet, etc

  • Good understanding of signal and power integrity at substrates, board, package, and system level.

  • Understanding of advanced 2.5D/3D package technology including (a) CoWoS-S/R/L, (b) EMIB, (c) CPO, (d) CPC

  • Familiarity in tools and workflows: Cadence Sigrity/Clarity/Innovus/Virtuoso, Ansys, AutoCAD, SolidWorks

  • Experience contributing to tool, process, and flow development, library maintenance

  • Experience interacting with chip design and electrical simulation teams to optimize the design. Familiarity with running and interpreting signal and power simulations is a plus

  • Ability to manage programs involving cross-functional teams. Strong interpersonal skills and willingness to learn new things are necessary along with the ability to work with stakeholders in multiple time zones across the globe.

  • Strong communication, presentation and documentation skills

Expected Base Pay Range (USD)

168,400 - 249,310, $ per annum

The successful candidate's starting base pay will be determined based on job-related skills, experience, qualifications, work location and market conditions. The expected base pay range for this role may be modified based on market conditions.

Additional Compensation and Benefit Elements

Marvell is committed to providing exceptional, comprehensive benefits that support our employees at every stage - from internship to retirement and through life's most important moments. Our offerings are built around four key pillars: financial well-being, family support, mental and physical health, and recognition. Highlights include an employee stock purchase plan with a 2-year look back, family support programs to help balance work and home life, robust mental health resources to prioritize emotional well-being, and a recognition and service awards to celebrate contributions and milestones. We look forward to sharing more with you during the interview process.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status.

Any applicant who requires a reasonable accommodation during the selection process should contact Marvell HR Helpdesk at TAOps@marvell.com.

Interview Integrity

To support fair and authentic hiring practices, candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews.

These tools must not be used to record, assist with, or enhance responses in any way. Our interviews are designed to evaluate your individual experience, thought process, and communication skills in real time. Use of AI tools without prior instruction from the interviewer will result in disqualification from the hiring process.

This position may require access to technology and/or software subject to U.S. export control laws and regulations, including the Export Administration Regulations (EAR). As such, applicants must be eligible to access export-controlled information as defined under applicable law. Marvell may be required to obtain export licensing approval from the U.S. Department of Commerce and/or the U.S. Department of State. Except for U.S. citizens, lawful permanent residents, or protected individuals as defined by 8 U.S.C. 1324b(a)(3), all applicants may be subject to an export license review process prior to employment.

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