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Intern Soc Design Engineer Jobs in Florida (NOW HIRING)

Package Design Engineer | Semiconductor

Apopka, FL ยท On-site

$119K/yr

Work with SoC design teams to optimize die floorplan, bump patterns and interposer / substrate ... Bachelors degree in Electrical Engineering, Mechanical Engineering, or other semiconductor ...

Description As an ASIC STA Engineer, you will have responsibilities spanning all aspects of SoC design in terms of timing. Key responsibilities include timing sign-off, STA and sign-off flow ...

Description As an ASIC STA Engineer, you will have responsibilities spanning all aspects of SoC design in terms of timing. Key responsibilities include timing sign-off, STA and sign-off flow ...

Description As an ASIC STA Engineer, you will have responsibilities spanning all aspects of SoC design in terms of timing. Key responsibilities include timing sign-off, STA and sign-off flow ...

Description As an ASIC STA Engineer, you will have responsibilities spanning all aspects of SoC design in terms of timing. Key responsibilities include timing sign-off, STA and sign-off flow ...

Hardware Design Engineer 3

Fort Meade, FL ยท On-site

$100 - $130/hr

We are seeking a Hardware Design Engineer to support our technology initiatives. A viable candidate ... Experience designing and developing ASIC/FPGA/SoC microelectronics including simulation ...

Review design plans and bid specifications from outside consultants for compliance with City ... Must possess Engineering Intern Certification and be able to obtain a Professional Engineering ...

Review design plans and bid specifications from outside consultants for compliance with City ... Must possess Engineering Intern Certification and be able to obtain a Professional Engineering ...

FPGA Design Engineer We are seeking a FPGA Design Engineer with over 8 years of experience to ... Experience with System-on-Chip (SoC) technologies. * Must have an Active DoD Secret Clearance ...

You will closely work with SOC teams to deliver IP views and make sure they meet the quality ... Preferred Qualifications Deep understanding of analog mixed-signal design with experience in high ...

You will closely work with SOC teams to deliver IP views and make sure they meet the quality ... Preferred Qualifications Deep understanding of analog mixed-signal design with experience in high ...

SerDes Circuit Design Engineer

Melbourne, FL ยท On-site

$187K/yr

You will drive mask design to implement layout view of designs ... You will closely work with SOC teams to deliver IP views and make sure they meet the quality ...

Mixed-Signal IC Design Engineer

Melbourne, FL ยท On-site

$187K/yr

Specify, design, implement, and verify analog and mixed-signal circuits and sub-systems, including ... Engage with cross-functional analog, digital, DV, firmware, software, SoC architecture, technology ...

Specify, design, implement, and verify analog and mixed-signal circuits and sub-systems, including ... Engage with cross-functional analog, digital, DV, firmware, software, SoC architecture, technology ...

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Intern Soc Design Engineer information

What is the difference between Intern Soc Design Engineer vs Intern Hardware Design Engineer?

AspectIntern Soc Design EngineerIntern Hardware Design Engineer
Required SkillsDigital/analog circuit design, FPGA, PCB layout, scriptingCircuit schematic, PCB design, component selection, testing
Work EnvironmentSemiconductor companies, electronics firms, R&D labsConsumer electronics, industrial equipment, R&D teams
Common UsageFocus on system-on-chip (SoC) architecture and integrationFocus on hardware components and circuit implementation

Intern Soc Design Engineers typically work on integrated circuit architecture and system integration, while Intern Hardware Design Engineers focus on designing and testing physical hardware components. Both roles involve electronics fundamentals but differ in scope and specific technical skills.

What are the most commonly searched types of Soc Design Engineer jobs in Florida? The most popular types of Soc Design Engineer jobs in Florida are:

Package Design Engineer | Semiconductor

Micross

Apopka, FL โ€ข On-site

$119K/yr

Full-time

Medical, Dental, Vision, Life, Retirement, PTO

Re-posted 7 days ago


Job description

Micross is seeking a Semiconductor Package Design Engineer to work in our Apopka, Florida or Raleigh, North Carolina facility.

Essential Duties and Responsibilities:

  • The primarily responsible for design of advanced semiconductor packages, including both ceramic and organic substrates, including layout, parasitic extraction, and optimization
  • Work with IC design, system design, package Signal Integrity (SI)/Power Integrity (PI) & thermal engineering teams to design custom interposer and substrates
  • Work with SoC design teams to optimize die floorplan, bump patterns and interposer / substrate stack up
  • Work with IC design team to define IC package requirements
  • Design package layout using standard CAD tools
  • Extract package parasitics and conduct PI/SI analysis
  • Documentation and release in appropriate archival system

Preferred Knowledge, Skills, And Abilities

Layout:

  • Allegro Package Designer Plus (APD+) tools for designing the package and generating artwork for fabrication.

Analysis:

  • Celsius PowerDC (IR Drop)
  • Sigrity Advanced SI II: Analysis tools for Signal integrity of parallel busses (DDRx) and serial links (PCIe Gen x), including Package and PCB effects
  • Sigrity Advanced PI II: Power Integrity tools (IR drop, Impedance Profile, capacitor optimization) including Package and PCB effects

RF / Microwave Design

  • AWR, Momentum and HFSS Software Circuit, system, and EM simulation for RF/microwave product development

Qualifications

  • Bachelors degree in Electrical Engineering, Mechanical Engineering, or other semiconductor packaging related discipline.
  • 8 to 10 years of experience in semiconductor packaging design, modeling, and simulations
  • Strong authority on Cadence Allegro Package Designer Plus (APD+)
  • Experience on interposer and substrate layouts and design in advanced package technologies
  • Experience with 2.5D, 3D package design
  • Experience with design teams on floor plan, bump and layout optimization
  • Excellent skills in problem solving, written and verbal communication, excellent organization skills, and highly self-motivated
  • Record of success in cross-functional team environment
  • Good experience with SI/PI tools for package level extraction/simulation

At Micross, our Core Values of integrity, communication, teamwork, quality and execution, self-discipline and accountability are cultivated throughout all levels of the organization. Micross provides a challenging and enjoyable workplace for members and supports the needs of the community.

Micross provides competitive benefits including medical, HSA and FSA plans, dental, vision, company paid basic Life Insurance, Employee Assistance Program (EAP), 401k with employer match, paid leave, vacation, holidays, generous tuition assistance, 529 College Savings, Pet insurance, Legal insurance, and a range of well-being programs available.

www.Micross.com