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Heterogeneous Integration Jobs (NOW HIRING)

Coherent

Photonic Material Engineer

Budd Lake, NJ · On-site

Coherent is seeking a PhD-level integrated photonics ceramic staff to implement integrated ceramic photonic integrated circuits, based on 2D/3D heterogeneous integration process to fabricate advance ...

Coherent Corp.

Photonic Material Engineer

Budd Lake, NJ · On-site

Coherent is seeking a PhD-level integrated photonics ceramic staff to implement integrated ceramic photonic integrated circuits, based on 2D/3D heterogeneous integration process to fabricate advance ...

Cspeed

Packaging Integration Engineer

Palo Alto, CA · On-site

... heterogeneous integration, high-density interconnects Ability to select and manage external foundries/OSATs for interposer-based packaging (must understand material selection, state of the art ...

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Heterogeneous Integration information

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$44.5K

$124.3K

$173.5K

How much do heterogeneous integration jobs pay per year?

As of Jun 4, 2026, the average yearly pay for heterogeneous integration in the United States is $124,275.00, according to ZipRecruiter salary data. Most workers in this role earn between $104,000.00 and $140,000.00 per year, depending on experience, location, and employer.

What are the key skills and qualifications needed to thrive in Heterogeneous Integration, and why are they important?

To thrive in Heterogeneous Integration, you need a strong background in materials science, semiconductor device physics, and microelectronics, often supported by an advanced degree in engineering or a related field. Familiarity with tools and processes such as wafer-level packaging, 3D integration, and electronic design automation (EDA) software is typically required. Strong problem-solving, collaboration, and project management skills help professionals excel in multidisciplinary teams and innovative environments. These skills are essential for developing cutting-edge solutions that improve performance and functionality in advanced electronic systems.

What are some common challenges faced by professionals working in Heterogeneous Integration, and how can they be addressed?

Professionals in Heterogeneous Integration often encounter challenges related to aligning and interconnecting diverse materials and technologies, such as combining silicon with compound semiconductors or integrating different chiplets. These complexities require careful thermal management, precise packaging, and close collaboration with specialists in materials science, electrical engineering, and manufacturing. Addressing these challenges typically involves staying current with the latest integration technologies, working in multidisciplinary teams, and being proactive in troubleshooting process compatibility and reliability issues. Effective communication and a willingness to learn from other domains greatly enhance success in this role.

What is heterogeneous integration in electronics?

Heterogeneous integration refers to the process of combining different types of components, such as chips made from various materials or technologies, into a single package or system. This approach enables improved performance, functionality, and miniaturization by integrating logic, memory, sensors, and other elements that may have been manufactured separately. It is increasingly important in advanced electronics, such as 5G, artificial intelligence, and high-performance computing, where traditional scaling methods reach their limits. Heterogeneous integration enables new system architectures and can lead to faster, more energy-efficient devices.

What is the difference between Heterogeneous Integration vs Semiconductor Process Engineer?

AspectHeterogeneous IntegrationSemiconductor Process Engineer
Required CredentialsEngineering degree in electrical, materials, or related fieldsEngineering degree, often with specialization in process technology
Work EnvironmentResearch labs, manufacturing facilities, R&D centersSemiconductor fabrication plants, R&D labs
Industry UsageElectronics, integrated circuits, advanced packagingSemiconductor manufacturing, process development
Common Search/ComparisonYesYes

Heterogeneous Integration involves combining different types of components or materials into a single system, often focusing on advanced packaging and system-in-package solutions. Semiconductor Process Engineers focus on developing and optimizing manufacturing processes for semiconductor devices. While both roles are integral to semiconductor technology, Heterogeneous Integration emphasizes system-level integration, whereas Process Engineers concentrate on fabrication processes.

Infographic showing various Heterogeneous Integration job openings in the United States as of May 2026, with employment types broken down into 14% Full Time, and 86% Part Time. Highlights an 84% Physical, 4% Hybrid, and 12% Remote job distribution, with an average salary of $124,275 per year, or $59.7 per hour.
3D Heterogeneous Integration Engineer

3D Heterogeneous Integration Engineer

Globalfoundries

Malta, NY • On-site

$98K - $176K/yr

Full-time

Posted 29 days ago

GlobalFoundries rating

8.2

Company rating: 8.2 out of 10

Based on 34 frontline employees who took The Breakroom Quiz

79th of 515 rated manufacturers

Job description

About GlobalFoundries:

GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world's most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.

Summary of Role:

GlobalFoundries Fab8 is seeking an experienced and dedicated R&D engineer, joining Advanced Packaging Lab (APL) to lead advanced 3D Heterogeneous Integration (3D-HI) initiatives spanning multiple application domains.

Essential Responsibilities:

  • Drive 3D-HI process development efforts for the building blocks required for advanced packaging solutions needed by the GlobalFoundries product lines (e.g., multi-die stacking, die-to-wafer / wafer-to-wafer fine pitch hybrid bonding, etc.).
  • Partner with unit process engineers, manufacturing engineers, as well as directly with the tool and material vendors for the GlobalFoundries fabs.
  • Collaborate joint development projects (JDP) with partners to develop new wafer level and die level 2.5D and 3D Heterogeneous Integration (3D-HI) processes.
  • Drive end-to-end process integration and planning to enable new capabilities and early product prototyping across multiple programs.
  • Develop expertise in processes, materials, and tooling, and make efficient use of characterization resources.
  • Drive data analysis, interpretation of results, and understanding of failure modes.
  • Identify and resolve process integration issues and related challenges.
  • Generate IP related to novel wafer integration and packaging technology.

Other Responsibilities:

  • Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.
  • Participate in hiring activities.
  • Mentor and guide new hires to assume their roles and responsibilities.
  • Other duties as assigned by manager.

Required Qualifications:

  • Education - Master's in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited degree program.
  • MS degree with at least 5 years of prior related work experience.
  • In depth knowledge of BEOL processes and integration (advanced bonding, TSVs), bump/wafer finish integration, wafer test/probe, OSAT collaboration, and package development & assembly.
  • Strong problem solving and technical trouble shooting skills including expertise in design of experiment.
  • Must have at least an overall 3.0 GPA and proven good academic standing.
  • Language Fluency - English (Written & Verbal).
  • Travel - Up to 10%.

Preferred Qualifications:

  • Education - PhD education level preferred with at least 3 years of prior related work experience.
  • Demonstrated prior leadership experience internally or with an OSAT eco-system.
  • Project management skills, i.e. the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity.
  • Strong written and verbal communication skills.
  • Strong planning and organizational skills.

Expected Salary Range

$98,000.00 - $176,000.00

The exact Salary will be determined based on qualifications, experience and location.

If you need a reasonable accommodation for any part of the employment process, please contact us by email at usaccommodations@gf.com and let us know the nature of your request and your contact information. Requests for accommodation will be considered on a case-by-case basis. Please note that only inquiries concerning a request for reasonable accommodation will be responded to from this email address.

An offer with GlobalFoundries is conditioned upon the successful completion of pre-employment conditions, as applicable, and subject to applicable laws and regulations.

GlobalFoundries is fully committed to equal opportunity in the workplace and believes that cultural diversity within the company enhances its business potential. GlobalFoundries goal of excellence in business necessitates the attraction and retention of highly qualified people. Artificial barriers and stereotypic biases detract from this objective and may be illegally discriminatory.

All policies and processes which pertain to employees including recruitment, selection, training, utilization, promotion, compensation, benefits, extracurricular programs, and termination are created and implemented without regard to age, ethnicity, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, sexual orientation, gender identity or expression, veteran status, or any other characteristic or category specified by local, state or federal law

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