Hardware Engineering Jobs in Illinois (NOW HIRING)

Hyve Solutions transforms complex engineering challenges into production reality for technology innovators building AI, cloud, and connected infrastructure. As a US-based manufacturing partner, the company rapidly delivers fast, agile execution through dep technical partnerships and co-innovation, and supply chain clarity. Hyve's integrated ODM, CM, and SI capabilities eliminate vendor complexity while accelerating time-to-market with single-partner accountability from design through scale. The company co-innovates with deep engineering expertise, treating customer success as its own while building tomorrow's digital infrastructure.

Role Overview

Hyve Solutions is expanding its US-based design and engineering capability to support rapid growth in AI infrastructure for the world's largest Hyperscalers. The Senior Hardware Engineering Manager - AI Systems leads a multidisciplinary team of hardware engineers spanning board design, signal and power integrity, thermal, power delivery, and firmware, and is accountable for the day-to-day execution of next-generation GPU and compute server platforms from architecture through high-volume production. Where the Hardware Engineering Director sets organizational strategy across the US design organization, this role owns the engineering team and program delivery within it: building the bench, running the design reviews, and making sure platforms hit their EVT, DVT, and PVT commitments. It is a hands-on leadership position suited to an engineer who still enjoys reviewing a schematic or a channel simulation while managing the people who produce them.

Core Responsibilities

Team leadership. Manage and grow a team of board design, SI/PI, thermal, power delivery, and firmware engineers across Fremont and Portland, owning hiring, onboarding, coaching, and performance development for direct reports.

Program execution. Drive delivery of GPU and compute server platform programs from architecture through EVT, DVT, PVT, and mass production, managing schedule, resource loading, quality, and cross-functional dependencies.

Technical oversight. Provide hands-on technical direction across schematic, layout, SI/PI, thermal, power, and firmware deliverables, guiding design trade-offs and leading complex root-cause debug across hardware, firmware, and system integration.

Design review discipline. Run design reviews and quality gates against Hyve's board design review framework (DR0.1 through DR1.0), and drive measurable improvement in first-pass success, yield, and time to market.

Customer engagement. Act as a primary engineering point of contact for Hyperscaler counterparts on assigned platforms, communicating technical status, risks, and commitments clearly and early.

Cross-geo collaboration. Partner closely with Taiwan design, operations, manufacturing, and validation teams so that designs are globally aligned, manufacturable, and scalable.

Production ramp support. Work with Operations, Manufacturing, and Quality to scale from prototype to high-volume production, and support datacenter deployment with rapid issue triage and corrective action.

Required Qualifications and Skills

Education: Bachelor's or Master's in Electrical Engineering, Computer Engineering, or a related field.

Experience: 12 or more years of hardware engineering experience, including at least 3 years directly managing hardware engineers with hiring and performance responsibility, and proven delivery of server, GPU, or accelerator platforms into high-volume production.

Technical breadth: Working command of board design, high-speed interfaces (PCIe Gen5/Gen6, CXL, NVLink, Ethernet), power delivery networks, thermal design for both air and liquid cooling, and platform firmware, with the judgment to arbitrate trade-offs across those disciplines.

Program management: Demonstrated ownership of multiple concurrent platform programs through EVT, DVT, and PVT, including schedule construction, risk management, and resource planning.

Leadership: A track record of attracting, developing, and retaining engineering talent, and of building team culture in a fast-growing organization.

Communication: Strong written and verbal communication, with the ability to represent engineering decisions to customers, partners, and senior leadership.

Preferred Qualifications

Direct experience supporting Hyperscalers or large cloud providers in an ODM or JDM model.

Experience standing up a new engineering team or site, including recruiting and onboarding at scale.

Familiarity with liquid-cooled AI system design and rack-level integration.

Experience operating across US and Taiwan engineering teams

Compensation: $162K to $220K DOE

Benefit Insurance

• Flexible Spending Account (FSA)

• Health Savings Account (HSA)

• Mental Health Care

• 401K with match

• Paid Holidays, Vacation & Sick Days

• Tuition Reimbursement

• Perks at Work

• LEAP Program

• MyFlexPay