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Full Time Serdes Jobs (NOW HIRING)

Senior FPGA Engineer

Manchester, NH · On-site

$140K - $170K/yr

Experience Required * 10+ years of experience * Full-Time * Onsite role Key Responsibilities ... High-speed data transmission (SERDES, DDR, LVDS) * Hardware integration, debugging, and testing ...

Familiarity with high-speed interfaces such as PCIe, DDR, Ethernet, Aurora, JESD204, or SerDes ... The base salary range for this full-time position is $ 160 K to $170K. Our total compensation ...

Familiarity with high-speed interfaces such as PCIe, DDR, Ethernet, Aurora, JESD204, or SerDes ... The base salary range for this full-time position is $ 160 K to $170K. Our total compensation ...

Deep knowledge of PAM4 signal theory, SerDes architecture, and optical link physics at 200G per ... this full-time position is determined based on a variety of factors including role, experience ...

Design high-speed SERDES interfaces (PCIe, JESD, gigabit links) and DDR4/DDR5 memory interfaces ... a year This is a full time, exempt position, based out of our Saratoga office. The total ...

Digital Design Engineer

Saratoga, CA · On-site

$130K - $225K/yr

Design high-speed SERDES interfaces (PCIe, JESD, gigabit links) and DDR4/DDR5 memory interfaces ... FPGA vendor toolchains (for interface bring-up and debug) This is a full time, exempt position ...

Digital Design Engineer

Saratoga, CA · On-site

$130K - $225K/yr

Design high-speed SERDES interfaces (PCIe, JESD, gigabit links) and DDR4/DDR5 memory interfaces ... a year This is a full time, exempt position, based out of our Saratoga office. The total ...

Deep knowledge of PAM4 signal theory, SerDes architecture, and optical link physics at 200G per ... this full-time position is determined based on a variety of factors including role, experience ...

Electrical Engineer

Santa Clara, CA · On-site

$68K - $161K/yr

Work on high-speed interfaces such as PCIe, DDR, Ethernet, USB, and SerDes. * Review signal ... Capgemini offers a comprehensive, non-negotiable benefits package to all regular, full-time ...

... (8+ years) for permanent , full-time , onsite roles in Silicon Valley supporting advanced ... Ethernet (802.3), MAC / PCS / SerDes / PHY * High-speed designs (100G+ preferred) * Tapeout ...

Proven experience with analog floor planning and layout for complex modules such as SerDes, ADC/DAC ... Capgemini offers a comprehensive, non-negotiable benefits package to all regular, full-time ...

Proven experience with analog floor planning and layout for complex modules such as SerDes, ADC/DAC ... Capgemini offers a comprehensive, non-negotiable benefits package to all regular, full-time ...

Showing results 41-60

Full Time Serdes information

See salary details

$80.5K

$141.4K

$290.5K

How much do full time serdes jobs pay per year?

As of Aug 14, 2026, the average yearly pay for full time serdes in the United States is $141,351.00, according to ZipRecruiter salary data. Most workers in this role earn between $95,000.00 and $158,000.00 per year, depending on experience, location, and employer.

What are the most commonly searched types of Serdes jobs?

The most popular types of Serdes jobs are:

Infographic showing various Full Time Serdes job openings in the United States as of August 2026, with employment types broken down into 96% Full Time, and 4% Contract. Highlights an 86% Physical, 7% Hybrid, and 7% Remote job distribution, with an average salary of $141,351 per year, or $68 per hour.

Senior/Principal Engineer with Signal/Power Integrity, Multiphysics, PDK/ADK Experience

Nityo Infotech

Austin, TX • On-site

$165K/yr

Full-time

Re-posted 4 days ago


Job description

Role: Senior/Principal Engineer with Signal/Power Integrity, Multiphysics, PDK/ADK Experience

Location: Austin, TX (HYBRID)

Job Type: FULL TIME

MUST HAVE: SI/PI - Signal Integrity /Power Integrity, Multiphysics simulations, Advanced packaging, Heterogeneous integration platforms, multi-material packages, PDK/ADK simulation collateral Experience

Job Description:

What You’ll Do

  • Own and execute hands-on SI/PI and multiphysics simulations for advanced 2.5D/3.0D heterogeneous integration and multi-material packages.
  • Perform modeling, extraction, and verification of high-speed interconnects, power delivery networks, thermal management, and mechanical stress across chiplets and advanced substrates.
  • Build and validate comprehensive ADK/PDK models (electrical, EM, thermal, mechanical) that accurately represent package-level behavior and enable system-level co-design.
  • Run end-to-end simulation workflows including EM extraction, S-parameter generation, PDN impedance analysis, crosstalk/eye diagram simulations, thermal/structural reliability checks, and co-simulation across domains.
  • Collaborate directly with EDA vendors (Cadence, Ansys, Synopsys, Siemens, Keysight, etc.), OSATs, and foundries to develop, test, and refine package simulation flows.
  • Generate user guides, reference flows, scripts, and automation that make SI/PI/multiphysics enablement repeatable and accessible to design teams.
  • Stay current with next-gen interface standards (PCIe Gen6/7, CXL, UCIe, UALink, SerDes, HBM) and incorporate their requirements into package design methodologies.
  • Guide technical strategy for SI/PI flows, mentor junior engineers, and represent TIE in working groups, customer design reviews, and industry forums.

Required Qualifications:

  • BS in Electrical Engineering, Computer Engineering, Applied Physics, or related discipline.
  • 8+ years (Senior) / 12+ years (Principal) of direct, hands-on experience in signal integrity, power integrity, and multiphysics simulations for advanced packaging, 2.5D/3DIC, or heterogeneous integration platforms.
  • Strong expertise with EDA/EM/multiphysics tools: Ansys HFSS/SIwave, Cadence Sigrity/Clarity, Synopsys RaptorX, Siemens HyperLynx, Keysight ADS, COMSOL, CST Studio.
  • Proven ability to extract/package-level models (RLC, S-parameters, dielectric/thermal constants, warpage/stress data) and integrate them into design enablement flows.
  • Demonstrated experience creating and validating PDK/ADK simulation collateral spanning SI/PI, RF, thermal, and mechanical domains.
  • Hands-on scripting/automation skills (Python, Tcl, SKILL, etc.) to streamline simulation flows.
  • Startup DNA. You’re energized by ambiguity, act with urgency, and take personal ownership for outcomes. You make things happen.
  • Execution mindset. You have demonstrated experience working in a hands-on role driving progress across multiple initiatives without layers of management.
  • Location. Austin, Texas is preferred for close collaboration with our engineering teams and partners. Hybrid work arrangements may be possible with travel up to 30–50%.  Such arrangements are subject to University review and approval in relation to jurisdictional employment-related laws, rules, and regulations.

Preferred Qualifications:

  • MS or PhD in Electrical Engineering, Applied Physics, or related discipline.
  • Deep experience with multi-material packages (Si, glass, organics, Cu, RDL, TSV, hybrid bonding, etc.).
  • Expertise in system-level co-simulation spanning electrical, thermal, and mechanical domains for high-power/high-bandwidth-density packages.
  • Familiarity with industry standards (IEEE, JEDEC, OIF, UCIe, 3Dblox, JEP30) and experience contributing to working groups.
  • Background in high-speed interconnect modeling and compliance testing for PCIe, CXL, UCIe, SerDes, HBM, or similar standards.
  • Track record of technical publications, patents, or open-source contributions in SI/PI/multiphysics simulation and design enablement.