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Freelance Principal Packaging Engineer Jobs (NOW HIRING)

Schwans

Principal Packaging Process Engineer

Hopkins, MN · On-site

$107K - $178K/yr

We are hiring a Principal Packaging Process Engineer in our R&D Team supporting our Asian Business, and this person will be responsible for supporting package development projects that meet business ...

Qualcomm

Principal IC Packaging Engineer

San Diego, CA · On-site

We are seeking a highly motivated Principal IC Packaging Engineer to lead the development of advanced integrated circuit (IC) packaging technologies. This role focuses on spearheading new product ...

Medtronic

Packaging Engineer

North Haven, CT

Additionally, the Packaging Engineer will provide support in the areas of cost reductions ... Roles below the Principal level require candidates to possess unrestricted U.S. work authorization ...

Gregg Carroll Recruiting Services

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Principal Optoelectronic Packaging Engineer

San Diego, CA · On-site

$187K - $212K/yr

Principal Optoelectronic Packaging Engineer Location: San Diego, CA | Santa Clara, CA | Colorado Springs, CO Relocation Assistance Available: The preferred location for this position is in San Diego ...

Medtronic

Packaging Engineer

North Haven, CT · On-site

Additionally, the Packaging Engineer will provide support in the areas of cost reductions ... Roles below the Principal level require candidates to possess unrestricted U.S. work authorization ...

Medtronic

Packaging Engineer

North Haven, CT · On-site

Additionally, the Packaging Engineer will provide support in the areas of cost reductions ... Roles below the Principal level require candidates to possess unrestricted U.S. work authorization ...

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All JobsFreelance Principal Packaging Engineer Jobs

Freelance Principal Packaging Engineer information

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$74K

$147.2K

$212.5K

How much do freelance principal packaging engineer jobs pay per year?

As of Jun 14, 2026, the average yearly pay for freelance principal packaging engineer in the United States is $147,220.00, according to ZipRecruiter salary data. Most workers in this role earn between $118,500.00 and $173,000.00 per year, depending on experience, location, and employer.

What is the difference between Freelance Principal Packaging Engineer vs Contract Packaging Engineer?

AspectFreelance Principal Packaging EngineerContract Packaging Engineer
CredentialsEngineering degree, industry certificationsEngineering degree, industry certifications
Work EnvironmentIndependent, project-based, consultingTemporary, client-site or remote, project-specific
Employer/Industry UsageConsultants, freelance platforms, packaging firmsManufacturers, packaging companies, contract firms

The Freelance Principal Packaging Engineer typically provides high-level expertise on a freelance basis, focusing on strategic packaging design and innovation. In contrast, a Contract Packaging Engineer usually works on specific packaging projects for a limited period, often on-site or remotely, executing defined tasks. Both roles require similar credentials but differ mainly in scope, independence, and project engagement style.

More about Freelance Principal Packaging Engineer jobs
What cities are hiring for Freelance Principal Packaging Engineer jobs? Cities with the most Freelance Principal Packaging Engineer job openings:
What are the most commonly searched types of Principal Packaging Engineer jobs? The most popular types of Principal Packaging Engineer jobs are:
What states have the most Freelance Principal Packaging Engineer jobs? States with the most job openings for Freelance Principal Packaging Engineer jobs include:
What job categories do people searching Freelance Principal Packaging Engineer jobs look for? The top searched job categories for Freelance Principal Packaging Engineer jobs are:
Freelance Principal Packaging Engineer jobs near you
Infographic showing various Freelance Principal Packaging Engineer job openings in the United States as of June 2026, with employment types broken down into 96% Full Time, and 4% Part Time. Highlights an 87% Physical, 5% Hybrid, and 8% Remote job distribution, with an average salary of $147,220 per year, or $70.8 per hour.
Principal Packaging Engineer

Principal Packaging Engineer

Alpha & Omega Semiconductor

Sunnyvale, CA • On-site

$170K - $220K/yr

Full-time

Posted 6 days ago

Job description

At Alpha and Omega Semiconductor (AOS), we design, develop and globally supply a broad range of power semiconductors, including a wide portfolio of Power MOSFET, IGBT, IPM, TVS, GaN/SiC, Power IC and Digital Power products. You will find our products in everyday applications including personal computers, graphic cards, gaming consoles, TVs, home appliances, smart phones, power tools, and more! At the center of our innovation is our people who bring passion, talent, and a collaborative atmosphere to our growing company. We offer an impressive benefit package and career development opportunities. If you are ready to take the next step in your career working with a team of passionate and talented people, then take a look at the job opportunity below to POWER your career!

Overall Purpose of Position: To work with Product Lines (both Discrete and PIC and IPM) on the package developments including thermal and stress simulation for internal and external requests.

Primary Job Responsibilities/Duties:

  • Interact with Product Lines, Product Engineers and Silicon Designers in US and overseas on package design.
  • Interact with internal assembly site and external OSAT (Out Sourcing Assembly and Testing) partners on the package designs and carry out from concepts to MP
  • Interact with material suppliers, such as LF, clip, solder, mold compound and assembly tools for assembly process enhancements.

Qualifications:

  • 10+ years of experiences in Power Electronics package design (Si, GaN, SiC; LF based, substrate based)
  • MS degree and above
  • Experience in AutoCAD and SoldWorks for package designs
  • Experiences Ansys for thermal and stress simulation
  • Lead Frame (LF), design, clip design, wire bond
  • Experiences in RD concept development and novel power electronics packaging technologies
  • Experience with assembly manufacturing processes and environment (soldering, die attach, wire bonding and molding
  • Experiences in MIS substrate design and IPM design is a plus
  • Professional communication in technical subjects with internal and external groups.

Alpha and Omega Semiconductor, Inc is committed to diversity in our workplace. Qualified applicants will receive consideration for employment without regard to, and will not be discriminated against based on race, age, color, ethnicity, marital status, sex, religion, national origin, sexual orientation, gender, gender identity, disability, protected veteran status or any other category protected by federal, state or local law.


Job Posted by ApplicantPro