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Fib Tem Engineer Jobs in Georgia (NOW HIRING)

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Fib Tem Engineer information

What are FIB TEM Engineers?

FIB TEM Engineers are specialized professionals who operate Focused Ion Beam (FIB) and Transmission Electron Microscopy (TEM) equipment to analyze and prepare samples at the micro and nano scale. They play a crucial role in material science, semiconductor manufacturing, and failure analysis by enabling detailed imaging and precise sample modification. Their expertise helps in understanding material properties, identifying defects, and supporting research and development in advanced technology fields.

What are the key skills and qualifications needed to thrive as a FIB TEM Engineer, and why are they important?

To thrive as a FIB TEM Engineer, you need a solid background in materials science, electron microscopy, and focused ion beam (FIB) techniques, often supported by a relevant engineering or science degree. Proficiency in operating FIB-SEM and TEM instruments, as well as familiarity with sample preparation protocols and image analysis software, is essential. Attention to detail, problem-solving ability, and effective communication are vital soft skills for successful collaboration and accurate analysis. Mastering these skills and tools ensures precise sample preparation and high-quality imaging, which are critical for research and product development in advanced technology fields.

What is the difference between Fib Tem Engineer vs Fib Insulation Installer?

AspectFib Tem EngineerFib Insulation Installer
CredentialsEngineering degree, certifications in thermal or mechanical engineeringHigh school diploma or equivalent, on-the-job training
Work EnvironmentDesign offices, construction sites, industrial facilitiesConstruction sites, residential and commercial buildings
Industry UsageDesign and oversee insulation systems, thermal managementInstall insulation materials, ensure proper application

Fib Tem Engineers focus on designing and planning insulation systems, requiring engineering credentials and working in design or supervisory roles. Fib Insulation Installers execute the installation process on-site, often with less formal education but practical training. Both roles are essential in the insulation industry, but they differ in responsibilities, credentials, and work environments.

What are some typical challenges Fib TEM Engineers face when preparing samples for transmission electron microscopy analysis?

Fib TEM Engineers often encounter challenges such as achieving precise, artifact-free sample preparation due to the delicate and small-scale nature of the specimens. Managing contamination, minimizing damage from the focused ion beam, and producing ultra-thin lamellae suitable for high-resolution imaging require meticulous technique and attention to detail. Additionally, coordinating with researchers to meet specific analysis requirements and maintaining equipment calibration are common aspects of the role. Successfully overcoming these challenges is key to delivering high-quality data for advanced materials characterization.
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Fib Tem Engineer jobs near you
Infographic showing various Fib Tem Engineer job openings in Georgia as of June 2026, with employment types broken down into 35% Internship, 1% As Needed, 54% Full Time, 2% Part Time, 7% Contract, and 1% Summer. Highlights an 94% Physical, 3% Hybrid, and 3% Remote job distribution.

Dielectric and Polymer Materials Engineer

Absolics Inc

Covington, GA

$90K - $150K/yr

Full-time

Posted 29 days ago

Job description

Job Title: R&D Engineer - Dielectric and Polymer Materials Expert for Advanced Packaging applications

Location: Covington, GA

Job Type: Full-Time

About Us: Absolics is a leading provider of advanced packaging technologies and services, offering scalable solutions for businesses of high-performance computing. We offer smart, innovative services to dozens of clients globally. By dedicating our efforts to establishing large glass substrates with built-in active and passive elements, our goal is to provide significant improvement in signaling characteristics and power consumption compared to existing solutions.

Job Description:

You will lead efforts to evaluate, down select and integrate the various Advanced Packaging Organic and Polymeric materials critical to advanced packaging process flows, with responsibility spanning material selection, film deposition or lamination, patterning, and cure characterization. In addition, you will oversee evaluation of material performance with respect to reliability testing and collaborate with downstream assembly teams to understand incoming assembly. Requirements. This role requires both materials science depth and process integration awareness. You will evaluate both emerging and established dielectric systems and drive their optimization across electrical, mechanical, and reliability dimensions.

Key Responsibilities:

  • Characterize dielectric film properties (electrical, thermal, mechanical) and correlate to process and reliability outcomes
  • Select, qualify, and support process window definition of advanced packaging dielectrics (example ABF, PBO, PSPI, polyimide, inorganic films) for RDL build-up
  • Support determination of optimal processing conditions for these materials across the various process teams critical to the overall fabrication process flow
  • Evaluate emerging dielectric materials and technologies (e.g., low-Dk/Df, glass core compatible systems) for roadmap fit
  • Develop and optimize cure, lamination, or photopatterning sequences for novel dielectric layers being tested
  • Investigate and resolve adhesion, delamination, cracking, or CTE-mismatch failures through materials and process analysis
  • Run reliability qualification testing (HAST, TCT) and interpret dielectric-driven failure mechanisms

Required Skills:

  • Hands-on experience evaluating, processing and/or successful qualification of two or more advanced packaging dielectrics, example ABF, PBO, PSPI, PID, Solder resist or BCB
  • Deep knowledge of dielectric patterning approaches: photoexposure, develop, and cure sequences for photosensitive materials; or lamination and laser drill for non-photosensitive films
  • Extensive experience with film characterization: ellipsometry, FTIR, TGA/DSC, profilometry, nanoindentation
  • Understanding of dielectric-to-metal adhesion, CTE mismatch, and stress management in multilayer stacks
  • Experience with electrical characterization of dielectric films (Dk, Df, leakage, breakdown voltage)
  • Ability to execute reliability testing per JEDEC standards (HAST, uHAST, TCT) and interpret failure mechanisms
  • Fluent in English; proficiency in Korean is a plus.

Preferred Skills

  • Direct experience with glass core or glass interposer dielectric process integration
  • Deep Familiarity with low-Dk/low-Df materials targeting high-frequency and AI/HPC applications
  • Knowledge of plasma-enhanced CVD or PVD inorganic dielectrics for thin-film packaging
  • Experience with CMP of dielectric films in damascene or hybrid bonding contexts
  • Background in failure analysis of dielectric delamination, cracking, or via integrity (FIB-SEM, TEM, laminography)
  • Familiarity with JEDEC and IPC qualification standards for substrate dielectrics
  • Track record of material supplier engagement and collaborative efforts for material testing and qualification
  • Publication record or patent activity in dielectric materials for packaging is a plus

Education

  • Ph.D. in Materials Science, Polymer Science, Chemical Engineering, Electrical Engineering, or related field preferred
  • M.S. with 3+ years of relevant industry or research experience considered

Benefits:

  • 401K 6% matching (NO vesting period)
  • Healthcare 100% support (Health, Dental, Vision)
  • Life, STD, LTD 100 % support
  • Cell phone allowance
  • PTO and self-development

SALARY:

  • $90,000 – $150,000