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Failure Analysis Engineer Aerospace Jobs (NOW HIRING)

APPLIED OPTOELECTRONICS INC

A failure analysis engineer for the process integration team will be responsible for failure analysis of semiconductor optical laser devices. He/She should have experience with front-end and back-end ...

Zipline

Failure Analysis Engineer

San Francisco, CA · On-site

As a Failure Analysis Engineer, you will investigate failures from fielded systems, development ... Experience in aerospace, robotics, automotive, medical devices, or high-volume electronics. What ...

Solidigm

Failure Analysis Engineer

Rancho Cordova, CA · On-site

$121K - $194K/yr

This Senior Failure Analysis Engineer will debug Solid State Drive (SSD) failures discovered during internal validation as well as field failures from our customers. They will need to work on variety ...

Solidigm

Failure Analysis Engineer

Rancho Cordova, CA · Hybrid

This Senior Failure Analysis Engineer will debug Solid State Drive (SSD) failures discovered during internal validation as well as field failures from our customers. They will need to work on variety ...

Power Integrations

Failure Analysis Engineer

San Jose, CA · On-site

$76K - $121K/yr

Description Silicon level Failure Analysis Engineer will perform device level failure analysis to support RMA and customer issues. Responsibilities: • Performing fault isolation and defect analysis ...

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How much do failure analysis engineer aerospace jobs pay per year?

As of Sep 13, 2026, the average yearly pay for failure analysis engineer aerospace in the United States is $93,179.00, according to ZipRecruiter salary data. Most workers in this role earn between $70,000.00 and $118,000.00 per year, depending on experience, location, and employer.

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Failure Analysis Engineer

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APPLIED OPTOELECTRONICS INC
Telecommunications • 1 - 5K employees
Learn more about APPLIED OPTOELECTRONICS INCexternal

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Medical, Dental, Vision, Retirement, PTO

Posted 14 days ago

Key responsibilities

  • Perform failure analysis of semiconductor optical laser devices, including device decap, microscopic inspection, and SEM analysis.

  • Utilize FIB to prepare TEM samples and conduct high-resolution imaging to identify atomic-level defects.

  • Analyze structural, electrical, and physical defects using material characterization techniques and document findings in technical reports.

Job description

AOI is committed to providing equal opportunity in all of our employment practices, including hiring, placement, promotion, training, transfer and compensation, to all qualified applicants and employees without regard to race, color, national origin, citizenship, religion, sex, veteran status, age, disability, marital status, or any other category protected by State or U.S. Federal law. Moreover, we endeavor to treat our employees fairly.

A failure analysis engineer for the process integration team will be responsible for failure analysis of semiconductor optical laser devices. He/She should have experience with front-end and back-end-of-line, and packaging processing. Good understanding of reliability evaluation techniques and understanding failure analysis experience is desirable. He/she will collaborate with other individuals and functional teams, define projects, address issues, develop improvement plans, and finally to document and deliver the desired end results.

Job Duties

Responsible for internal failure analysis including device decap, internal microscopic and SEM inspection, internal measurement data analysis.

Hands-on experiences on sample Preparation & Imaging: Utilize Focused Ion Beam (FIB) to prepare TEM samples and perform high-resolution imaging (HR-STEM) to identify defects at the atomic level.

Root Cause Analysis: Analyze structural, electrical, and physical defects in semiconductor devices, identifying issues related to yield, reliability, or process.

Material Characterization: Apply Energy Dispersive X-ray Spectroscopy (EDX/EDS) and other analytical techniques (SIMS, XPS, SEM) to characterize materials.

Reporting & Collaboration: Document findings in detailed technical reports, present data to cross-functional teams (design, process, QA), and support continuous improvement initiatives.

Equipment Maintenance: Ensure high uptime of TEM/FIB equipment through routine calibration and troubleshooting.

Qualifications

Hands-on experience with Transmission Electron Microscopy (TEM) and FIB in a lab or manufacturing environment (typically 1–3+ years).

Master’s degree or Ph.D in Material Science Engineering, Electrical Engineering, Physics, or related discipline plus 1 year of working experience in semiconductor laboratory or fabrication is preferred.

Knowledge of compound semiconductor device theory is desired.

Microsoft Access, SQL, LabVIEW and other programing skills preferred.

Experience with DOE techniques and SPC (Statistical Process Control) is preferred.

Strong data analysis and problem solving skills.

Detail oriented and self-motivated.

Ability to work independently and as a team.

Ability to work in clean room environment wearing smock

Excellent interpersonal and communication skills for successful inter and intra-group interactions.

Physical Demands and Work Environment

Subject to noise, vibration, dust, odors, and exposure to toxic or caustic chemicals.

The associate work in a manufacturing environment and be require to wear personal protective equipment.

Location

This position will be on-site based in Sugar Land, Texas.

WHY AOI?

Flexible and competitive health (medical, dental, vision) plans offer the employee with the right options to meet individual needs

Employer matching on 401(k) deferrals

Unused PTO payout at end of the year

Relocation package available within US

Immigration sponsorships (Must be currently authorized to work in the US)

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