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Electronics Device Failure Analysis Engineer Jobs

APPLIED OPTOELECTRONICS INC

A failure analysis engineer for the process integration team will be responsible for failure ... Job Duties Responsible for internal failure analysis including device decap, internal microscopic ...

samtec

Failure Analysis Engineer

Colorado Springs, CO · On-site

$80K - $110K/yr

If your favorite part of engineering is rolling up your sleeves, tearing things apart, and figuring ... Understand the customers' failure description and perform failure analysis on optical-electronic ...

Samtec

Failure Analysis Engineer

Colorado Springs, CO

$80K - $110K/yr

If your favorite part of engineering is rolling up your sleeves, tearing things apart, and figuring ... Understand the customers' failure description and perform failure analysis on optical-electronic ...

Samtec

Failure Analysis Engineer

Colorado Springs, CO · On-site

$80K - $110K/yr

If your favorite part of engineering is rolling up your sleeves, tearing things apart, and figuring ... Understand the customers' failure description and perform failure analysis on optical-electronic ...

Samtec, Inc

Failure Analysis Engineer

Colorado Springs, CO · On-site

$80K - $110K/yr

Samtec is seeking a Failure Analysis Engineer to join the Engineering Support Group (ESG) team ... Understand the customers' failure description and perform failure analysis on optical-electronic ...

System One

Failure Analysis Engineer

Austin, TX · On-site

Failure Analysis Engineer Location: Austin, TX Type: Direct Hire Requirements: * BS in Mechanical ... Interface directly with process engineering and device teams to translate findings into yield ...

System One

Failure Analysis Engineer

Austin, TX · On-site

Failure Analysis Engineer Location: Austin, TX Type: Direct Hire Requirements: * BS in Mechanical ... Interface directly with process engineering and device teams to translate findings into yield ...

Zipline

Failure Analysis Engineer

San Francisco, CA

As a Failure Analysis Engineer, you will investigate failures from fielded systems, development ... Hands-on comfort working with electronics, hardware assemblies, and laboratory equipment. * Ability ...

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Electronics Device Failure Analysis Engineer information

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How much do electronics device failure analysis engineer jobs pay per year?

As of Sep 11, 2026, the average yearly pay for electronics device failure analysis engineer in the United States is $88,896.00, according to ZipRecruiter salary data. Most workers in this role earn between $59,500.00 and $109,500.00 per year, depending on experience, location, and employer.

What does an electronics device failure analysis engineer do?

An Electronics Device Failure Analysis Engineer investigates why electronic components or devices fail during manufacturing, testing, or in the field. They use specialized techniques and tools such as microscopy, electrical testing, and X-ray analysis to identify the root causes of failures. Their findings help improve product reliability, guide design improvements, and prevent future failures. These engineers often collaborate with design, manufacturing, and quality teams to implement corrective actions and optimize processes.

What are the key skills and qualifications needed to thrive as an electronics device failure analysis engineer?

To thrive as an Electronics Device Failure Analysis Engineer, you need a solid background in electrical engineering, semiconductor physics, and hands-on experience with device characterization, typically supported by a relevant degree. Proficiency with tools like scanning electron microscopes (SEM), focused ion beam (FIB) systems, and failure analysis software is essential, along with knowledge of industry standards and certifications such as IPC or IEEE. Strong analytical thinking, attention to detail, and effective communication skills help engineers accurately diagnose failures and present findings to cross-functional teams. These competencies are crucial for identifying root causes, driving product improvements, and ensuring reliability in high-stakes electronics manufacturing environments.

What are the typical challenges faced by electronics device failure analysis engineers when diagnosing complex failures?

Electronics Device Failure Analysis Engineers often encounter challenges related to isolating root causes in highly integrated and miniaturized devices. These challenges may include distinguishing between process-related defects and operational wear, interpreting subtle physical or electrical anomalies, and working with limited access to proprietary design data. Collaboration with design, manufacturing, and quality assurance teams is essential to gather detailed background information and ensure effective problem resolution. Staying up-to-date with advanced analytical tools and methodologies also plays a crucial role in overcoming these challenges.

What are popular job titles related to Electronics Device Failure Analysis Engineer jobs?

For Electronics Device Failure Analysis Engineer jobs, the most frequently searched job titles are:

Infographic showing various Electronics Device Failure Analysis Engineer job openings in the United States as of September 2026, with employment types broken down into 1% Internship, 85% Full Time, 12% Part Time, and 2% Contract. Highlights an 81% Physical, 4% Hybrid, and 15% Remote job distribution, with an average salary of $88,896 per year, or $42.7 per hour.

Failure Analysis Engineer

On-site

APPLIED OPTOELECTRONICS INC
Telecommunications • 1 - 5K employees
Learn more about APPLIED OPTOELECTRONICS INCexternal

Other

Medical, Dental, Vision, Retirement, PTO

Posted 12 days ago

Key responsibilities

  • Perform failure analysis of semiconductor optical laser devices, including device decap, microscopic inspection, and SEM analysis.

  • Utilize FIB to prepare TEM samples and conduct high-resolution imaging to identify atomic-level defects.

  • Analyze structural, electrical, and physical defects using material characterization techniques and document findings in technical reports.

Job description

AOI is committed to providing equal opportunity in all of our employment practices, including hiring, placement, promotion, training, transfer and compensation, to all qualified applicants and employees without regard to race, color, national origin, citizenship, religion, sex, veteran status, age, disability, marital status, or any other category protected by State or U.S. Federal law. Moreover, we endeavor to treat our employees fairly.

A failure analysis engineer for the process integration team will be responsible for failure analysis of semiconductor optical laser devices. He/She should have experience with front-end and back-end-of-line, and packaging processing. Good understanding of reliability evaluation techniques and understanding failure analysis experience is desirable. He/she will collaborate with other individuals and functional teams, define projects, address issues, develop improvement plans, and finally to document and deliver the desired end results.

Job Duties

Responsible for internal failure analysis including device decap, internal microscopic and SEM inspection, internal measurement data analysis.

Hands-on experiences on sample Preparation & Imaging: Utilize Focused Ion Beam (FIB) to prepare TEM samples and perform high-resolution imaging (HR-STEM) to identify defects at the atomic level.

Root Cause Analysis: Analyze structural, electrical, and physical defects in semiconductor devices, identifying issues related to yield, reliability, or process.

Material Characterization: Apply Energy Dispersive X-ray Spectroscopy (EDX/EDS) and other analytical techniques (SIMS, XPS, SEM) to characterize materials.

Reporting & Collaboration: Document findings in detailed technical reports, present data to cross-functional teams (design, process, QA), and support continuous improvement initiatives.

Equipment Maintenance: Ensure high uptime of TEM/FIB equipment through routine calibration and troubleshooting.

Qualifications

Hands-on experience with Transmission Electron Microscopy (TEM) and FIB in a lab or manufacturing environment (typically 1–3+ years).

Master’s degree or Ph.D in Material Science Engineering, Electrical Engineering, Physics, or related discipline plus 1 year of working experience in semiconductor laboratory or fabrication is preferred.

Knowledge of compound semiconductor device theory is desired.

Microsoft Access, SQL, LabVIEW and other programing skills preferred.

Experience with DOE techniques and SPC (Statistical Process Control) is preferred.

Strong data analysis and problem solving skills.

Detail oriented and self-motivated.

Ability to work independently and as a team.

Ability to work in clean room environment wearing smock

Excellent interpersonal and communication skills for successful inter and intra-group interactions.

Physical Demands and Work Environment

Subject to noise, vibration, dust, odors, and exposure to toxic or caustic chemicals.

The associate work in a manufacturing environment and be require to wear personal protective equipment.

Location

This position will be on-site based in Sugar Land, Texas.

WHY AOI?

Flexible and competitive health (medical, dental, vision) plans offer the employee with the right options to meet individual needs

Employer matching on 401(k) deferrals

Unused PTO payout at end of the year

Relocation package available within US

Immigration sponsorships (Must be currently authorized to work in the US)

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