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Dry Etch Process Jobs (NOW HIRING)

As a Dry Etch Process Engineer you will build, integrate, and optimize plasma etch processes that enable next-generation memory devices. You will work hands-on with etch equipment, chamber hardware ...

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Dry Etch Process information

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How much do dry etch process jobs pay per hour?

As of Sep 13, 2026, the average hourly pay for dry etch process in the United States is $24.67, according to ZipRecruiter salary data. Most workers in this role earn between $19.71 and $28.12 per hour, depending on experience, location, and employer.

What is a dry etch process engineer?

A Dry Etch Process engineer is a specialist in semiconductor manufacturing who uses plasma or other gases to remove material from the surface of silicon wafers in a controlled manner, without using liquid chemicals. This process is crucial for defining microscopic features on chips and ensuring high precision in device fabrication. Dry etching allows for cleaner, more accurate pattern transfers compared to wet etching, which uses liquid solutions. Engineers in this field monitor and optimize process parameters to achieve the desired results while minimizing defects and maintaining yield.

What are the key skills and qualifications needed to thrive as a dry etch process engineer?

Success as a Dry Etch Process Engineer requires a solid background in materials science, semiconductor manufacturing, and process engineering, often supported by a degree in engineering or a related field. Familiarity with plasma etching equipment, statistical process control (SPC) software, and cleanroom protocols is essential. Strong problem-solving skills, attention to detail, and effective teamwork abilities help individuals excel in this role. These competencies are critical to ensuring precise, efficient wafer fabrication and maintaining product quality in high-tech manufacturing environments.

What are some common challenges faced by dry etch process engineers, and how can new hires effectively address them?

Dry Etch Process Engineers often face challenges such as maintaining process uniformity, troubleshooting equipment issues, and optimizing recipes for yield and throughput. New hires can effectively address these challenges by developing a thorough understanding of process parameters, collaborating closely with equipment and integration engineers, and proactively participating in cross-functional problem-solving meetings. Ongoing training and hands-on experience with etch tools, as well as staying current with best practices, will also help new engineers quickly contribute to process improvements.

What is the difference between Dry Etch Process vs Wet Etch Process?

AspectDry Etch ProcessWet Etch Process
CredentialsTypically requires knowledge of plasma physics and cleanroom protocolsRequires understanding of chemical handling and safety procedures
Work EnvironmentCleanroom with plasma and vacuum equipmentLaboratory or manufacturing setting with chemical baths
Industry UsageSemiconductor fabrication, microelectronicsMicrofabrication, MEMS, and some semiconductor processes
Common Search/ComparisonOften compared for precision and selectivityCompared for cost and simplicity

Dry etch processes use plasma and gases to etch materials with high precision, suitable for complex patterns. Wet etch involves chemical solutions that remove material more simply but with less control. Both are essential in semiconductor manufacturing, but dry etch offers better anisotropy and control, while wet etch is faster and more cost-effective for certain applications.

Infographic showing various Dry Etch Process job openings in the United States as of July 2026, with employment types broken down into 3% As Needed, 86% Full Time, 10% Part Time, and 1% Contract. Highlights an 99% Physical, and 1% Remote job distribution, with an average salary of $51,319 per year, or $24.7 per hour.

Process Engineer, Dry Etch

Temecula, CA • On-site

Skorpios Technologies Inc
Telecommunications • 11 - 50 employees

$100K - $150K/yr

Full-time

Medical, Dental, Vision, Life, Retirement, PTO

Re-posted 25 days ago


Job description

Description:

The Dry Etch Process Engineer is responsible to help support the development of manufacturable, repeatable, and high yielding processes for state-of-the-art highly specialized devices in the fields of Aerospace, Defense, Bioelectronics, and High-Speed Communications.

  • Partner with Integration Engineers, Customers, and Other Development Engineers to execute experiments and adjust or optimize processes for Fab Operation.
  • Partner with Product Engineering and Integration to help ensure effective new products and process introductions as well as consistent device performance and quality.
  • Guide and assist Process Technicians through challenging process steps.
  • Analyze metrology results and disposition lots based on data and pass/fail criteria.
  • Report and summarize results from the metrology analysis and provide guidance to Integration Engineering Team and Process Development Engineering Team.
  • Provide effective pass-downs to support uninterrupted operation for Dry Etch activities.
  • Sustain and improve processes for wafer fabrication.
  • Partner with equipment engineering, operation, and management to improve cycle time, tool availability, quality, and product yields.
  • Using Document Control, Process Work Instructions, and Manufacturing Execution Systems, preserve working knowledge of all codes and standards applicable to assigned production equipment.
  • Assure that the manufactured products conform to specifications and application requirements.
  • Partner with Senior Development Engineering team and Integration teams to resolve deviations or technical issues by establishing a list of hypotheses, defining the experiment to validate or invalidate hypothesis, identify root-causes, implement corrective actions, document improved process, and train operations
  • Sustain existing processes in the areas of, Reactive Ion Etching (RIE), Deep RIE (DRIE), Magnetron RIE (MRIE), Inductively Coupled Plasma etching (ICP), Microwave Ashing, Transformer Coupled Plasma etching (TCP), Dipole Ring Magnetron etching (DRM) and Barrel etching, etch process recipe creations, inspections, defects control, and standard Dry Etch related metrology such as ellipsometry or profilometry.
  • Create and maintain operating specifications for production processes and equipment.
  • Monitor process health with Statistical Process Control (SPC) and respond to out-of-control event following out-of-control action plans.
Requirements:
  • Processing experience in a fab in the area of Dry Etch processing using Reactive Ion Etching (RIE), Deep RIE (DRIE), Magnetron RIE (MRIE), Inductively Coupled Plasma etching (ICP), and Microwave Ashing
  • Experience with Statistical Process Control (SPC)
  • Basic understanding of algebraic concepts
  • Data extraction, analysis, and reporting experience
  • Basic understanding of Semiconductor processing
  • Ability to troubleshoot basic problems and address root causes
  • Ability to understand all maintenance activity details required to ensure a healthy and repeatable process
  • Ability to plan and prioritize activities, perform and monitor multiple overlapping tasks/operations to meet goals and timelines
  • Ability to operate processing tools, write and run Dry Etch recipes, inspect wafers under the microscope, and perform basic characterization related to Dry Etch processing with particles / defects metrology, and thickness / uniformity metrology
  • Must be able to work offset shifts: Front-End Days (starts on Sundays, ends on Thursdays) or Back-End Days (starts on Tuesdays, ends Saturdays).
  • BS in Electrical Engineering, Material Science, Physics, Chemistry, or related + 9 years, MS + 7 years, or Ph.D. + 4 years

Competencies

  • Hands-on mindset
  • Excellent Communication skills
  • Collaboration
  • Quick Learner
  • Strong interpersonal skills
  • Self-starter
  • Prioritization
  • Accountability
  • Innovative

Work Environment

80%+ of work is performed in the Fab, which a temperature-controlled cleanroom environment that requires the use of a full-body gown, over-boots, over-hood, safety glasses, and other PPE. The use of personal protective equipment to prevent exposure to hazardous materials can be expected. Frequent gowning and de-gowning is required. Frequent interruptions, static noise, and alarms (auditory and flashing lights) can be expected.


Physical Demands

  • Frequently in a stationary position, often sitting and/or standing for prolonged periods (3 hours)
  • Frequently viewing a computer monitor for prolonged periods (3 hours)
  • Frequently walking around the Fab for prolonged periods (3 hours)
  • Occasionally required to push and/or pull 50+ lbs objects, such as tool components
  • Occasionally required to lift 50+ lbs and occasionally carry that amount short distances (# ft)
  • Occasionally required reach, bend, twist, squat, kneel, and stoop to access and work on tools in the Fab
    • May often require repetitive motions involving the wrists, hands, and/or fingers
    • May require different positions and motions in tight and confined spaces
  • Occasionally required to handle items using small ranges of motion (e.g. fingers and hands) and large ranges of motion (e.g., full-arms and shoulders) for carrying cassettes and lot boxes
  • Constantly required to wear PPE

Why Skorpios?

At Skorpios, you will be at the forefront of the silicon photonics revolution. We offer the chance to work on truly disruptive technology that is changing how the world connects. You will be part of a team where technical excellence is celebrated and where your contributions have a direct impact on the success of our next-generation product lines. 

Skorpios offers an excellent benefits package which includes:

  • Competitive salary
  • Medical
  • Dental
  • Vision
  • 401(k)
  • Company paid Life Insurance
  • Company paid Disability
  • Paid Holidays
  • Paid Vacation
  • Gym Membership Discounts

Export Control / ITAR Statement: This position is located at a facility that operates under International Traffic in Arms Regulations (ITAR). All applicants must be 'U.S. persons' within the meaning of ITAR. ITAR defines a 'U.S. person' as a U.S. Citizen, U.S. Permanent Resident (i.e., 'Green Card Holder'), Political Asylee, or Refugee.

Skorpios Technologies, Inc. is an Equal Opportunity Employer. We celebrate diversity and are committed to creating an inclusive environment for all employees. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex (including pregnancy, childbirth, or related medical conditions), sexual orientation, gender identity or expression, national origin, ancestry, age (40 and over), physical or mental disability, medical condition, genetic information, marital status, military or veteran status, protected leave status, or any other characteristic protected by applicable federal, state, or local laws.

As a federal contractor, Skorpios Technologies, Inc. takes affirmative action to employ and advance in employment qualified minorities, women, protected veterans, and individuals with disabilities. We encourage all qualified candidates to apply.

Skorpios Technologies, Inc. is committed to providing reasonable accommodations for qualified individuals with disabilities and disabled veterans in our job application procedures. If you need assistance or accommodation due to a disability, you may contact us at or AskHR@Skorpiosinc.com

Work Environment

Work is primarily performed in a temperature-controlled, open cubicle setting. Frequent interruptions and conversational noise can be expected. This role may also require occasional work in a manufacturing or cleanroom environment.

Work Authorization/Security Clearance Requirements

Authorization may be required to release covered technology to employees who are not U.S. citizens, U.S. nationals, lawful permanent residents, asylees, or refugees.

Compensation and Benefits

Skorpios embraces a Total Compensation philosophy that includes a base salary and eligibility for overtime for non-exempt roles.

We offer a comprehensive and competitive benefits package designed to support employee health, welfare, and retirement. Highlights include healthcare benefits, a 401(k) savings plan, and paid time off.

Expected salary range: $100,000–$150,000, depending on qualifications and experience.

The actual starting rate will be determined based on role-related criteria, level hired in at, including educational qualifications or equivalent experience, relevant work history, and the skills required for the role.