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How much do dry etch process jobs pay per hour?

As of Sep 12, 2026, the average hourly pay for dry etch process in the United States is $24.67, according to ZipRecruiter salary data. Most workers in this role earn between $19.71 and $28.12 per hour, depending on experience, location, and employer.

What is a dry etch process engineer?

A Dry Etch Process engineer is a specialist in semiconductor manufacturing who uses plasma or other gases to remove material from the surface of silicon wafers in a controlled manner, without using liquid chemicals. This process is crucial for defining microscopic features on chips and ensuring high precision in device fabrication. Dry etching allows for cleaner, more accurate pattern transfers compared to wet etching, which uses liquid solutions. Engineers in this field monitor and optimize process parameters to achieve the desired results while minimizing defects and maintaining yield.

What are the key skills and qualifications needed to thrive as a dry etch process engineer?

Success as a Dry Etch Process Engineer requires a solid background in materials science, semiconductor manufacturing, and process engineering, often supported by a degree in engineering or a related field. Familiarity with plasma etching equipment, statistical process control (SPC) software, and cleanroom protocols is essential. Strong problem-solving skills, attention to detail, and effective teamwork abilities help individuals excel in this role. These competencies are critical to ensuring precise, efficient wafer fabrication and maintaining product quality in high-tech manufacturing environments.

What are some common challenges faced by dry etch process engineers, and how can new hires effectively address them?

Dry Etch Process Engineers often face challenges such as maintaining process uniformity, troubleshooting equipment issues, and optimizing recipes for yield and throughput. New hires can effectively address these challenges by developing a thorough understanding of process parameters, collaborating closely with equipment and integration engineers, and proactively participating in cross-functional problem-solving meetings. Ongoing training and hands-on experience with etch tools, as well as staying current with best practices, will also help new engineers quickly contribute to process improvements.

What is the difference between Dry Etch Process vs Wet Etch Process?

AspectDry Etch ProcessWet Etch Process
CredentialsTypically requires knowledge of plasma physics and cleanroom protocolsRequires understanding of chemical handling and safety procedures
Work EnvironmentCleanroom with plasma and vacuum equipmentLaboratory or manufacturing setting with chemical baths
Industry UsageSemiconductor fabrication, microelectronicsMicrofabrication, MEMS, and some semiconductor processes
Common Search/ComparisonOften compared for precision and selectivityCompared for cost and simplicity

Dry etch processes use plasma and gases to etch materials with high precision, suitable for complex patterns. Wet etch involves chemical solutions that remove material more simply but with less control. Both are essential in semiconductor manufacturing, but dry etch offers better anisotropy and control, while wet etch is faster and more cost-effective for certain applications.

Infographic showing various Dry Etch Process job openings in the United States as of July 2026, with employment types broken down into 3% As Needed, 86% Full Time, 10% Part Time, and 1% Contract. Highlights an 99% Physical, and 1% Remote job distribution, with an average salary of $51,319 per year, or $24.7 per hour.

Dry Etch Process Engineer

Newport Beach, CA • On-site

Prosum Inc.
Recruiting and Staffing Services • 201 - 500 employees
Learn more about Prosum Inc.external

Other

Re-posted 2 days ago

Job description

Job Description
Dry Etch Process EngineerSalary Range: $100k to $130k
Job Summary
Our client is seeking an experienced Dry Etch Process Engineer to support and enhance dry etch processes within a high-volume semiconductor manufacturing environment. This position will focus on sustaining existing processes, developing new process capabilities, improving yield and quality, and supporting the transition of new technologies into production. The ideal candidate is a collaborative problem-solver with strong technical expertise in semiconductor process engineering.
Key Responsibilities
  • Sustain, monitor, and optimize dry etch processes in a high-volume manufacturing environment.
  • Develop and implement process improvements to enhance yield, throughput, quality, and overall process performance.
  • Troubleshoot process-related issues and drive root cause analysis to resolve yield and reliability concerns.
  • Support the transfer of new process technologies from development into volume manufacturing.
  • Characterize, qualify, and validate new process equipment, upgrades, and process changes.
  • Collaborate with cross-functional teams including Manufacturing, Integration, Equipment Engineering, and Quality to meet production and reliability objectives.
  • Analyze process data and implement continuous improvement initiatives using statistical methods.
  • Benchmark process performance and share best practices across engineering teams.
  • Ensure processes meet qualification, quality, and reliability requirements.
Required Qualifications
  • Bachelor's degree in Chemical Engineering, Chemistry, Materials Science, Electrical Engineering, Physics, or a related engineering or science discipline.
  • Minimum of 3 years of dry etch process engineering experience in a semiconductor manufacturing environment (2+ years with an advanced degree may be considered).
  • Strong understanding of dry etch process fundamentals, equipment, and semiconductor manufacturing principles.
  • Experience troubleshooting process issues and driving continuous process improvements.
  • Experience with Design of Experiments (DOE), statistical analysis, and process characterization.
  • Proficiency with JMP or similar statistical analysis software.
  • Strong organizational, analytical, and problem-solving skills.
  • Excellent communication skills and the ability to work effectively within cross-functional teams.
Preferred Qualifications
  • Master's or Ph.D. in a related engineering or scientific discipline.
  • Experience with poly etch and/or metal etch processes.
  • Hands-on experience with semiconductor etch equipment such as LAM 2300, LAM 9600, and/or Applied Materials DPS systems.
  • Knowledge of PROMIS WIP management systems.
  • Experience with Lean Manufacturing, Six Sigma, FMEA, and 8D problem-solving methodologies.
  • Six Sigma certification is a plus.

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