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Chemical Mechanical Planarization Jobs (NOW HIRING)

onsemi

CMP Module Engineer

Hopewell, NY · On-site

$88K - $142K/yr

The 300mm CMP Equipment Engineer is responsible for sustaining, improving, and optimizing the performance of Chemical Mechanical Planarization (CMP) equipment in a high-volume semiconductor ...

onsemi

CMP Module Engineer

Hopewell, NY · On-site

$65.80 - $102K/hr

The 300mm CMP Equipment Engineer is responsible for sustaining, improving, and optimizing the performance of Chemical Mechanical Planarization (CMP) equipment in a high-volume semiconductor ...

Amtech

Foundry CMP Process Engineer II

Phoenix, AZ · On-site

... chemical-mechanical planarization) foundry division. Candidate will be primarily engaged to support the processes developed on the AMAT Mirra, IPEC 472 and OnTrak Cleaner platforms within the scope ...

Embrace HR LLC

$86K - $117K/yr

This Engineer role within the Chemical Mechanical Planarization Technology (CMPT) organization is a cross-function influential leader to address business growth and customer satisfaction ...

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How much do chemical mechanical planarization jobs pay per hour?

As of Sep 2, 2026, the average hourly pay for chemical mechanical planarization in the United States is $18.25, according to ZipRecruiter salary data. Most workers in this role earn between $16.35 and $19.23 per hour, depending on experience, location, and employer.

What is chemical mechanical planarization (CMP)?

Chemical Mechanical Planarization (CMP) is a process used in semiconductor manufacturing to smooth and flatten the surfaces of wafers. It combines both chemical and mechanical techniques to remove excess material and achieve a perfectly even surface, which is critical for building the multiple layers of modern microchips. CMP helps ensure that subsequent layers are properly aligned, improving device performance and yield. The process is essential in the production of integrated circuits and other advanced electronic components.

What are the typical challenges faced by engineers working in chemical mechanical planarization (CMP) processes within semiconductor manufacturing?

Engineers working in CMP often face challenges such as maintaining wafer uniformity, minimizing defects like scratches and dishing, and optimizing slurry chemistry for different materials. The role requires close collaboration with process integration teams and equipment vendors to troubleshoot issues and implement process improvements. Staying current with new materials and process technologies is crucial, and success often depends on strong problem-solving skills and attention to detail in a fast-paced, cleanroom environment.

What are the key skills and qualifications needed to thrive as a chemical mechanical planarization (CMP) engineer, and why are they important?

To excel as a CMP Engineer, you need a solid background in chemical engineering, materials science, or a related field, often supported by a relevant degree. Familiarity with CMP equipment, process control systems, and semiconductor manufacturing software is essential, as is experience with data analysis tools. Strong problem-solving abilities, attention to detail, and effective teamwork skills help you optimize processes and address yield or quality issues. These competencies are vital for ensuring precise wafer planarization, minimizing defects, and maintaining high production standards in semiconductor fabrication.

What is the difference between Chemical Mechanical Planarization vs Semiconductor Process Technician?

AspectChemical Mechanical PlanarizationSemiconductor Process Technician
CredentialsTechnical certifications, associate degree in engineering or related fieldTechnical certifications, associate or bachelor’s degree in engineering or related field
Work EnvironmentCleanroom, manufacturing floor, specialized equipmentCleanroom, manufacturing floor, equipment operation and monitoring
Industry UsageSemiconductor fabrication, wafer processingSemiconductor manufacturing, process monitoring
Job FocusMaterial removal, surface planarization, process controlProcess execution, equipment setup, quality checks

While both roles operate within semiconductor manufacturing environments, Chemical Mechanical Planarization specialists focus on the precise removal and smoothing of wafer surfaces using specialized equipment, whereas Semiconductor Process Technicians oversee broader process operations, including equipment setup and quality assurance. Understanding these distinctions helps clarify career paths and job expectations in semiconductor fabrication.

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Chemical Mechanical Planarization jobs near you
Infographic showing various Chemical Mechanical Planarization job openings in the United States as of August 2026, with employment types broken down into 90% Full Time, 7% Part Time, 1% Contract, and 2% Nights. Highlights an 97% Physical, 1% Hybrid, and 2% Remote job distribution, with an average salary of $37,952 per year, or $18.2 per hour.

Module Equipment Engineer (Phoenix, AZ On-site)

TSMC

Phoenix, AZ • On-site

Other

Posted 24 days ago

TSMC rating

8.0

Company rating: 8.0 out of 10

Based on 21 frontline employees who took The Breakroom Quiz

59th of 160 rated electronics manufacturers

Job description

At TSMC Arizona, brilliance can ignite a world of innovation and launch a promising future. The world's most brilliant innovators entrust us to transform their ideas into world-changing products that impact millions of lives. As long as you have the same passion to pursue excellence, you will find your fit here.
TSMC Arizona module engineering departments are looking for equipment engineering talentsto join our advanced technology fab, located in sunny Phoenix, Arizona. As an Equipment Engineer, you will demonstrate a strong sense of reliability and enthusiasm and will possess an attitude that embodies our core values - Integrity, Commitment, Innovation and Customer Trust.
Equipment Engineer is focusing on improving tool performance and availability while meeting uptime and cycle time requirements.
  • CMP : Chemical Mechanical Planarization
  • CVD : Chemical Vapor Deposition
  • PVD : Physical Vapor Deposition
  • EPI : Epitaxy
  • DIF : Diffusion
  • WET : Wet Clean
  • ME : Metrology
  • Etch : Wet Etch and Dry Etch
  • LIT : Lithography

Job Description:
Your main responsibilities include, but are not limited to:
  • Maintain equipment performance in clean room environment for quality production.
  • Handling on-duty and fundamental alarm troubleshooting.
  • Installing/qualifying new tool sets according to planned schedule in a timely manner.
  • Finding root cause and solving critical equipment issues.
  • Improving tool uptime availability and driving defect reduction.
  • Identifying and pursuing opportunities for hardware capability enhancement.
  • Building defense/monitoring system to prevent equipment failure or performance lost.
  • Managing vendor relationships and being responsible for module liaison with facilities, vendor, and manufacturing shift personnel.
  • Scheduled night shifts, weekend on-duty, and on-call in 24/7 high-volume manufacturing environment are required for business needs.
  • If hired for this position, you may be required to participate in and perform Emergency Response Team (ERT) duties as an essential part of the role. These duties may include responding to F21 incidents, such as medical emergencies, chemical spills, fire response, or addressing any other disruptions to business operations. If you are selected by your manager to become a part of ERT, participation is mandatory and additional compensation will be provided for performing these critical responsibilities in the form of a monthly premium.

Qualifications:
Applicants must be legally eligible to work in the United States and have:
  • Bachelor's or higher degree in Electronics, Electrical Engineering, Mechanical Engineering, Mechanics, Mechatronics Engineering, or equivalent fields.
  • Working experience knowledge in mechanical-related or semiconductor processes is preferred.
  • Academic skills of numerical analysis, statistics, optics, chemistry, or physics.
  • At least 1 year experience in semiconductor industry as Equipment Engineer is a strong add.
  • Able to lift weight consistent with applicable regulations and/or safety guidelines, including NIOSH lifting recommendations.
  • Able to work in a cleanroom environment, gowning up in coveralls, hoods, boots, safety glasses and gloves. Spend significant amount of time on the factory floor working on the tools.
  • All Equipment Engineers (EE) may be required to work a Compressed Work Week (4-day on, 3-day off, 3-day on, 4-day off), and may be required to work night shift on a rotational basis.
  • Night shift rotations are expected to be no more than 4 months per calendar year.

Personal Attributes:
  • Good communication and interpersonal skills that enable you to work on cross-functional and geographically dispersed teams.
  • Able to take initiatives, adapt priorities and responsibilities to support business needs.
  • Hands-on participant with a strong sense of ownership.
  • A team player with leadership skills that can multitask and thrive in a very dynamic and fast-paced environment.
  • Goal driven with demonstrated ability of working in a high performing team culture.
  • Quick assimilation to new technology.
  • Ability to troubleshoot complex problems and to own the efforts to address and resolve root causes.

Work Location: Phoenix, AZ
Travel: May require travel dependent on business needs.
Relocation assistance available
Date: Aug 9, 2026
Country/Region: US
City: Phoenix
Company: TSMC Arizona

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About TSMC

Sourced by ZipRecruiter

Industry

Computer and electronic product manufacturing

Company size

10,000+ Employees

Headquarters location

San Jose, CA, US

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