Assistant Tsmc Engineer Jobs in Oregon (NOW HIRING)

The Role 

We are seeking a Senior ASIC Physical Design Engineer to help implement advanced SoCs that power next-generation satellite and space systems. In this role, you will contribute to the full physical design flow-from synthesis to GDSII-working closely with architecture, RTL, verification, and packaging teams. You'll be a key contributor in achieving timing closure, optimizing PPA, and supporting design integration with external partners. You will be part of a collaborative design team developing state-of-the-art mixed-signal SoCs to be hosted on some of the largest, most powerful, rapidly designed and rapidly manufactured satellites ever deployed in space. In your first 6 months, you will develop and implement new SoC sub-systems for satellite communications and beyond. In your first two years, you will have contributed to developing cutting-edge SoCs that will fly in space. 

Responsibilities 

• Execute the complete physical design flow for complex SoC blocks and top-level integration, including synthesis, floorplanning, place & route, CTS, STA, and physical verification. 
• Perform timing closure and optimization across multiple corners and modes using industry-standard tools. 
• Collaborate with front-end, verification, and DFT teams to ensure clean handoff and predictable convergence. 
• Work with external physical design service providers and internal leads to review deliverables, resolve issues, and ensure schedule alignment. 
• Develop and maintain scripts and automation to improve flow efficiency and consistency. 
• Support physical sign-off activities including DRC/LVS, IR drop, EM, and power analysis. 
• Assist in chip-level integration, ECOs, and tapeout preparation. 
• Contribute to methodology development, tool evaluation, and flow documentation. 
• Support your product through production and spaceflight.  

Required Qualifications 

• Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or related field. 
• 5-10 years of experience in ASIC physical design for complex SoCs. 
• Hands-on experience with industry-standard tools (Synopsys ICC2/Fusion Compiler, Cadence Innovus, or equivalent). 
• Strong understanding of timing analysis, power optimization, and physical verification flows. 
• Experience with hierarchical or flat SoC design methodologies. 
• Familiarity with FinFET technologies. 
• Working knowledge of DFT, UPF/CPF power intent, and ECO implementation. 
• Strong problem-solving skills and ability to work cross-functionally in fast-paced environments. 

Preferred Qualifications 

• Exposure to radiation-hardened or space-qualified ASICs. 
• Experience with chip-package co-design or advanced packaging (2.5D/3D). 
• Familiarity with physical design service vendor management or offshore collaboration. 
• Experience with sign-off through TSMC. 
• Experience with Gate-All-Around technologies.  
• Experience working in cross-functional, geographically distributed teams. 

Compensation and Benefits:

• Base salary range for this role is $170,000 - $250,000 + equity in the company
• Salary will be based on several factors including, but not limited to: knowledge and skills, education, and experience level
• Comprehensive benefits package including paid time off, medical/dental/vision/ coverage, life insurance, paid parental leave, and many other perks