S. based R&D design center focuses on pioneering advanced RF andsuperconducting electronics for ... Optimize for performance and packaging capabilities utilizing Keysight ADS and Ansys HFSS. Create ...
S. based R&D design center focuses on pioneering advanced RF andsuperconducting electronics for ... Optimize for performance and packaging capabilities utilizing Keysight ADS and Ansys HFSS. Create ...
... advanced electronic security infrastructure across federal and military sites. This is a full-time ... Package: Medical, Dental, Vision, 401K, Paid Time Off, Sick Leave (as required by law), and ...
... advanced electronic security infrastructure across federal and military sites. This is a full-time ... Package: Medical, Dental, Vision, 401K, Paid Time Off, Sick Leave (as required by law), and ...
Photonic Packaging Engineer, Principal San Jose, California, United States Astera Labs provides ... advanced optics. This role will drive the intersection of photonics, high-speed electronics ...
Photonic Packaging Engineer, Principal San Jose, California, United States Astera Labs provides ... advanced optics. This role will drive the intersection of photonics, high-speed electronics ...
... or electronic packaging (Master's with 5+ years experience considered) * Strong academic background in power integrity, signal integrity, and thermal management for advanced packaging Technical ...
Quick apply
... or electronic packaging (Master's with 5+ years experience considered) * Strong academic background in power integrity, signal integrity, and thermal management for advanced packaging Technical ...
Mechanical Engineer
$75 - $82/hr
... Electronics Packaging Chelmsford, MA, United States About the Role We are seeking a motivated and detail-oriented Mechanical Engineer to support the design, development, and manufacturing of advanced ...
Mechanical Engineer
$75 - $82/hr
... Electronics Packaging Chelmsford, MA, United States About the Role We are seeking a motivated and detail-oriented Mechanical Engineer to support the design, development, and manufacturing of advanced ...
Develop energy-efficient, lightweight, and cost-effective electronic components. * Collaborate ... Advanced Degree in a related field and minimum 3 years of experience * Strong foundation in ...
Develop energy-efficient, lightweight, and cost-effective electronic components. * Collaborate ... Advanced Degree in a related field and minimum 3 years of experience * Strong foundation in ...
Senior Mechanical Engineer - Packaging Engineer (Onsite)
Rockford, IL · On-site
$104K - $138K/yr
Develop energy-efficient, lightweight, and cost-effective electronic components. * Collaborate ... Advanced Degree in a related field and minimum 3 years of experience * Strong foundation in ...
Senior Mechanical Engineer - Packaging Engineer (Onsite)
Rockford, IL · On-site
$104K - $138K/yr
Develop energy-efficient, lightweight, and cost-effective electronic components. * Collaborate ... Advanced Degree in a related field and minimum 3 years of experience * Strong foundation in ...
... for electronic packaging design, 3D CAD modeling (SolidWorks), and advanced Finite Element Analysis (ANSYS) for structural and thermal performance. • Leads mechanical design, testing, and ...
... for electronic packaging design, 3D CAD modeling (SolidWorks), and advanced Finite Element Analysis (ANSYS) for structural and thermal performance. • Leads mechanical design, testing, and ...
Packaging Technician
$14.50 - $17.75/hr
Are you looking to power the next leap in the exciting world of advanced electronics? Do you want ... Package and label finished product per work instructions. * Obtain required samples of finished ...
Packaging Technician
$14.50 - $17.75/hr
Are you looking to power the next leap in the exciting world of advanced electronics? Do you want ... Package and label finished product per work instructions. * Obtain required samples of finished ...
Position Overview Qnity Electronics has an exciting and challenging opportunity within Advanced Circuit & Packaging (ACP) for a Materials Scientist located in Marlborough, MA. This role focuses on ...
Position Overview Qnity Electronics has an exciting and challenging opportunity within Advanced Circuit & Packaging (ACP) for a Materials Scientist located in Marlborough, MA. This role focuses on ...
Perform advanced troubleshooting, repair, and design of electrical circuits. * Diagnose/maintain ... Carpenter Co. offers a comprehensive benefits package including excellent health insurance ...
Quick apply
Perform advanced troubleshooting, repair, and design of electrical circuits. * Diagnose/maintain ... Carpenter Co. offers a comprehensive benefits package including excellent health insurance ...
... electronics packaging design engineer to support development, missile integration, and flight test for an Advanced Program. Responsibilities includes: Performing electronic packaging designs for ...
... electronics packaging design engineer to support development, missile integration, and flight test for an Advanced Program. Responsibilities includes: Performing electronic packaging designs for ...
... advanced electronic systems to ensure continuous operational readiness in compliance with DoD ... SRC offers a generous benefit package, including medical, dental, and vision plans, 401(k) with a ...
... advanced electronic systems to ensure continuous operational readiness in compliance with DoD ... SRC offers a generous benefit package, including medical, dental, and vision plans, 401(k) with a ...
... electronics packaging design engineer to support development, missile integration, and flight test for an Advanced Program. Responsibilities includes: Performing electronic packaging designs for ...
... electronics packaging design engineer to support development, missile integration, and flight test for an Advanced Program. Responsibilities includes: Performing electronic packaging designs for ...
... advanced electronic systems to ensure continuous operational readiness in compliance with DoD ... SRC offers a generous benefit package, including medical, dental, and vision plans, 401(k) with a ...
... advanced electronic systems to ensure continuous operational readiness in compliance with DoD ... SRC offers a generous benefit package, including medical, dental, and vision plans, 401(k) with a ...
Engineering - Mechanical Engineer
Chelmsford, MA · On-site
$82.21/hr
... advanced microwave electronics subsystems. Leverage cutting-edge design tools and hands-on ... Lead electronics packaging design and documentation for military microwave subsystems * Perform ...
Engineering - Mechanical Engineer
Chelmsford, MA · On-site
$82.21/hr
... advanced microwave electronics subsystems. Leverage cutting-edge design tools and hands-on ... Lead electronics packaging design and documentation for military microwave subsystems * Perform ...
... advanced electronic systems to ensure continuous operational readiness in compliance with DoD ... SRC offers a generous benefit package, including medical, dental, and vision plans, 401(k) with a ...
... advanced electronic systems to ensure continuous operational readiness in compliance with DoD ... SRC offers a generous benefit package, including medical, dental, and vision plans, 401(k) with a ...
* Performing preventive and corrective maintenance on advanced electronic systems to ensure ... SRC offers a generous benefit package, including medical, dental, and vision plans, 401(k) with a ...
* Performing preventive and corrective maintenance on advanced electronic systems to ensure ... SRC offers a generous benefit package, including medical, dental, and vision plans, 401(k) with a ...
* Performing preventive and corrective maintenance on advanced electronic systems to ensure ... SRC offers a generous benefit package, including medical, dental, and vision plans, 401(k) with a ...
* Performing preventive and corrective maintenance on advanced electronic systems to ensure ... SRC offers a generous benefit package, including medical, dental, and vision plans, 401(k) with a ...
* Performing preventive and corrective maintenance on advanced electronic systems to ensure ... SRC offers a generous benefit package, including medical, dental, and vision plans, 401(k) with a ...
* Performing preventive and corrective maintenance on advanced electronic systems to ensure ... SRC offers a generous benefit package, including medical, dental, and vision plans, 401(k) with a ...
Advanced Electronic Packaging information
See salary details
$29.5K - $35.5K
3% of jobs
$35.5K - $41.5K
12% of jobs
$45.7K is the 25th percentile. Wages below this are outliers.
$41.5K - $47.5K
15% of jobs
$47.5K - $53.5K
14% of jobs
The median wage is $56.8K / yr.
$53.5K - $59.5K
13% of jobs
$59.5K - $65.5K
11% of jobs
$69K is the 75th percentile. Wages above this are outliers.
$65.5K - $71.5K
15% of jobs
$71.5K - $77.5K
5% of jobs
$77.5K - $83.5K
7% of jobs
$83.5K - $89.5K
3% of jobs
$89.5K - $95.5K
3% of jobs
$29.5K
$60.8K
$95.5K
How much do advanced electronic packaging jobs pay per year?
As of Jun 4, 2026, the average yearly pay for advanced electronic packaging in the United States is $60,843.00, according to ZipRecruiter salary data. Most workers in this role earn between $46,000.00 and $70,000.00 per year, depending on experience, location, and employer.
Other
This job post has expired today. Applications are no longer accepted.
Job description
JobTitle: RF-mmWave IC Design / Packaging Engineer
Location: Kissimmee, FL (imec U.S.R&D Design Center)
Team: Advanced RF
Employment Type: Full-time
Aboutimec
imecis a world-leading research and innovation hub in nanoelectronics and digitaltechnologies. Our U.S. based R&D design center focuses on pioneering advanced RF andsuperconducting electronics for next-generation applications. We foster acollaborative, hands-on environment where initiative and innovation areencouraged.
Aboutthe Role
Weare looking for a talented engineer with significant interest and training in millimeter wave (>110 GHz)semiconductor design and packaging to join our multidisciplinary team. You willcontribute to active chip design, optimizing interconnects formanufacturability, prototype development, and characterization in advancedRF technologies. This is a critical role to establishing US basedcapabilities as part of the FloridaSemiconductor Engine established by the National Science Foundation.
WhatYou'll Do
Design active devices in CMOS and III-V (InP).
Optimize for performance and packaging capabilities utilizing Keysight ADS and Ansys HFSS.
Create layouts to tape out chips using Siemens Calibre and Cadence Virtuoso.
Design and optimize passive interconnects to enable heterogeneous integration utilizing imec RF interposer technology.
Design and utilize both virtual and physical measurement platforms for design optimization and verification.
Perform design reviews and create technical documentation and reports.
Work directly with design partners on development and manufacture of prototypes.
Contribute to publications in international journals and conferences.
MinimumQualifications
Master's in electrical engineering, physics, or related field.
Strong communication skills for internal and external collaboration.
Successful demonstration of taking a design from concept to prototype measurement.
Experience with semiconductor tapeout.
Experience designing active devices above 110 GHz.
DesiredQualifications
PhD in electrical engineering, physics, or related field.
Experience with Teledyne InP or GlobalFoundries 22FDX+ processes.
Millimeter wave measurements using a manual probe station.
Experience with electronic packaging: wafer bumping, micro-pillars, flip chip bonding, through silicon vias (TSV), or heterogeneous integration.
Location: Kissimmee, FL (imec U.S.R&D Design Center)
Team: Advanced RF
Employment Type: Full-time
Aboutimec
imecis a world-leading research and innovation hub in nanoelectronics and digitaltechnologies. Our U.S. based R&D design center focuses on pioneering advanced RF andsuperconducting electronics for next-generation applications. We foster acollaborative, hands-on environment where initiative and innovation areencouraged.
Aboutthe Role
Weare looking for a talented engineer with significant interest and training in millimeter wave (>110 GHz)semiconductor design and packaging to join our multidisciplinary team. You willcontribute to active chip design, optimizing interconnects formanufacturability, prototype development, and characterization in advancedRF technologies. This is a critical role to establishing US basedcapabilities as part of the FloridaSemiconductor Engine established by the National Science Foundation.
WhatYou'll Do
Design active devices in CMOS and III-V (InP).
Optimize for performance and packaging capabilities utilizing Keysight ADS and Ansys HFSS.
Create layouts to tape out chips using Siemens Calibre and Cadence Virtuoso.
Design and optimize passive interconnects to enable heterogeneous integration utilizing imec RF interposer technology.
Design and utilize both virtual and physical measurement platforms for design optimization and verification.
Perform design reviews and create technical documentation and reports.
Work directly with design partners on development and manufacture of prototypes.
Contribute to publications in international journals and conferences.
MinimumQualifications
Master's in electrical engineering, physics, or related field.
Strong communication skills for internal and external collaboration.
Successful demonstration of taking a design from concept to prototype measurement.
Experience with semiconductor tapeout.
Experience designing active devices above 110 GHz.
DesiredQualifications
PhD in electrical engineering, physics, or related field.
Experience with Teledyne InP or GlobalFoundries 22FDX+ processes.
Millimeter wave measurements using a manual probe station.
Experience with electronic packaging: wafer bumping, micro-pillars, flip chip bonding, through silicon vias (TSV), or heterogeneous integration.