Advanced Electronic Packaging Jobs (NOW HIRING)

The Global Electronics Association is seeking a Technology Solutions Subject Matter Expert (SME) Consultant based in Taiwan. Reporting to the Vice President of Technology Solutions, this externally facing consulting role serves as a senior technical expert and industry convener, supporting the Association's global technology programs with a strong regional focus on Taiwan.
This role plays a critical part in shaping next-generation electronics manufacturing and advanced electronic packaging across the supply chain in Taiwan, East Asia, and globally. The consultant will work directly with OEMs, semiconductor and packaging companies, OSATs, substrate and PCB manufacturers, EMS/ODM providers, equipment suppliers, and research organizations to identify emerging technical challenges and drive the development of guidelines, standards, roadmaps, workshops, and training aligned with industry needs.
RESPONSIBILITIES
Technology Expertise & Advisory Leadership
Serve as a senior subject matter expert across component-level and system-level packaging, providing technical insight spanning advanced packaging, substrates, HDI/UHDI PCBs, assembly, test, and reliability. Advise on package-to-PCB-to-system integration topics including materials, design considerations, manufacturing processes, digital manufacturing, and scalability challenges for advanced electronic systems.
NextGen Guidelines, Standards & Roadmap Development
Drive the identification, development, and execution of new guidelines, standards, and technical reports aligned with emerging industry requirements. Contribute expert input to technology roadmaps, white papers, and position statements addressing advanced packaging, substrates, PCB technologies, advanced assembly, digital manufacturing, quality and reliability, and sustainability.
Industry & Ecosystem Engagement
Act as a technical liaison within Taiwan's electronics ecosystem, engaging OEMs, semiconductor and packaging companies, OSATs, substrate and PCB manufacturers, EMS/ODM providers, equipment suppliers, and regional research partners. Foster new partnerships and collaborative initiatives across industry, academia, and government-aligned research organizations to strengthen regional and global alignment.
Workgroup Formation & Community Building
Establish and lead multi-company technical workgroups, including Taiwan-focused AEP and ADEPT initiatives. Coordinate cross-company technical activities, guide technical direction, and apply data-driven approaches to address complex challenges; translating technical issues into clear opportunities and actionable outcomes. Grow and sustain a strong technical community within Taiwan.
Workshops, Events & Thought Leadership
Lead and support technical workshops, conferences, webinars, and industry forums across Taiwan and the region, while delivering senior-level thought leadership that informs industry dialogue and advances Technology Solutions priorities.
Training & Knowledge Development
Provide expert input to inform training materials, educational modules, and best-practice guidance. Identify gaps and opportunities for future Technology Solutions offerings, ensuring content reflects real-world manufacturing, design, and system deployment needs.
REQUIREMENTS
• Bachelor's degree in engineering, science, or a technology-related field
• Master's degree or PhD preferred; business degree (e.g., MBA) a plus
• 15+ years of experience within the electronics industry, with demonstrated technical leadership and sustained industry contributions
• Deep subject matter expertise in either or both:
o Component-level packaging (CLP), including next-generation packaging, advanced substrates, assembly, test, and reliability
o System-level packaging (SLP), including design, materials, assembly, test, and sub-system/final system reliability
• Broad technical and supply-chain experience across electronic hardware systems, including materials, design, HDI/UHDI PCBs, IDM/OSAT, EMS/ODM, digital manufacturing, and complex integrated systems
• Proven experience coordinating/leading multi-company technical collaborations, working groups, consortia
• Strong communication skills, with the ability to lead and influence diverse technical stakeholders
• Willingness to travel regionally and internationally (~15%) as required
PREFERRED QUALIFICATIONS
• Experience supporting AI/HPC systems, automotive/e-mobility, industrial, or aerospace & defense electronics
• Prior involvement in industry standards development, technology roadmaps, or training programs
• Strong technical program or project management experience (PMP or equivalent preferred)
• Background in statistical methods, data analysis, or structured problem-solving (BB/MBB a plus)
This role is a flexible consulting/contract engagement, estimated at 60-70 hours per month, structured to align with the Global Electronics Association's Technology Solutions strategic initiatives and program needs. The Global Electronics Association dba IPC International, Inc. is an Equal Opportunity Employer.
Please send resume and cover letter to e-mail: mattkelly@electronics.org . Subject line should say: Taiwan Consultant, Advanced Electronic Packaging.