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Intel is transforming from an Integrated Device Manufacturer (IDM) to a leading foundry service provider, offering world-class manufacturing capabilities to customers worldwide. Our Manufacturing Development and Customer Engineering (MDCE) organization is at the forefront of this transformation, focusing on yield improvement, performance optimization, and exceptional customer service delivery. We are responsible for improving process capability for Intel's technology nodes from initial product qualification to high volume manufacturing.

We are seeking a Senior Director, Dry Etch Development Engineering to join our team within MDCE.

Leads a team of module development engineers to drive technology development and enablement, provide integrated process solutions, and perform feasibility studies to meet desired device specifications while maximizing safety, quality, and process capabilities across wafer processing, assembly/test, and module repair factories. Ensures execution of module improvement responsibilities, and oversees process and equipment performance in manufacturing lines. Leads the growth of manufacturing capacity to high-volume production while simultaneously transferring technology to manufacturing sites across the globe. Drives cross-organizational alignment toward process-pathway solutions and partners closely with integration, device, and yield engineering teams to develop robust process solutions that deliver power-performance and area leadership while maintaining focus on technology structural cost. Partners with supplier executive management to identify, nurture, develop, and implement innovative research and industry ideas, helping bring differentiated solutions to production. Coaches and leads engineering teams to reverse engineer and develop repair and improvement opportunities that enhance cost efficiency, output, and yield. Hires, manages, and coaches engineers in advanced technology development, building deep subject matter expertise across the organization while developing long-term strategies for module engineering capabilities to support future requirements. Enables teams to execute through clear goal setting, facilitation of work, accountability, differentiated performance management, and a strong focus on delivering team results. Drives results by inspiring people, role modeling Intel values, developing the capabilities of others, and fostering a productive and collaborative work environment.

Prior senior management experience with large, multinational manufacturing organizations, preferably within high technology, scientific, or semiconductor industries, including specialization in technology development. Strong industry background in semiconductor process development and leadership, with particular expertise in etch processes across multiple dry etch equipment platforms. Experience working with investors and third-party suppliers to optimize and customize solutions that meet manufacturing requirements. Proven engineering leadership at a global scale, including leading major factory ramp-ups and process technology development in high-volume manufacturing environments. Extensive fab start-up experience with a demonstrated technical track record across multiple semiconductor disciplines, including manufacturing engineering, quality and reliability, research and development, and sourcing/supply chain innovation.

Substantial technical expertise in areas such as logic technology development, packaging, silicon process technologies, or related fields, supported by a body of research and patents. Demonstrated success in delivering customized solutions within Research and Development and High Volume Manufacturing (HVM) organizations. Previous experience working in a semiconductor foundry environment. Requirements may be obtained through a combination of relevant industry experience, internships, academic coursework, and/or research activities.

Master's degree in Electrical Engineering or a technical equivalent. 14 years of relevant experience in the semiconductor industry

Experienced Hire

Shift 1 (United States of America)

US, Oregon, Hillsboro

US, Arizona, Phoenix, US, California, Santa Clara

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

This role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

$248,400.00-350,690.00 USD

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change. * ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter. Intel’s official careers website.