The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile ...

60 Intel Packaging Engineer Jobs Hiring in AZ
The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile ...
The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile ...
The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile ...
Packaging Module Development Engineer
Phoenix, AZ · On-site
$127K - $179K/yr
The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the ... The Packaging Module Development Engineer will contribute to advancing technology and foundry ...
Packaging Module Development Engineer
Phoenix, AZ · On-site
$127K - $179K/yr
The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the ... The Packaging Module Development Engineer will contribute to advancing technology and foundry ...
Thermal Quality and Reliability Engineer
Phoenix, AZ · On-site
$101K - $128K/yr
The Role and Impact As a Packaging Quality and Reliability Engineer, you will play a critical role in Intel's mission to deliver world-class semiconductor technologies. In this position, you will ...
Thermal Quality and Reliability Engineer
Phoenix, AZ · On-site
$101K - $128K/yr
The Role and Impact As a Packaging Quality and Reliability Engineer, you will play a critical role in Intel's mission to deliver world-class semiconductor technologies. In this position, you will ...
Packaging Module Equipment Development Engineer
Phoenix, AZ · On-site
$115 - $220/hr
... Intel's roadmap of future assembly packaging platform technologies. Optimizes and improves the ... The candidate must have Bachelor's degree in Engineering, Physics, Chemistry or related STEM field ...
Packaging Module Equipment Development Engineer
Phoenix, AZ · On-site
$115 - $220/hr
... Intel's roadmap of future assembly packaging platform technologies. Optimizes and improves the ... The candidate must have Bachelor's degree in Engineering, Physics, Chemistry or related STEM field ...
Packaging Module Equipment Development Engineer
Phoenix, AZ · On-site
$115K - $219K/yr
... Intel's roadmap of future assembly packaging platform technologies. * Optimizes and improves the ... The candidate must have Bachelor's degree in Engineering, Physics, Chemistry or related STEM field ...
Packaging Module Equipment Development Engineer
Phoenix, AZ · On-site
$115K - $219K/yr
... Intel's roadmap of future assembly packaging platform technologies. * Optimizes and improves the ... The candidate must have Bachelor's degree in Engineering, Physics, Chemistry or related STEM field ...
Intel is a company of bold and curious inventors and problem solvers who create some of the most ... packaging technology development and partner engineering groups on process/technology maturity for ...
Intel is a company of bold and curious inventors and problem solvers who create some of the most ... packaging technology development and partner engineering groups on process/technology maturity for ...
Packaging Module Equipment Development Engineer
Phoenix, AZ · On-site
$115K - $219K/yr
... Intel's roadmap of future assembly packaging platform technologies. * Optimizes and improves the ... The candidate must have Bachelor's degree in Engineering, Physics, Chemistry or related STEM field ...
Packaging Module Equipment Development Engineer
Phoenix, AZ · On-site
$115K - $219K/yr
... Intel's roadmap of future assembly packaging platform technologies. * Optimizes and improves the ... The candidate must have Bachelor's degree in Engineering, Physics, Chemistry or related STEM field ...
Packaging Research and Development Engineer
Chandler, AZ · On-site
$115 - $220/hr
... Packaging Research and Development Engineer to join the Module Engineering Backend Area ... Find out more about the benefits of working at Intel. Annual Salary Range for jobs which could be ...
New
Packaging Research and Development Engineer
Chandler, AZ · On-site
$115 - $220/hr
... Packaging Research and Development Engineer to join the Module Engineering Backend Area ... Find out more about the benefits of working at Intel. Annual Salary Range for jobs which could be ...
New
Thermal Quality and Reliability Engineer
Phoenix, AZ · On-site
$120.86 - $170.63/hr
Role and Impact As a Packaging Quality and Reliability Engineer, you will play a critical role in Intel's mission to deliver world-class semiconductor technologies. In this position, you will drive ...
Thermal Quality and Reliability Engineer
Phoenix, AZ · On-site
$120.86 - $170.63/hr
Role and Impact As a Packaging Quality and Reliability Engineer, you will play a critical role in Intel's mission to deliver world-class semiconductor technologies. In this position, you will drive ...
Thermal Quality and Reliability Engineer
Phoenix, AZ · On-site
$101K - $128K/yr
The Role and Impact As a Packaging Quality and Reliability Engineer, you will play a critical role in Intel's mission to deliver world-class semiconductor technologies. In this position, you will ...
Thermal Quality and Reliability Engineer
Phoenix, AZ · On-site
$101K - $128K/yr
The Role and Impact As a Packaging Quality and Reliability Engineer, you will play a critical role in Intel's mission to deliver world-class semiconductor technologies. In this position, you will ...
Intel is a company of bold and curious inventors and problem solvers who create some of the most ... packaging technology development and partner engineering groups on process/technology maturity for ...
Intel is a company of bold and curious inventors and problem solvers who create some of the most ... packaging technology development and partner engineering groups on process/technology maturity for ...
Packaging module development engineer
Chandler, AZ · On-site
$115.11 - $219.55/hr
... Intel's roadmap of future assembly packaging platform technologies. * Optimizes and improves the ... Master's degree in Mechanical Engineering, Materials Science, Electrical Engineering, Physics ...
Packaging module development engineer
Chandler, AZ · On-site
$115.11 - $219.55/hr
... Intel's roadmap of future assembly packaging platform technologies. * Optimizes and improves the ... Master's degree in Mechanical Engineering, Materials Science, Electrical Engineering, Physics ...
Silicon Packaging Design Engineer
Phoenix, AZ · On-site
$135K/yr
Intel seeks a motivated and innovative Silicon Packaging Design Engineer to join our team, driving the end-to-end development of silicon interposer and bridge designs that define the future of ...
Silicon Packaging Design Engineer
Phoenix, AZ · On-site
$135K/yr
Intel seeks a motivated and innovative Silicon Packaging Design Engineer to join our team, driving the end-to-end development of silicon interposer and bridge designs that define the future of ...
Electrical Engineering, Physics, Applied Physics, Optics, Material Science, Chemical Engineering ... Benefits at Intel Our total rewards package goes above and beyond just a paycheck. Whether you're ...
Electrical Engineering, Physics, Applied Physics, Optics, Material Science, Chemical Engineering ... Benefits at Intel Our total rewards package goes above and beyond just a paycheck. Whether you're ...
Silicon Packaging Design Engineer
Phoenix, AZ · On-site
$135K/yr
Intel seeks a motivated and innovative Silicon Packaging Design Engineer to join our team, driving the end-to-end development of silicon interposer and bridge designs that define the future of ...
Silicon Packaging Design Engineer
Phoenix, AZ · On-site
$135K/yr
Intel seeks a motivated and innovative Silicon Packaging Design Engineer to join our team, driving the end-to-end development of silicon interposer and bridge designs that define the future of ...
Intel Process Integration Engineer - (FE)
$103K - $139K/yr
Work closely with device engineers to tune process conditions. Optimize critical dimensions (CD ... Benefits at Intel Our total rewards package goes above and beyond just a paycheck. Whether you're ...
Intel Process Integration Engineer - (FE)
$103K - $139K/yr
Work closely with device engineers to tune process conditions. Optimize critical dimensions (CD ... Benefits at Intel Our total rewards package goes above and beyond just a paycheck. Whether you're ...
... Engineer to drive process control, manufacturing data analytics, and yield improvement for Thermal ... Intel's roadmap for advanced packaging and Thermal Compression Bonding technologies. They apply ...
... Engineer to drive process control, manufacturing data analytics, and yield improvement for Thermal ... Intel's roadmap for advanced packaging and Thermal Compression Bonding technologies. They apply ...
As a Facilities Engineer, you will play a pivotal role in ensuring Intel's buildings and ... Position of TrustN/A Benefits We offer a total compensation package that ranks among the best in ...
As a Facilities Engineer, you will play a pivotal role in ensuring Intel's buildings and ... Position of TrustN/A Benefits We offer a total compensation package that ranks among the best in ...
Intel's Substrate Packaging Technology Development (SPTD) organization is seeking a talented and drivenPackaging Research and Development Engineerto join our Module Engineering Backend team ...
Intel's Substrate Packaging Technology Development (SPTD) organization is seeking a talented and drivenPackaging Research and Development Engineerto join our Module Engineering Backend team ...
Intel Jobs Information
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What are the most popular jobs at Intel in Arizona?

Full-time
Medical, Retirement, PTO
Re-posted 17 days ago
Intel rating
8.7
Based on 147 frontline employees who took The Breakroom Quiz
19th of 159 rated electronics manufacturers
Job description
Job Description:
The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Technology Development (ATD) team pioneers innovative package assembly solutions and scales them for high-volume manufacturing.
As a Packaging Module Development Engineer, you will:
• Contribute to the advancement of technology and foundry capabilities by developing First Level Interconnect (FLI) to support Intel's future packaging platforms.
• Collaborate with multifunctional, cross organizational teams to optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability.
• Drive innovation in next generation equipment, materials, and fabrication processes to scale advanced semiconductor packaging capabilities
• Lead equipment development activities, including pathfinding, new equipment definition, selection, technology development, and transition to high volume manufacturing.
• Manage projects to ensure alignment with product development schedules and execution milestones.
• Apply sound engineering principles, formal education, and professional judgment to resolve complex technical challenges.
• Provide sustaining engineering support to maintain equipment performance and process health in high volume manufacturing environments
• Respond effectively and with urgency to foundry customer requests, escalations, and manufacturing events
The ideal candidate should demonstrate:
• Technical leadership, strategic planning, and critical thinking.
• Ability to coach and develop technical teams.
• Tolerance for ambiguity and adaptability in a dynamic environment.
• Flexibility in managing changing priorities and responsibilities.
• Experience leading teams in a highly matrixed organization.
• Initiative and ability to work independently.
• Strong communication, influencing, technical, and analytical skills.
This position requires regular onsite presence.
Qualifications:
You must possess the minimum education requirements and minimum required qualifications to be initially considered for this position. Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or military experience. Additional preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications:
• Master's degree in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field with 3+ years of experience or PhD in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field.
• Experience listed above should be a combination of the following:
Programming/script (e.g., Python, MATLAB) development with artificial intelligence and machine learning concepts.
Preferred Qualifications:
One or more years of experience in one or more of the following areas:
• Technology development, including familiarity with Statistical Process Control (SPC) and/or Design of Experiments (DOE)
• Delivery of results for complex, time-critical technical projects.
• Semiconductor fabrication processes and technologies.
• Prior related work experience within a semiconductor foundry.
Job Type:
Experienced Hire
Shift:
Shift 1 (United States of America)
Primary Location:
US, Arizona, Phoenix
Additional Locations:
Business group:
Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $115,110.00-219,550.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
About Intel
Sourced by ZipRecruiter
Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth
Industry
Manufacturing
Company size
10,000+ Employees
Headquarters location
Santa Clara, CA, US
Year founded
1968