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## Principal Process Engineer, Die BondingBoise, Idaho, United States of America**Our vision is to transform how the world uses information to enrich life for *all*.**Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Micron is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products which drive the AI revolution. By collaborating closely with our global R&D, equipment and materials suppliers, and manufacturing teams, we ensure the efficient development, transfer and implementation of new technology nodes, maintaining Micron's leadership in the industry.As a Principal Process Engineer in Die Bonding, you will be primarily responsible for starting up, developing, and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement, and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology.**Responsibilities:*** Develop, diagnose, and resolve various die bonding process technologies* Coordinate and execute process, equipment, and material evaluation/optimization initiatives and implement changes at process step* Lead and participate in continuous yield improvement and cost reduction activities* Validate and fan out new process baseline qualified, including new process, tools and/or materials for new product introduction* Manage, audit, and be a liaison with material suppliers to achieve quality, cost, and risk management objectives* Support SPC/FDC/RMS/APC and site-to-site portability* Support internal and external audits**Minimum Qualifications:*** A BS degree with minimum 8+ years proven experience in Semiconductor Process Engineering* Solid engineering knowledge of semiconductor advanced packaging die stacking processes* Skilled at designing valid tests and Design of Experiments (DOE)* Excellent data collection, organization, and analysis skills, plus proficiency in data analysis techniques/programs* Excellent oral and written communication skills and a strong attention to detail* Highly self-motivated and have the ability to work independently, as a group leader, and as a collaborative contributor* Knowledge and an understanding of project management**Preferred Qualifications:*** Masters or Doctorate degree in Engineering, Physics, or related field* Experience in working on Die Bonding : Fusion Bonding, Hybrid Bonding, Direct Bonding, or on applications such as MEMS, Imager, Memory or Heterogeneous Integration* Bonding experience at a Vendor, Research Institute or Semiconductor Industry Equipment Supplier or IntegratorAs a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on .Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.To learn about yourTo learn more about Micron, please visitFor US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at hrsupport\_na@micron.com or 1-800-336-8918 (select option #3)Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.AI alert**:** Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.Strong communities and education are vital to the success of both society and innovative companies. Every Micron site understands the complex needs of their local community. Whether it’s through strategic giving, sponsorships or deploying team member volunteers, we are making a difference. Micron is committed to sustainable practices and supporting our global community. We are building and maintaining sustainable operations, products, and communities while focusing on opportunities and risks that are most important to our business success and stakeholders.Micron uses an artificial intelligence ("AI") recruiting software provided by Eightfold AI to assist with and support its recruiting efforts. Before submitting your application to (the "Platform"), please review Micron’s to understand how your personal data is processed, as well as this Notice Related to Micron’s Use of the Eightfold AI Recruiting Software ("Notice"). You may also review Eightfold AI’s responsible AI Principles here: .Micron’s use of the Eightfold AI recruiting software in connection with your application may be subject to various AI-related laws and regulations:1. **U.S. State and Local Laws:** Depending on where you reside, the Platform may constitute a high-risk AI system that makes, or is a substantial factor in making, a consequential decision and/or an "automated employment decision tool," as those terms are defined by applicable U.S. law.2. **EU Artificial Intelligence Act ("EU AI Act"):** The EU AI Act classifies AI systems used in recruitment and employment decisions as "high-risk" under Annex III. The EU AI Act applies not only to deployers established in the EU, but also where AI outputs (such as matching scores or candidate rankings) are used by personnel located in the EU, or where the recruitment process relates to a position located in the EU (see below).For applications submitted through the Platform, Micron recruiters will use the assistance of the Eightfold AI recruiting software to identify your skills based on the information in your resume and other application materials, and to help assess how closely your skills match the defined requirements for open roles.While submitting your application through the Platform is not required, we encourage you to do so (as explained below).If you click "Submit" below:1. Micron will provide job recommendations to you, which will be displayed on the Platform.2. #J-18808-Ljbffr